Material Declaration Form

Document Status: ACTIVE: 8/7/2025

General Information

IPC1752
Form type*Distribute
Sectionals*Material information
Manufacturing information
Version2
Subsectionals*A-D

Supplier Information

Company name*STMicroelectronics
Contact name*Refer to Supplier Comment section
Contact phone*Refer to Supplier Comment section
Authorized representative*MDRF CHAMPION
Representative phone*Refer to Supplier Comment section
Supplier commentOnline Technical Support - STMicroelectronics : http://www.st.com/web/en/support/support.html
Response Date*2025-08-07
Contact email*Refer to Supplier Comment section
Representative titleMDRFMaterial Declaration champion
Representative email*Refer to Supplier Comment section

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier acceptance*true
Legal declaration*Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

© 2022 STMicroelectronics

Product Details

Mfr item numberSTM32F205RET6
Mfr item name645W*411XXX5
Amount359
Unit of measuremg
Manufacturing site998Z
Unit typeEach
VersionA
Date2025-08-07
ST ECOPACK gradeECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating3
Bulk solder terminationNot Applicable
Package designatorQFP
Package size10x10
Package: 5W LQFP 64 10x10x1.4 10051434
Classification temperature260
Terminal platingTin (Sn), matte
Number of reflow cycles3
Terminal base alloyCopper Alloy
Number of instances64
ShapeGull wing
Comment

RoHS Compliance

QueryList: RoHS Directive 2011/65/EU - 8 June 2011, Annex II amended by Delegated Directive 2015/863 - 31 March 2015

Exemption Id.DescriptionResponse
true
false
false
false

REACH Compliance

QueryList: REACH - 25th June 2025

1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

CategoryLevel_NameCategoryLevel_Thresholdamount in product (mg)Applicationppm in productResponse
#N/A0true

Material Composition Declaration

Note: Substance present with less than 0.001mg will not be declared in this document.

Homogeneous materialMaterial groupSubstance categorySubstanceCASMass (mg)Unit of measureConcentration in homogeneous material (ppm)Concentration in product (ppm)
Die or diesM-011 Other inorganic materialsdieSilicon (Si)7440-21-313.630mg93191637960
metallizationAluminium (Al)7429-90-50.070mg4792195
metallizationCopper (Cu)7440-50-80.453mg309471261
metallizationCobalt (Co)7440-48-40.001mg1004
metallizationTantalum (Ta)7440-25-70.063mg4293175
metallizationTungsten (W)7440-33-70.203mg13876565
PassivationSilicon Nitride12033-89-50.053mg3594146
PassivationSilicon Oxide7631-86-90.153mg10482427
Glue epoxy (EN4900GC)Other Organic MaterialsOrganic CompoundsAcrylic resinProprietary0.053mg70000147
Organic CompoundsPolybutadiene derivativeProprietary0.015mg2000042
Organic CompoundsButadiene copolymerProprietary0.011mg7850001650
Organic CompoundsAcrylateProprietary0.041mg1500032
Organic CompoundsEpoxy resinProprietary0.023mg54000113
Organic CompoundsPeroxideProprietary0.006mg3000063
Organic CompoundsAdditiveProprietary0.014mg800017
MetalsSilver7440-22-40.592mg1800038
Encapsualtion (EME-G700LAL-A)Other Organic MaterialsOrganic CompoundsEpoxy ResinProprietary13.036mg5500036305
Organic CompoundsPhenol ResinProprietary4.977mg2100013862
GlassSilica(Amorphous)A60676-86-0189.612mg800000528069
GlassSilica(Amorphous)B7631-86-928.205mg11900078550
Organic CompoundsCarbon Black1333-86-41.185mg50003300
Bonding wire (Cu)Bonding WireMetalsCopper7440-50-80.901mg9655002509
MetalsPalladium7440-05-30.029mg3100081
MetalsGold7440-57-50.003mg35009
Plating anode (Sn)Other inorganic materialsMetalsTin7440-31-51.438mg10000004004
Leadframe (C7025 + Ag)Copper & its alloysMetalsCopper7440-50-8101.536mg973499282777
MetalsIron7439-89-62.377mg227906620
MetalsPhosphor7723-14-00.026mg25073
MetalsZinc7440-66-60.131mg1260366
MetalsSiliver7440-22-40.229mg2200639
SVHCMetalsLead7439-92-10.000mg10

© 2022 STMicroelectronics

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