General Information
IPC Standard | 1752 |
Form Type | Distribute |
Sectionals | 1752 |
Material Information | Distribute |
Manufacturing Information | Version 2, Subsectionals A-D |
Supplier Information
Company Name | STMicroelectronics |
Contact Name | Refer to Supplier Comment section |
Contact Phone | Refer to Supplier Comment section |
Authorized Representative | MDG CHAMPION |
Representative Phone | Refer to Supplier Comment section |
Response Date | 2025-07-08 |
Contact Email | Refer to Supplier Comment section |
Representative Title | MDGMaterial Declaration champion |
Representative Email | Refer to Supplier Comment section |
Supplier Comment
Refer to Supplier Comment section
Online Technical Support: http://www.st.com/web/en/support/support.html
Uncertainty Statement
STMicroelectronics provides this document and its contents on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose, and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss, or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
Supplier Acceptance | true |
Legal Declaration | Standard |
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Product Information
Mfr Item Number | STM32G431RBI3 |
Mfr Item Name | 542I*468XXXX |
Amount | 27 |
Version | A |
Unit of Measure | mg |
Manufacturing Site | 9996 |
Unit Type | Each |
Date | 2025-07-08 |
ST ECOPACK Grade | ECOPACK® 2 |
Manufacturing Details
J-STD-020 MSL Rating | 3 |
Bulk Solder Termination | Tin - 3.5Ag |
Classification Temperature | 260 |
Terminal Plating | Not Applicable |
Number of Reflow Cycles | 3 |
Terminal Base Alloy | NAC |
Package Designator | BGA |
Package Size | 5x5 |
Package Description | A019 UFBGA 5X5X0.6 64L P 0.5 MM 8526322 |
Number of Instances | 64 |
Shape | Bulk solder |
Comment | 0 |
Compliance Information
RoHS Compliance
This declaration pertains to RoHS Directive 2011/65/EU, as amended by Delegated Directive 2015/863.
- Product(s) meets EU RoHS requirement without any exemptions: true
- Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
- Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
- Product(s) does not meet EU RoHS requirements and is not under exemptions: false
REACH Compliance
This declaration pertains to REACH regulations as of 21st January 2025.
- Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH: true
Material Composition Declaration
Note: Substances present with less than 0.001mg will not be declared in this document.
Homogeneous Material | Material Group | Substance | CAS | Exempt | Mass (mg) | Unit of Measure | Concentration in Homogeneous Material (ppm) | Concentration in Product (ppm) |
---|---|---|---|---|---|---|---|---|
Die or dies | M-011 Other inorganic materials | Silicon (Si) | 7440-21-3 | 1.703 | mg | 960597 | 63032.51 | |
Die or dies | M-011 Other inorganic materials | Aluminium (Al) | 7429-90-5 | 0.003 | mg | 1876 | 123.10 | |
Die or dies | M-011 Other inorganic materials | Copper (Cu) | 7440-50-8 | 0.030 | mg | 16686 | 1094.90 | |
Die or dies | M-011 Other inorganic materials | Cobalt (Co) | 7440-48-4 | 0.000 | mg | 67 | 4.40 | |
Die or dies | M-011 Other inorganic materials | Tantalum (Ta) | 7440-25-7 | 0.010 | mg | 5428 | 356.17 | |
Die or dies | M-011 Other inorganic materials | Titanium (Ti) | 7440-32-6 | 0.000 | mg | 201 | 13.19 | |
Die or dies | M-011 Other inorganic materials | Tungsten (W) | 7440-33-7 | 0.000 | mg | 134 | 8.79 | |
