Material Declaration Form

General Information

Form Type: 1752

Sectionals: Distribute

Material Information: (Not specified)

Manufacturing Information: (Not specified)

Version: 2

Subsectionals: A-D

*: Required Field

Supplier Information

Company Name: STMicroelectronics

Contact Name: Refer to Supplier Comment section

Contact Phone: Refer to Supplier Comment section

Authorized Representative: MDRF CHAMPION

Contact Email: Refer to Supplier Comment section

Representative Title: MDRFMaterial Declaration champion

Representative Phone: Refer to Supplier Comment section

Representative Email: Refer to Supplier Comment section

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier Acceptance: true

Legal Declaration: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Details

Mfr Item Number: STM32U585QII6Q

Mfr Item Name: 23PG*482XXXU

Amount: 80

Version: A

Unit of Measure: mg

Manufacturing Site: 9991

Unit Type: Each

Date: 2025-07-22

ST ECOPACK Grade: ECOPACK® 2

Manufacturing Information

J-STD-020 MSL Rating: 3

Classification Temperature: 260

Bulk Solder Termination: Tin - 3.5Ag

Terminal Plating: Not Applicable

Number of Reflow Cycles: 3

Terminal Base Alloy: NAC

Package Designator: BGA

Package Size: 7x7

Number of Instances: 132

Shape: Bulk solder

Package Description: A0G8 UFBGA 7X7X0.6 132L P 0.5 R 12X12 8298393

RoHS Directive Query

Query ItemDescriptionResponse
1Product(s) meets EU RoHS requirement without any exemptionstrue
2Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)false
3Product(s) meets EU RoHS requirements by application of the selected exemption(s)false
4Product(s) does not meet EU RoHS requirements and is not under exemptionsfalse

REACH Query

Query ItemDescriptionResponse
1Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACHtrue

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document.

Homogeneous MaterialMaterial GroupSubstance CategorySubstanceCASExemptMass (mg)Unit of MeasureConcentration in Homogeneous Material (ppm)Concentration in Product (ppm)
Die or diesM-011 Other inorganic materialsdieSilicon (Si)7440-21-314.135mg961172177288
metallizationAluminium (Al)7429-90-50.063mg4284790
metallizationCopper (Cu)7440-50-80.188mg127842358
passivationNickel (Ni)7440-02-00.001mg6813
metallizationTantalum (Ta)7440-25-70.032mg2176401
metallizationTitanium (Ti)7440-32-60.008mg544100
metallizationTungsten (W)7440-33-70.001mg6813
PassivationSilicon Nitride12033-89-50.045mg3060564
PassivationSilicon Oxide7631-86-90.233mg158442922
Substrate (A27839)Copper & its alloysSubstrate19.579mg
SubstrateContinuous Filament Fiber Glass65997-17-32.545mg13000031924
SubstrateBismaleimide105391-33-11.077mg5500013506
SubstrateTriazine25722-66-11.077mg5500013506
SubstrateEpoxy Resin9003-36-52.154mg11000027013
SubstrateInorganic filler24623-77-60.979mg5000012278
SubstrateCopper (Cu)7440-50-86.265mg32000078582
SubstrateGold (Au)7440-57-50.392mg200004911
SubstrateNickel(Ni)7440-02-01.371mg7000017190
SubstrateAcrylic ResinProprietary0.979mg5000012278
SubstrateBarium Sulfate7727-43-70.587mg300007367
SubstrateSilica7631-86-90.392mg200004911
SubstrateTalc containing no asbestiform fibers14807-96-60.392mg200004911
SubstrateDipropylene Glycol Monomethyl Ether34590-94-80.392mg200004911
Substrate3-Methoxy-3-Methyl Butyl-AcetateProprietary0.392mg200004911
SubstrateEpoxy Resin85954-11-60.587mg300007367
SubstrateCopper & its alloys19.579mg
DAF (ATB-125-12)Precious metalsGlue or tapeButadiene, acrylonitrile polymer, carboxy-terminate68610-41-32.778mg65000034844
Glue or tapeFormaldehyde, polymer with (chloromethyl)oxirane37382-79-91.069mg25000013402
Glue or tapeDapsone80-08-00.256mg600003216
Glue or tape[3-(2,3-Epoxypropoxy)propyl]trimethoxysilane2530-83-80.085mg200001072
Glue or tapeReaction product: bisphenol-A-(epichlorhydrin); epoxy resin (number average molecular weight <= 700)25068-38-60.085mg200001072
Bonding wire (Cu)Precious metalsBonding wireCopper (Cu)7440-50-80.517mg9655006479
Bonding wirePalladium (Pd)7440-05-30.017mg31000208
Bonding wireGold (Au)7440-57-50.002mg350023
Encapsulation (KE-G1250AAS)Other inorganic materialsMolding CompoundSilica(Fused)60676-86-033.683mg900000422462
Molding CompoundEpoxy resinProprietary1.984mg5300024878
Solder Balls (96.5Sn 3.5Ag)Other Nonferrous metals & alloysMolding CompoundPhenol resinProprietary1.609mg4300020184
Molding CompoundCarbon Black1333-86-40.150mg40001878
Matte SnTin (Sn)7440-31-53.098mg96500038852
Matte SnSilver (Ag)7440-22-40.112mg350001409

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