MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

Product Information

Product: IBGA149 11.00x8.00x1.15, 0.65P

Case: 503CT

Issue: B

Date: 12 AUG 2025

Package Outline and Dimensions

A textual description of the package outline is provided, illustrating the 3D view, top view, section A-A, detail B, and bottom view. Key dimensions are detailed in a table below.

Dimensions Table (Millimeters)

DIM	MIN	NOM	MAX
A	~	~	1.620
A1	0.270	0.320	0.370
A2	1.150 [reference]
A3	0.600	0.650	0.700
A4	0.450	0.500	0.550
b	0.350	0.400	0.450
D	10.925	11.000	11.075
D1	9.785	9.860	9.935
D2	8.098 [reference]
D3	5.402	5.477	5.552
D4	0.570 [reference]
E	7.925	8.000	8.075
E1	5.925	6.000	6.075
E2	4.553 [reference]
E3	3.925	4.000	4.075
E4	1.000 [reference]
e	0.650 [basic common size]

Diagram Descriptions

3D Package View: A visual representation of the IBGA package, showing its overall rectangular form with a grid of solder balls on the underside.

Top View: Depicts the top surface of the package, highlighting the optical center, the active array area (3856H x 2168V), and the first active pixel. Key dimensions like D, E, D1, E1, D2, E2, D3, E3, D4, E4, b, and e are indicated.

Section A-A: A cross-sectional view illustrating the package profile and the seating plane, defined by the spherical crowns of the solder balls.

Detail B: An enlarged view showing the solder ball pitch (e) and diameter (Øb).

Bottom View: Shows the arrangement of 149 solder balls on the package's bottom surface, with the ball pitch (e) and diameter (Øb) specified.

Marking Diagram

The Generic Marking Diagram illustrates typical package markings. It includes a Pin1 indicator and fields for specific device code (XXXX), year (Y), and lot traceability (ZZZ). The diagram notes that Pb-Free indicators (e.g., "G" or microdot "G") may or may not be present, and some products might not follow this generic marking.

Recommended Mounting Footprint

This section provides a layout for mounting the package on a Printed Circuit Board (PCB). For detailed information on soldering and mounting techniques, refer to the onsemi Soldering and Mounting Techniques reference manual (SOLDERRM/D).

Notes

1. Dimensioning and tolerancing per ASME Y14.5M, 1994.
2. Controlling dimension: Millimeters [mm].
3. Solder ball diameter is measured at the maximum solder ball diameter parallel to Datum C.
4. Coplanarity applies to the spherical crowns of the solder balls.
5. Datum C, the seating plane is defined by the spherical crowns of the solder balls.
6. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
7. Air gap between glass and pixel array: 0.150 thickness.
8. Glass: 0.500 thickness; Refractive Index = 1.52; AR coating R<1% 420-850nm (each side).
9. Parallelism applies only to the active array.
10. Maximum rotation of active array relative to Datums A and B is ±0.7°.
11. Refer to the device data sheet for total pixel array definitions.
12. Package center (X, Y) = (0.000, 0.000).
13. Optical center relative to package center (X, Y) = (-0.023, 0.000).

* This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "G", may or may not be present. Some products may not follow the Generic Marking.

Document Information

Document Number: 98AON51618H

Description: IBGA149 11.00x8.00x1.15, 0.65P

Page: 1 of 1

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