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onsemi PLCC52 Mechanical Case Outline

Document Number: 98AON31341E | Case 776AF | Issue B | Date: 15 AUG 2025

Package Overview

This document from onsemi provides comprehensive mechanical case outline and package dimensions for the PLCC52 (Plastic Leaded Chip Carrier) package. It serves as a technical reference for engineers and designers specifying this component.

Key Specifications

Dimensional Details and Diagrams

The document features detailed graphical representations of the PLCC52 package, including top, side, and bottom views. A critical table presents precise millimeter measurements for various features, such as overall body dimensions (D, E), lead dimensions (b, b2, e), and package height (A, A1, A2, A3). These dimensions adhere to ASME Y14.5M-2018 standards for dimensioning and tolerancing.

Additional information covers the generic marking diagram, explaining the placement and meaning of device codes, year, and lot codes. It also highlights important considerations like allowable mold protrusion and the location of the Pin 1 identifier.

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776AF Acrobat Distiller 25.0 (Windows)

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