Material Declaration Form

STMicroelectronics STM32G431RBI3

General Information

IPC Standard1752
Form TypeDistribute
Sectionals1752
Material InformationDistribute
Manufacturing InformationVersion 2, Subsectionals A-D

Supplier Information

Company NameSTMicroelectronics
Contact NameRefer to Supplier Comment section
Contact PhoneRefer to Supplier Comment section
Authorized RepresentativeMDG CHAMPION
Representative PhoneRefer to Supplier Comment section
Response Date2025-07-08
Contact EmailRefer to Supplier Comment section
Representative TitleMDGMaterial Declaration champion
Representative EmailRefer to Supplier Comment section

Supplier Comment

Refer to Supplier Comment section

Online Technical Support: http://www.st.com/web/en/support/support.html

Uncertainty Statement

STMicroelectronics provides this document and its contents on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose, and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss, or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Product Information

Mfr Item NumberSTM32G431RBI3
Mfr Item Name542I*468XXXX
Amount27
VersionA
Unit of Measuremg
Manufacturing Site9996
Unit TypeEach
Date2025-07-08
ST ECOPACK GradeECOPACK® 2

Manufacturing Details

J-STD-020 MSL Rating3
Bulk Solder TerminationTin - 3.5Ag
Classification Temperature260
Terminal PlatingNot Applicable
Number of Reflow Cycles3
Terminal Base AlloyNAC
Package DesignatorBGA
Package Size5x5
Package DescriptionA019 UFBGA 5X5X0.6 64L P 0.5 MM 8526322
Number of Instances64
ShapeBulk solder
Comment0

Compliance Information

RoHS Compliance

This declaration pertains to RoHS Directive 2011/65/EU, as amended by Delegated Directive 2015/863.

  • Product(s) meets EU RoHS requirement without any exemptions: true
  • Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
  • Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
  • Product(s) does not meet EU RoHS requirements and is not under exemptions: false

REACH Compliance

This declaration pertains to REACH regulations as of 21st January 2025.

  • Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH: true

Material Composition Declaration

Note: Substances present with less than 0.001mg will not be declared in this document.

Homogeneous MaterialMaterial GroupSubstanceCASExemptMass (mg)Unit of MeasureConcentration in Homogeneous Material (ppm)Concentration in Product (ppm)
Die or diesM-011 Other inorganic materialsSilicon (Si)7440-21-31.703mg96059763032.51
Die or diesM-011 Other inorganic materialsAluminium (Al)7429-90-50.003mg1876123.10
Die or diesM-011 Other inorganic materialsCopper (Cu)7440-50-80.030mg166861094.90
Die or diesM-011 Other inorganic materialsCobalt (Co)7440-48-40.000mg674.40
Die or diesM-011 Other inorganic materialsTantalum (Ta)7440-25-70.010mg5428356.17
Die or diesM-011 Other inorganic materialsTitanium (Ti)7440-32-60.000mg20113.19
Die or diesM-011 Other inorganic materialsTungsten (W)7440-33-70.000mg1348.79
Die or diesPassivationSilicon Nitride12033-89-50.007mg4222277.04
Die or diesPassivationSilicon Oxide7631-86-90.019mg10789707.95
Substrate (101427659)COREFibrous-Glass-Wool65997-17-31.174mg140762.181843447.69
Substrate (101427659)COREFormaldehyde Polymer with (Chloromethyl)Oxirane28906-96-90.299mg35828.5090911058.84
Substrate (101427659)CORETriazine25722-66-10.299mg35828.5090911058.84
Substrate (101427659)CORESilicon dioxide7631-86-90.730mg87580.827032.71
Substrate (101427659)COPPER FOILCopper (Cu)7440-50-82.502mg30000092598.08
Substrate (101427659)SOLDERMASK (AUS320)Cured ResinProprietary1.385mg166118.105551274.06
Substrate (101427659)SOLDERMASK (AUS320)Phthalocyanine Blue147-14-80.004mg440.0479616135.83
Substrate (101427659)SOLDERMASK (AUS320)Organic PigmentProprietary0.004mg440.0479616135.83
Substrate (101427659)SOLDERMASK (AUS320)SilicaProprietary0.009mg1100.119904339.56
Substrate (101427659)SOLDERMASK (AUS320)Barium sulfate7727-43-70.382mg45764.9880114125.83
Substrate (101427659)SOLDERMASK (AUS320)Talc14807-96-60.039mg4620.5035971426.17
Substrate (101427659)SOLDERMASK (AUS320)Antifoamer and Leveling AgentProprietary0.013mg1540.167866475.39
Substrate (101427659)NI PLATINGNickel (Ni)7440-02-00.136mg16306.954445033.31
Substrate (101427659)AU PLATINGGold (Au)7440-57-51.365mg163669.064750518.13
DAF (EM-760L2-P)Other organic materials0.290mg
DAF (EM-760L2-P)GLUESynthetic RubberProprietary0.116mg4000004293.12
DAF (EM-760L2-P)GLUEAmorphous Silica7631-86-90.145mg5000005366.40
DAF (EM-760L2-P)GLUEPhenol ResinProprietary0.152mg
Bonding Wire (Cu)BONDING WIRECopper (Cu)7440-50-80.148mg1000001073.28
Bonding Wire (Cu)BONDING WIREPalladium (Pd)7440-05-30.004mg9705005459.51
Bonding Wire (Cu)BONDING WIREGold (Au)7440-57-50.029mg28000157.51
Solderballs (Sn3.5Ag)SOLDERBALLTin (Sn)7440-31-51.917mg96500070964.29
Solderballs (Sn3.5Ag)SOLDERBALLSilver (Ag)7440-22-40.070mg350002573.83
Encapsulation (G770FE)MOLDING COMPOUNDEpoxy Resin AProprietary0.434mg3000016074.76
Encapsulation (G770FE)MOLDING COMPOUNDEpoxy Resin B1675-54-30.434mg3000016074.76
Encapsulation (G770FE)MOLDING COMPOUNDPhenol ResinProprietary0.666mg4600024647.96
Encapsulation (G770FE)MOLDING COMPOUNDSilica(Amorphous) A60676-86-010.482mg724000387937.53
Encapsulation (G770FE)MOLDING COMPOUNDSilica(Amorphous) B7631-86-92.172mg15000080373.80
Encapsulation (G770FE)MOLDING COMPOUNDAluminum Hydroxide21645-51-20.217mg150008037.38
Encapsulation (G770FE)MOLDING COMPOUNDCarbon Black1333-86-40.072mg50002679.13

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