STMicroelectronics Material Declaration Form

Document Identifier: IPC-1752

Active Date: 7/15/2025

General Information

Form Type: Distribute

Sectionals: 1752

Version: 2

Subsectionals: A-D

*: Required Field

Supplier Information

Company Name: STMicroelectronics

Contact Name: Refer to Supplier Comment section

Contact Phone: Refer to Supplier Comment section

Authorized Representative: MDG CHAMPION

Representative Phone: Refer to Supplier Comment section

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Response Date: 2025-07-15

Contact Email: Refer to Supplier Comment section

Representative Title: MDG Material Declaration Champion

Representative Email: Refer to Supplier Comment section

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier Acceptance: true

Legal Declaration: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Information

Mfr Item Number: STM32MP255DAK3

Mfr Item Name: E579*505XXXY

Amount: 364

Version: A

Unit of Measure: mg

Manufacturing Site: 9991

Unit Type: Each

Date: 2025-07-15

ST ECOPACK Grade: ECOPACK® 2

Manufacturing Information

J-STD-020 MSL Rating: 3

Bulk Solder Termination: Not Applicable

Classification Temperature: 260

Terminal Plating: Not Applicable

Number of Reflow Cycles: 3

Terminal Base Alloy: NAC

Package Designator: BGA

Package Size: 14x14

Number of Instances: 424

Package: B0MP FC VFBGA 14X14 424B P0.5 DM01034187

Shape: Bulk solder

Comment: SACN305

Compliance Queries

RoHS Directive 2011/65/EU

1 - Product(s) meets EU RoHS requirement without any exemptions
2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)
4 - Product(s) does not meet EU RoHS requirements and is not under exemptions

Response: true, false, false, false

REACH Compliance

REACH - 21st January 2025

1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Response: true

Material Composition Declaration

Note: Substance present with less than 0.001mg will not be declared in this document.

Homogeneous Material	Material Group	Substance	CAS	Mass (mg)	Unit of Measure	Concentration in Homogeneous Material (ppm)	Concentration in Product (ppm)
Die or dies	M-011 Other inorganic materials	Silicon (Si)	7440-21-3	9.329	mg	932860	25620.82
	supplier	metallisation	Aluminium (Al)	7429-90-5	0.005	mg	500	13.73
	supplier	metallisation	Arsenic (As)	7440-38-2	0.000	mg	4	0.11
	supplier	metallisation	Copper (Cu)	7440-50-8	0.498	mg	49763	1366.73
	supplier	metallisation	Cobalt (Co)	7440-48-4	0.000	mg	29	0.80
	supplier	metallisation	Silver (Ag)	7440-22-4	0.002	mg	196	5.38
	supplier	metallisation	Tantalum (Ta)	7440-25-7	0.005	mg	500	13.73
	supplier	metallisation	Tin (Sn)	7440-31-5	0.107	mg	10667	292.97
	supplier	metallisation	Titanium (Ti)	7440-32-6	0.001	mg	108	2.97
	supplier	metallisation	Tungsten (W)	7440-33-7	0.006	mg	550	15.11
	supplier	Passivation	Silicon Nitride (SiN)	12033-89-5	0.014	mg	1399	38.42
	supplier	passivation	Silicon Oxide	7631-86-9	0.034	mg	3424	94.04
Substrate (A32383)	supplier	Copper & Resin		105.305	mg
Solder Mask	supplier	Plastics PAK	Proprietary	3.141	mg	29826	8626.26
	supplier	Solder Mask	Barium sulphate	7727-43-7	1.254	mg	11905	3443.16
	supplier	Solder Mask	Plastic EP	Proprietary	0.806	mg	7653	2213.40
	supplier	Solder Mask	Silicon dioxide	7631-86-9	0.640	mg	6074	1756.72
	supplier	Solder Mask	Additives, not to declare	Proprietary	0.288	mg	2733	790.44
	supplier	Solder Mask	Talc	14807-96-6	0.192	mg	1822	526.96
	supplier	Solder Mask	Pigment portion, not to declare	Proprietary	0.038	mg	364	105.28
	supplier	Solder Mask	Inorganic Ingredient, not to declare	Proprietary	0.038	mg	364	105.28
PP	supplier	Thermosetting resin (including filler)	Proprietary	20.110	mg	190964	55230.50
	supplier	PP	Glass Cloth	65997-17-3	13.406	mg	127310	36820.52
	supplier	PP	Copper	7440-50-8	7.307	mg	69388	20068.36
	supplier	PP	Copper	7440-50-8	58.086	mg	551597	159532.56
Underfill (UA26)	supplier	Encapsulation Glue		1.900	mg
	supplier	Underfill	p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline	5026-74-4	0.190	mg	100000	521.83
	supplier	Underfill	Bisphenol F type liquid epoxy resin	9003-36-5	0.190	mg	100000	521.83
	supplier	Underfill	Bisphenol A type liquid epoxy resin	25068-38-6	0.057	mg	30000	156.55
	supplier	Underfill	Amine type hardener	Proprietary	0.143	mg	75000	391.37
	supplier	Underfill	Carbon black	1333-86-4	0.010	mg	5000	26.09
	supplier	Underfill	Silicon dioxide	60676-86-0	1.235	mg	650000	3391.90
	supplier	Underfill	Additives	Proprietary	0.076	mg	40000	208.73
Encapsulation (EME-G760-SW)	supplier	Molding Compound		202.563	mg
	supplier	Molding compound	2,2'-((3,3',5,5'-Tetramethyl-(1,1'-biphenyl)-4,4'-diyl)bis(oxymethylene))-bis-oxirane	85954-11-6	16.205	mg	80000	44506.74
	supplier	Molding compound	Phenol Resin A	9003-35-4	8.103	mg	40000	22253.37
	supplier	Molding compound	Phenol Resin B	Proprietary	8.103	mg	40000	22253.37
	supplier	Molding compound	Silica (Amorphous) A	60676-86-0	121.538	mg	600000	333800.52
	supplier	Molding compound	Silica (Amorphous) B	7631-86-9	40.513	mg	200000	111266.84
	supplier	Molding compound	Metal Hydroxide	Proprietary	6.077	mg	30000	16690.03
	supplier	Molding compound	Carbon Black	1333-86-4	2.026	mg	10000	5563.34
Solder balls (SACN305)	supplier	Other inorganic materials		44.334	mg
	supplier	Solder Ball	Tin	7440-31-5	42.694	mg	963000	117258.03
	supplier	Solder Ball	Silver	7440-22-4	1.463	mg	33000	4018.19
	supplier	Solder Ball	Copper	7440-50-8	0.155	mg	3500	426.17
	supplier	Solder Ball	Nickel	7440-02-0	0.022	mg	500	60.88

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