MICROCHIP AN4306 Mounting Instruction yeBaseless Power Module

Nhanganyaya

Ichi chinyorwa chekushandisa chinopa kurudziro yekuisa zvakakodzera iyo isina base simba module kune yekupisa singi uye PCB. Tevedza mirairo yekumisikidza kudzikamisa zvese zvinopisa uye zvema mechanical stress.

Interface Pakati peBaseless Power Module uye Heat Sink

Ichi chikamu chinotsanangura iyo interface pakati pebaseless power module uye heat sink.

Phase Change Material (PCM) Deposition

 

Kuti uwane iyo yakaderera kesi yekupisa kunyura kupisa kupisa, chikamu chekuchinja zvinhu kuiswa muzinga rehuchi chinogona kuiswa pane baseless simba module. Shandisa chidzitiro-yekudhinda tekiniki kuti uve nechokwadi chekuisa yunifomu yehupamhi hudiki hwe150 μm kusvika 200 μm (5.9 mils kusvika 7.8 mils) pane isina hwaro simba module, sezvakaratidzwa mumufananidzo unotevera. Microchip inokurudzira Loctite PSX-Pe. Rudzi urwu rwekupisa kwemukati runodzikisira pombi-kunze. kupomba-kunze kunokonzerwa kubva mukupisa bhasikoro kunoitika pakati penzvimbo mbiri dzekusangana.

Aluminium Foils ane PCM

Kuti uwane iyo yakaderera-kusvika-kupisa kunyura kupisa kupisa, iyo aluminium foil ine PCM pamativi ese (Kunze Crayotherm-KU-ALF5) inogona kuiswa pakati peiyo baseless simba module uye kupisa kunyura sezvinoratidzwa mumufananidzo unotevera.

Kuisa iyo Baseless Module kune Heat Sink

Kuiswa kwakakodzera kweiyo isina base simba module kune yekupisa singi kwakakosha kuvimbisa kunaka kwekutamisa kupisa. Iyo yekupisa inonyura uye isina baseless simba module yekubatanidza nzvimbo inofanirwa kuve yakatsetseka uye yakachena (isina tsvina, isina ngura, uye isina kukuvadzwa) kudzivirira mechanical kusagadzikana kana baseless power module inoiswa uye kudzivirira kuwedzera kwekupisa kwekupisa.

Cherechedza: Yakakurudzirwa flatness ndeye <50 μm ye 100 mm inoenderera uye yakakurudzirwa roughness ndeye Rz 10. Isa iyo isina baseless power module nePCM kana aluminium foil nePCM pamusoro pemakomba ekupisa uye shandisa kudzvinyirira kuduku kwairi.

• Kune iyo BL1 uye BL2 isina baseless simba module:
  • Isa iyo M4 sikuruu uye chitubu washer (DIN 137A) mugomba rinokwirisa. Iyo screw head uye washer dhayamita inofanira kunge iri pa8 mm yakajairika. Simbisa sikuru kusvika iyi yekupedzisira torque kukosha yasvika. (Ona chigadzirwa chedhetebheti kune yakakura torque inobvumidzwa).
• Kune iyo BL3 isina base simba module:
  • Isa maM3 screws uye maspring washers (DIN 137A) mumakomba arikukwira. Iyo screw head uye washer dhayamita inofanira kunge iri 6 mm yakajairika.

• Iwo mashanu M3 screws anofanirwa kukwizwa kusvika 1/3 ye torque yekupedzisira. Order: 1 - 2 - 4 - 3 - 5.
• Iwo mashanu M3 screws anofanirwa kukwizwa kusvika 2/3 ye torque yekupedzisira. Order: 1 - 5 - 3 - 4 - 2.
• Iwo mashanu M3 screws anofanirwa kukwizwa kune yekupedzisira torque. Order: 3 - 5 - 4 - 2 - 1.

Ona chigadzirwa chedhetebheti kune yakakura torque inobvumidzwa. Kuita oparesheni iyi kune ese asina hwaro simba modules, shandisa screwdriver ine controlled torque.

PCB Gungano paBaseless Power Module

Aya anotevera matanho ekuunganidza PCB pane isina base simba module.

1. Isa ma spacers pane sink yekupisa padyo neiyo baseless power module. Iwo ma spacers anofanira kunge ari 10±0.1 mm kureba.
   • Cherechedza: Iyo isina base module ndeye 9.3 mm kureba. Iwo ma spacers anofanirwa kunge ari padyo neasina base simba mamodule kudzivirira chero vibrations uchiremekedza insulation zvinodiwa, sezvinoratidzwa mumufananidzo unotevera. Iyo PCB inofanirwa kukwidziridzwa kune isina base simba module uye screwed kune spacers. Iyo torque inokwirisa ye0.6 Nm (5 lbf·in) inokurudzirwa.
2. Solder mapini emagetsi emodule yemagetsi kuPCB. Hapana yakachena solder flux inodiwa kuti ubatanidze iyo PCB pane module sezvo aqueous module yekuchenesa isingatenderwe.

