STMicroelectronics Material Declaration Form

IPC-1752 Standard

Date: 2025-07-15

General Information

Form Type: Distribute

IPC Version: 1752

Version: 2

Sectionals: A-D

Supplier Information

Company Name: STMicroelectronics

Contact Name: Refer to Supplier Comment section

Contact Phone: Refer to Supplier Comment section

Contact Email: Refer to Supplier Comment section

Authorized Representative: MDG CHAMPION

Representative Title: MDG Material Declaration champion

Representative Phone: Refer to Supplier Comment section

Representative Email: Refer to Supplier Comment section

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier Acceptance: true

Legal Declaration: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Details

Mfr Item Number: STM32MP255FAK3

Mfr Item Name: E479*505XXXY

Amount: 364

Version: A

Unit of Measure: mg

Manufacturing Site: 9991

Unit Type: Each

Date: 2025-07-15

ST ECOPACK Grade: ECOPACK® 2

Manufacturing Information

J-STD-020 MSL Rating: 3

Bulk Solder Termination: Not Applicable

Classification Temperature: 260

Terminal Plating: Not Applicable

Number of Reflow Cycles: 3

Terminal Base Alloy: NAC

Package Designator: BGA

Number of Instances: 424

Package Size: 14x14

Package Description: B0MP FC VFBGA 14X14 424B P0.5 DM01034187

Shape: Bulk solder

Comment: SACN305

Compliance Information

RoHS Directive (2011/65/EU, amended by 2015/863)

1 - Product(s) meets EU RoHS requirement without any exemptions
2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)
4 - Product(s) does not meet EU RoHS requirements and is not under exemptions

Response: true, false, false, false

REACH (21st January 2025)

Query: 1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Category Level Name: #N/A

Category Level Threshold: #N/A

Amount in Product (mg): #N/A

Application: #N/A

Response: true

Material Composition Declaration

Note: Substances present with less than 0.001mg will not be declared in this document.

