STMicroelectronics Materials Declaration Form
Form Type: IPC 1752
Version: 2
Date: 2014-09-15
Supplier Information
Company Name: STMicroelectronics
Contact Name: Antonella Lanzafame
Contact Title: AMS & IPD Materials Declaration Champion
Contact Email: Refer to " Supplier Comment" section
Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/internet/com/support/online_tech_support.jsp
Product Information
Mfr Item Number: HD6R*UY29ABA
Mfr Item Name: A
Version: BO2A
Mfr Site: ST ECOPACK Grade
Amount: 54.00 mg
Unit Type: Each
ECOPACK Grade: ECOPACK® 2
Manufacturing Information
J-STD-020 MSL Rating: 1
Classification Temp: 260
Nbr of Reflow Cycles: 3
Bulk Solder Termination: Terminal Plating: Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Base Alloy: Copper Alloy
Comment: Not Applicable ; if coating is used o Nickel/Palladium/Gold (Ni/Pd/Au)
Package Designator: SOJ
Size: 5-4.4-0.9
Nbr of Instances: 14
Shape: J bend
Comment: TSSOP 14 BODY 4.4 PITCH 0.65; MD valid for CP:TSX634AIPT, TSX634IPT.
Compliance Information
RoHS Directive 2011/65/EU - July 2011
- Product(s) meets EU RoHS requirement without any exemptions: true
- Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
- Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
- Product(s) does not meet EU RoHS requirements and is not under exemptions: false
- Product(s) is obsolete, no information is available: false
- Product(s) is unknown, no information is available: false
REACH - 16th June 2014
The product does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH: true
| CategoryLevel_Name | CategoryLevel_Threshold | amount in product (mg) | Application | ppm in product |
|---|---|---|---|---|
Material Composition Declaration
| Homogeneous Material | Material Group | Mass | UoM | Level | Substance Category | Substance | CAS | Exempt | Mass | UoM | Concentration in homogeneous material (ppm) | Concentration in product (ppm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| die (s) | Other inorganic materials | 2.146 | mg | supplier | die | Silicon (Si) | 7440-21-3 | 2.113 | mg | 984623 | 39130 | |
| die (s) | supplier | metallization | Aluminium (Al) | 7429-90-5 | 0.01 | mg | 4660 | 185 | ||||
| die (s) | supplier | metallization | Copper (Cu) | 7440-50-8 | 0.001 | mg | 466 | 19 | ||||
| die (s) | supplier | metallization | Titanium (Ti) | 7440-32-6 | 0.004 | mg | 1864 | 74 | ||||
| die (s) | supplier | passivation | Gamma-butyrolactone | 96-48-0 | 0.012 | mg | 5592 | 222 | ||||
| die (s) | supplier | passivation | Polyhydroxyamide | 55295-98-2 | 0.006 | mg | 2796 | 111 | ||||
| Leadframe | Copper & its alloys | 23.817 | mg | supplier | alloy | Copper (Cu) | 7440-50-8 | 22.897 | mg | 961372 | 424019 | |
| Leadframe | supplier | alloy | Nickel (Ni) | 7440-02-0 | 0.714 | mg | 29979 | 13222 | ||||
| Leadframe | supplier | alloy | Silicon (Si) | 7440-21-3 | 0.155 | mg | 1512 | 667 | ||||
| Leadframe | supplier | alloy | Magnesium (Mg) | 7439-95-4 | 0.014 | mg | 6508 | 2870 | ||||
| Leadframe | supplier | metallization | Nickel (Ni) | 7440-02-0 | 0.036 | mg | 588 | 259 | ||||
| Leadframe | supplier | metallization | Palladium (Pd) | 7440-05-3 | 0.001 | mg | 42 | 19 | ||||
| Die attach | Other Organic Materials | 0.628 | mg | supplier | glue or tape | Silver (Ag) | 7440-22-4 | 0.477 | mg | 759554 | 8833 | |
| Die attach | Other Organic Materials | 0.207 | mg | supplier | glue or tape | 2,6-Diglycidylphenyl allyl ether | 13561-08-5 | 0.063 | mg | 100318 | 1167 | |
| Die attach | supplier | glue or tape | 1,4-bis (2,3-epoxypropoxy) butane | 2425-79-8 | 0.025 | mg | 39809 | 463 | ||||
| Die attach | supplier | glue or tape | 2,6-Diglycidyl phenyl allyl ether | CE 417-470-1 | 0.038 | mg | 60510 | 704 | ||||
| Die attach | supplier | glue or tape | Polyoxypropylenediamine | 9046-10-0 | 0.025 | mg | 39809 | 463 | ||||
| Bonding wire | Other inorganic materials | supplier | wire | Gold (Au) | 7440-57-5 | 0.207 | mg | 1000000 | 3833 | |||
| encapsulation | mold compound | Silica, vitreous | 60676-86-0 | 24.127 | mg | 886957 | 446796 | |||||
| encapsulation | mold compound | epoxy resin | Proprietary | 2.177 | mg | 80031 | 40315 | |||||
| encapsulation | mold compound | Phenol resin | Proprietary | 0.816 | mg | 29998 | 15111 | |||||
| encapsulation | mold compound | carbon black | 1333-86-4 | 0.082 | mg | 3014 | 1519 |
Legal Statement
Supplier Acceptance: true
Legal Declaration: Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Standard:
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