Cherechedza: Usadzorere nhanho mbiri idzi, nekuti kana mapini ese atengeswa kutanga kuPCB, kupuruzira PCB pane spacers kunogadzira deformation yePCB, zvichitungamira kune mechanical stress inogona kukuvadza matinji kana kutyora zvinhu paPCB.

Nekugadzira kwakanaka, wave solder process inogona kushandiswa kutengesa materminal kuPCB. Chikumbiro chega chega, singi yekupisa uye PCB inogona kunge yakasiyana; wave soldering inofanirwa kuongororwa pane imwe nyaya-ne-kesi hwaro. Chero zvazvingaitika, dhizaini yakanyatsogadziriswa ye solder inofanira kukomberedza pini imwe neimwe.

Makomba ari muPCB (ona Mufananidzo 4-1) anodiwa kuti ubvise masiruuru anosungirira pasi isina base simba module kune inopisa singi. Aya maburi ekupinda anofanira kunge akakura kuti screw head uye washer zvipfuure zvakasununguka, zvichibvumira kushivirira kwakajairwa muPCB gomba nzvimbo.

Mukaha pakati pepasi pePCB uye isina baseless power module yakadzikira. Microchip haikurudzire kushandisa kuburikidza negomba zvikamu pamusoro peiyo module. Kuderedza kuchinjika pamusoro pevoltages, SMD decoupling capacitors emagetsi emagetsi VBUS uye 0/VBUS inogona kushandiswa. (Ona Mufananidzo 4-1). Ita shuwa chengetedzo paunenge uchibata zvinorema senge electrolytic kana polypropylene capacitors, transformers, kana inductors akaiswa akatenderedza magetsi module. Kana zvinhu izvi zviri munzvimbo imwe chete, wedzera ma spacers zvekuti huremu hwezvinhu izvi pabhodhi hahubatiswe neiyo baseless power module asi nema spacers. Pini kunze inogona kuchinja zvichienderana nekugadzirisa. Ona chigadzirwa chedhetebheti chepini kunze kwenzvimbo. Imwe neimwe application, PCM, PCB, uye spacers kuiswa kwakasiyana uye inofanirwa kuongororwa pane imwe nyaya-ne-kesi.

BL1, BL2, uye BL3 Gungano paPCB imwechete

1. Tsanangudzo yeGungano inogadzirwa nematatu emagetsi mamodules: maviri BL1 baseless simba modules yebhiriji rekugadziridza, imwe BL2, uye imwe BL3 isina base simba module yekumisikidzwa kwebhiriji-chikamu.

• Gungano rehunyambiri AC chinja pane BL3 simba module kuita kuonana matrix yekugadzira simba rendege (kusvika ku50 kW).

Mhedziso

Ichi chinyorwa chekushandisa chinopa kurudziro maererano nekumisikidzwa kweiyo baseless module. Kushandisa iyi mirairo kuchabatsira kudzikisira kushushikana kwemechani paPCB uye isina base simba module kuti ive nechokwadi chekushanda kwenguva refu kwehurongwa. Mirayiridzo yekumisikidza kune sink yekupisa inofanirawo kuteverwa kuti uwane yakaderera kupisa kwekudzivirira kubva kumachipisi emagetsi kudzika kune inotonhorera. Ese mashandiro aya akakosha kuvimbisa yakanakisa system kuvimbika.

Revision History

Kudzokorora	Date	Tsanangudzo
A	11/2021	Shanduko dzinotevera dzinoitwa mudzokororo iyi: Yakagadziridza gwaro maererano neMicrochip zviyero. Nhamba yegwaro yakagadziridzwa kuita DS00004306. Nhamba yetsamba yekunyorera yakagadziridzwa kuita AN4306.

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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Chero Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Matching, Dynamic DAM. , ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, REAL Matrix, Q. , Ripple Blocker, RTAX, RTG4, SAMICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-IS, storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, uye ZENA zviratidzo zveMicrochip Technology Incorporated muUSA nedzimwe nyika.

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© 2021, Microchip Technology Incorporated nemakambani ayo. All Rights Reserved.
ISBN: 978-1-5224-9309-9

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© 2021 Microchip Technology Inc. nemasangano ayo.
DS00004306A

Zvinyorwa / Zvishandiso

MICROCHIP AN4306 Mounting Instruction yeBaseless Power Module [pdf] Bhuku reMushandisi AN4306 Kukwirisa Kuraira kweBaseless Simba Module, AN4306, Kukwirisa Kuraira kweBaseless Simba ModuleBaseless Simba Module.

References

• User Manual