Homogeneous Material	Material Group	Mass (mg)	Unit of Measure	Level	Substance Category	Substance	CAS	Exempt	Concentration in Homogeneous Material (ppm)	Concentration in Product (ppm)
Die or dies	M-011 Other inorganic materials	10.000	mg	supplier	die	Silicon(Si)	7440-21-3		932860	25620.82
Die or dies	metallisation	0.005	mg	supplier	metallisation	Aluminium(Al)	7429-90-5		500	13.73
Die or dies	metallisation	0.000	mg	supplier	metallisation	Arsenic(As)	7440-38-2		4	0.11
Die or dies	metallisation	0.498	mg	supplier	metallisation	Copper(Cu)	7440-50-8		49763	1366.73
Die or dies	metallisation	0.000	mg	supplier	metallisation	Cobalt(Co)	7440-48-4		29	0.80
Die or dies	metallisation	0.002	mg	supplier	metallisation	Silver(Ag)	7440-22-4		196	5.38
Die or dies	metallisation	0.005	mg	supplier	metallisation	Tantalum (Ta)	7440-25-7		500	13.73
Die or dies	metallisation	0.107	mg	supplier	metallisation	Tin(Sn)	7440-31-5		10667	292.97
Die or dies	metallisation	0.001	mg	supplier	metallisation	Titanium(Ti)	7440-32-6		108	2.97
Die or dies	metallisation	0.006	mg	supplier	metallisation	Tungsten(W)	7440-33-7		550	15.11
Die or dies	Passivation	0.014	mg	supplier	passivation	Silicon Nitride (SiN)	12033-89-5		1399	38.42
Die or dies	passivation	0.034	mg	supplier	passivation	Silicon Oxide	7631-86-9		3424	94.04
Substrate (A32383)	Copper & Resin	105.305	mg	supplier
Substrate (A32383)	Solder Mask	3.141	mg	supplier	Plastics PAK	Proprietary			29826	8626.26
Substrate (A32383)	Solder Mask	1.254	mg	supplier	Barium sulphate	7727-43-7			11905	3443.16
Substrate (A32383)	Solder Mask	0.806	mg	supplier	Plastic EP	Proprietary			7653	2213.40
Substrate (A32383)	Solder Mask	0.640	mg	supplier	Silicon dioxide	7631-86-9			6074	1756.72
Substrate (A32383)	Solder Mask	0.288	mg	supplier	Additives, not to declare	Proprietary			2733	790.44
Substrate (A32383)	Solder Mask	0.192	mg	supplier	Talc	14807-96-6			1822	526.96
Substrate (A32383)	Solder Mask	0.038	mg	supplier	Pigment portion, not to declare	Proprietary			364	105.28
Substrate (A32383)	Solder Mask	0.038	mg	supplier	Inorganic Ingredient, not to declare	Proprietary			364	105.28
PP	Thermosetting resin (including filler)	20.110	mg	supplier		Proprietary			190964	55230.50
PP	Glass Cloth	13.406	mg	supplier		65997-17-3			127310	36820.52
Cu foil	Copper	7.307	mg	supplier		Copper	7440-50-8		69388	20068.36
Cu Plating	Copper	58.086	mg	supplier		Copper	7440-50-8		551597	159532.56
Underfill (UA26)	Encapsulation Glue	1.900	mg	supplier
Underfill (UA26)	Underfill	0.190	mg	supplier	p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline	5026-74-4		100000	521.83
Underfill (UA26)	Underfill	0.190	mg	supplier	Bisphenol F type liquid epoxy resin	9003-36-5		100000	521.83
Underfill (UA26)	Underfill	0.057	mg	supplier	Bisphenol A type liquid epoxy resin	25068-38-6		30000	156.55
Underfill (UA26)	Underfill	0.143	mg	supplier	Amine type hardener	Proprietary			75000	391.37
Underfill (UA26)	Underfill	0.010	mg	supplier	Carbon black	1333-86-4		5000	26.09
Underfill (UA26)	Underfill	1.235	mg	supplier	Silicon dioxide	60676-86-0		650000	3391.90
Underfill (UA26)	Underfill	0.076	mg	supplier	Additives	Proprietary			40000	208.73
Encapsulation (EME-G760-SW)	Molding Compound	202.563	mg	supplier
Encapsulation (EME-G760-SW)	Molding compound	16.205	mg	supplier	2,2'-((3,3',5,5'-Tetramethyl-(1,1'-biphenyl)-4,4'-diyl)-bis(oxymethylene))-bis-oxirane	85954-11-6		80000	44506.74
Encapsulation (EME-G760-SW)	Molding compound	8.103	mg	supplier	Phenol Resin A	9003-35-4		40000	22253.37
Encapsulation (EME-G760-SW)	Molding compound	8.103	mg	supplier	Phenol Resin B	Proprietary			40000	22253.37
Encapsulation (EME-G760-SW)	Molding compound	121.538	mg	supplier	Silica(Amorphous) A	60676-86-0		600000	333800.52
Encapsulation (EME-G760-SW)	Molding compound	40.513	mg	supplier	Silica(Amorphous) B	7631-86-9		200000	111266.84
Encapsulation (EME-G760-SW)	Molding compound	6.077	mg	supplier	Metal Hydroxide	Proprietary		30000	16690.03
Encapsulation (EME-G760-SW)	Molding compound	2.026	mg	supplier	Carbon Black	1333-86-4		10000	5563.34
Solder balls (SACN305)	Other inorganic materials	44.334	mg	supplier
Solder balls (SACN305)	Solder Ball	42.694	mg	supplier	Tin	7440-31-5		963000	117258.03
Solder balls (SACN305)	Solder Ball	1.463	mg	supplier	Silver	7440-22-4		33000	4018.19
Solder balls (SACN305)	Solder Ball	0.155	mg	supplier	Copper	7440-50-8		3500	426.17
Solder balls (SACN305)	Solder Ball	0.022	mg	supplier	Nickel	7440-02-0		500	60.88

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