Die or dies | Passivation | Silicon Nitride | 12033-89-5 | 0.007 | mg | 4222 | 277.04 | |
Die or dies | Passivation | Silicon Oxide | 7631-86-9 | 0.019 | mg | 10789 | 707.95 | |
Substrate (101427659) | CORE | Fibrous-Glass-Wool | 65997-17-3 | 1.174 | mg | 140762.1818 | 43447.69 | |
Substrate (101427659) | CORE | Formaldehyde Polymer with (Chloromethyl)Oxirane | 28906-96-9 | 0.299 | mg | 35828.50909 | 11058.84 | |
Substrate (101427659) | CORE | Triazine | 25722-66-1 | 0.299 | mg | 35828.50909 | 11058.84 | |
Substrate (101427659) | CORE | Silicon dioxide | 7631-86-9 | 0.730 | mg | 87580.8 | 27032.71 | |
Substrate (101427659) | COPPER FOIL | Copper (Cu) | 7440-50-8 | 2.502 | mg | 300000 | 92598.08 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Cured Resin | Proprietary | 1.385 | mg | 166118.1055 | 51274.06 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Phthalocyanine Blue | 147-14-8 | 0.004 | mg | 440.0479616 | 135.83 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Organic Pigment | Proprietary | 0.004 | mg | 440.0479616 | 135.83 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Silica | Proprietary | 0.009 | mg | 1100.119904 | 339.56 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Barium sulfate | 7727-43-7 | 0.382 | mg | 45764.98801 | 14125.83 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Talc | 14807-96-6 | 0.039 | mg | 4620.503597 | 1426.17 | |
Substrate (101427659) | SOLDERMASK (AUS320) | Antifoamer and Leveling Agent | Proprietary | 0.013 | mg | 1540.167866 | 475.39 | |
Substrate (101427659) | NI PLATING | Nickel (Ni) | 7440-02-0 | 0.136 | mg | 16306.95444 | 5033.31 | |
Substrate (101427659) | AU PLATING | Gold (Au) | 7440-57-5 | 1.365 | mg | 163669.0647 | 50518.13 | |
DAF (EM-760L2-P) | Other organic materials | 0.290 | mg | |||||
DAF (EM-760L2-P) | GLUE | Synthetic Rubber | Proprietary | 0.116 | mg | 400000 | 4293.12 | |
DAF (EM-760L2-P) | GLUE | Amorphous Silica | 7631-86-9 | 0.145 | mg | 500000 | 5366.40 | |
DAF (EM-760L2-P) | GLUE | Phenol Resin | Proprietary | 0.152 | mg | |||
Bonding Wire (Cu) | BONDING WIRE | Copper (Cu) | 7440-50-8 | 0.148 | mg | 100000 | 1073.28 | |
Bonding Wire (Cu) | BONDING WIRE | Palladium (Pd) | 7440-05-3 | 0.004 | mg | 970500 | 5459.51 | |
Bonding Wire (Cu) | BONDING WIRE | Gold (Au) | 7440-57-5 | 0.029 | mg | 28000 | 157.51 | |
Solderballs (Sn3.5Ag) | SOLDERBALL | Tin (Sn) | 7440-31-5 | 1.917 | mg | 965000 | 70964.29 | |
Solderballs (Sn3.5Ag) | SOLDERBALL | Silver (Ag) | 7440-22-4 | 0.070 | mg | 35000 | 2573.83 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Epoxy Resin A | Proprietary | 0.434 | mg | 30000 | 16074.76 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Epoxy Resin B | 1675-54-3 | 0.434 | mg | 30000 | 16074.76 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Phenol Resin | Proprietary | 0.666 | mg | 46000 | 24647.96 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Silica(Amorphous) A | 60676-86-0 | 10.482 | mg | 724000 | 387937.53 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Silica(Amorphous) B | 7631-86-9 | 2.172 | mg | 150000 | 80373.80 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Aluminum Hydroxide | 21645-51-2 | 0.217 | mg | 15000 | 8037.38 | |
Encapsulation (G770FE) | MOLDING COMPOUND | Carbon Black | 1333-86-4 | 0.072 | mg | 5000 | 2679.13 |