STMicroelectronics Material Declaration Form
Product: STM32MP253FAK3
Mfr Item Name: E879*505XXXY
Form Type: IPC-1752
Date: 2025-07-15
General Information
| IPC Version | 1752 |
|---|---|
| Form Type | Distribute |
| Sectionals | 2 |
| Subsectionals | A-D |
| *: Required Field |
Supplier Information
| Company Name | STMicroelectronics |
|---|---|
| Contact Name | Refer to Supplier Comment section |
| Contact Phone | Refer to Supplier Comment section |
| Authorized Representative | MDG CHAMPION |
| Representative Phone | Refer to Supplier Comment section |
| Contact Email | Refer to Supplier Comment section |
| Representative Title | MDGMaterial Declaration champion |
| Representative Email | Refer to Supplier Comment section |
Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
| Supplier Acceptance | true |
|---|---|
| Legal Declaration | Standard |
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Product and Manufacturing Details
| Mfr Item Number | STM32MP253FAK3 |
|---|---|
| Mfr Item Name | E879*505XXXY |
| Amount | 364 |
| Version | A |
| Unit of Measure | mg |
| Manufacturing Site | 9991 |
| Unit Type | Each |
| ST ECOPACK Grade | ECOPACK® 2 |
| J-STD-020 MSL Rating | 3 |
| Bulk Solder Termination | Not Applicable |
| Classification Temperature | 260 |
| Terminal Plating | Not Applicable |
| Number of Reflow Cycles | 3 |
| Terminal Base Alloy | NAC |
| Package Designator | BGA |
| Number of Instances | 424 |
| Package Size | 14x14 |
| Package Shape | Bulk solder |
| Package Description | BOMP FC VFBGA 14X14 424B P0.5 DM01034187 |
| Comment | SACN305 |
RoHS Compliance
Directive: RoHS Directive 2011/65/EU- 8 June 2011, amended by Delegated Directive 2015/863 - 31 March 2015
Compliance Status:
- 1 - Product(s) meets EU RoHS requirement without any exemptions
- 2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
- 3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)
- 4 - Product(s) does not meet EU RoHS requirements and is not under exemptions
Selected Status: true
REACH Compliance
Date: 21st January 2025
Query: 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH
Response: true
Material Composition Declaration
Note: Substances present with less than 0.001mg are not declared.
Total Product Mass: 364.1023 mg
| Homogeneous Material | Substance | CAS Number | Mass (mg) | Concentration in Product (ppm) |
|---|---|---|---|---|
| Die or Dies | Silicon (Si) | 7440-21-3 | 9.329 | 25620.82 |
| Metallisation | Aluminium (Al) | 7429-90-5 | 0.005 | 13.73 |
| Metallisation | Arsenic (As) | 7440-38-2 | 0.000 | 0.11 |
| Metallisation | Copper (Cu) | 7440-50-8 | 0.498 | 1366.73 |
| Metallisation | Cobalt (Co) | 7440-48-4 | 0.000 | 0.80 |
| Metallisation | Silver (Ag) | 7440-22-4 | 0.002 | 5.38 |
| Metallisation | Tantalum (Ta) | 7440-25-7 | 0.005 | 13.73 |
| Metallisation | Tin (Sn) | 7440-31-5 | 0.107 | 292.97 |
| Metallisation | Titanium (Ti) | 7440-32-6 | 0.001 | 2.97 |
| Metallisation | Tungsten (W) | 7440-33-7 | 0.006 | 15.11 |
| Passivation | Silicon Nitride (SiN) | 12033-89-5 | 0.014 | 38.42 |
| Passivation | Silicon Oxide | 7631-86-9 | 0.034 | 94.04 |
| Substrate (A32383) | Copper & Resin | N/A | 105.305 | N/A |
| Solder Mask | Plastics PAK | Proprietary | 3.141 | 8626.26 |
| Solder Mask | Barium sulphate | 7727-43-7 | 1.254 | 3443.16 |
| Solder Mask | Plastic EP | Proprietary | 0.806 | 2213.40 |
| Solder Mask | Silicon dioxide | 7631-86-9 | 0.640 | 1756.72 |
| Solder Mask | Additives, not to declare | Proprietary | 0.288 | 790.44 |
| Solder Mask | Talc | 14807-96-6 | 0.192 | 526.96 |
| Solder Mask | Pigment portion, not to declare | Proprietary | 0.038 | 105.28 |
| Solder Mask | Inorganic Ingredient, not to declare | Proprietary | 0.038 | 105.28 |
| Printed Circuit Board (PP) | Thermosetting resin (including filler) | Proprietary | 20.110 | 55230.50 |
| Printed Circuit Board (PP) | Glass Cloth | 65997-17-3 | 13.406 | 36820.52 |
| Printed Circuit Board (PP) | Copper (Cu foil) | 7440-50-8 | 7.307 | 20068.36 |
| Printed Circuit Board (PP) | Copper (Cu Plating) | 7440-50-8 | 58.086 | 159532.56 |
| Underfill (UA26) | Encapsulation Glue | N/A | 1.900 | N/A |
| Underfill (UA26) | p-(2,3-epoxypropoxy)-N, N-bis(2,3-epoxypropyl)amine | 5026-74-4 | 0.190 | 521.83 |
| Underfill (UA26) | Bisphenol F type liquid epoxy resin | 9003-36-5 | 0.190 | 521.83 |
| Underfill (UA26) | Bisphenol A type liquid epoxy resin | 25068-38-6 | 0.057 | 156.55 |
| Underfill (UA26) | Amine type hardener | Proprietary | 0.143 | 391.37 |
| Underfill (UA26) | Carbon black | 1333-86-4 | 0.010 | 26.09 |
| Underfill (UA26) | Silicon dioxide | 60676-86-0 | 1.235 | 3391.90 |
| Underfill (UA26) | Additives | Proprietary | 0.076 | 208.73 |
| Encapsulation (EME-G760-SW) | Molding Compound | N/A | 202.563 | N/A |
| Encapsulation (EME-G760-SW) | 2,2'-((3,3',5,5'-Tetramethyl-(1,1'-biphenyl)-4,4'-diyl)-bis(oxymethylene))-bis-oxirane | 85954-11-6 | 16.205 | 44506.74 |
| Encapsulation (EME-G760-SW) | Phenol Resin A | 9003-35-4 | 8.103 | 22253.37 |
| Encapsulation (EME-G760-SW) | Phenol Resin B | Proprietary | 8.103 | 22253.37 |
| Encapsulation (EME-G760-SW) | Silica(Amorphous) A | 60676-86-0 | 121.538 | 333800.52 |
| Encapsulation (EME-G760-SW) | Silica(Amorphous) B | 7631-86-9 | 40.513 | 111266.84 |
| Encapsulation (EME-G760-SW) | Metal Hydroxide | Proprietary | 6.077 | 16690.03 |
| Encapsulation (EME-G760-SW) | Carbon Black | 1333-86-4 | 2.026 | 5563.34 |
| Solder balls (SACN305) | Other inorganic materials | N/A | 44.334 | N/A |
| Solder balls (SACN305) | Tin | 7440-31-5 | 42.694 | 117258.03 |
| Solder balls (SACN305) | Silver | 7440-22-4 | 1.463 | 4018.19 |
| Solder balls (SACN305) | Copper | 7440-50-8 | 0.155 | 426.17 |
| Solder balls (SACN305) | Nickel | 7440-02-0 | 0.022 | 60.88 |
Note: This table provides a comprehensive list of materials and substances as per the original document.
