Material Declaration Form
General Information
Form Type: 1752
Sectionals: Distribute
Material Information: (Not specified)
Manufacturing Information: (Not specified)
Version: 2
Subsectionals: A-D
*: Required Field
Supplier Information
Company Name: STMicroelectronics
Contact Name: Refer to Supplier Comment section
Contact Phone: Refer to Supplier Comment section
Authorized Representative: MDRF CHAMPION
Contact Email: Refer to Supplier Comment section
Representative Title: MDRFMaterial Declaration champion
Representative Phone: Refer to Supplier Comment section
Representative Email: Refer to Supplier Comment section
Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
Supplier Acceptance: true
Legal Declaration: Standard
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Product Details
Mfr Item Number: STM32U585QII6Q
Mfr Item Name: 23PG*482XXXU
Amount: 80
Version: A
Unit of Measure: mg
Manufacturing Site: 9991
Unit Type: Each
Date: 2025-07-22
ST ECOPACK Grade: ECOPACK® 2
Manufacturing Information
J-STD-020 MSL Rating: 3
Classification Temperature: 260
Bulk Solder Termination: Tin - 3.5Ag
Terminal Plating: Not Applicable
Number of Reflow Cycles: 3
Terminal Base Alloy: NAC
Package Designator: BGA
Package Size: 7x7
Number of Instances: 132
Shape: Bulk solder
Package Description: A0G8 UFBGA 7X7X0.6 132L P 0.5 R 12X12 8298393
RoHS Directive Query
Query Item | Description | Response |
---|---|---|
1 | Product(s) meets EU RoHS requirement without any exemptions | true |
2 | Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) | false |
3 | Product(s) meets EU RoHS requirements by application of the selected exemption(s) | false |
4 | Product(s) does not meet EU RoHS requirements and is not under exemptions | false |
REACH Query
Query Item | Description | Response |
---|---|---|
1 | Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH | true |
Material Composition Declaration
Note: Substance present with less 0.001mg will not be declared in this document.
Homogeneous Material | Material Group | Substance Category | Substance | CAS | Exempt | Mass (mg) | Unit of Measure | Concentration in Homogeneous Material (ppm) | Concentration in Product (ppm) |
---|---|---|---|---|---|---|---|---|---|
Die or dies | M-011 Other inorganic materials | die | Silicon (Si) | 7440-21-3 | 14.135 | mg | 961172 | 177288 | |
metallization | Aluminium (Al) | 7429-90-5 | 0.063 | mg | 4284 | 790 | |||
metallization | Copper (Cu) | 7440-50-8 | 0.188 | mg | 12784 | 2358 | |||
passivation | Nickel (Ni) | 7440-02-0 | 0.001 | mg | 68 | 13 | |||
metallization | Tantalum (Ta) | 7440-25-7 | 0.032 | mg | 2176 | 401 | |||
metallization | Titanium (Ti) | 7440-32-6 | 0.008 | mg | 544 | 100 | |||
metallization | Tungsten (W) | 7440-33-7 | 0.001 | mg | 68 | 13 | |||
Passivation | Silicon Nitride | 12033-89-5 | 0.045 | mg | 3060 | 564 | |||
Passivation | Silicon Oxide | 7631-86-9 | 0.233 | mg | 15844 | 2922 | |||
Substrate (A27839) | Copper & its alloys | Substrate | 19.579 | mg | |||||
Substrate | Continuous Filament Fiber Glass | 65997-17-3 | 2.545 | mg | 130000 | 31924 | |||
Substrate | Bismaleimide | 105391-33-1 | 1.077 | mg | 55000 | 13506 | |||
Substrate | Triazine | 25722-66-1 | 1.077 | mg | 55000 | 13506 | |||
Substrate | Epoxy Resin | 9003-36-5 | 2.154 | mg | 110000 | 27013 | |||
Substrate | Inorganic filler | 24623-77-6 | 0.979 | mg | 50000 | 12278 | |||
Substrate | Copper (Cu) | 7440-50-8 | 6.265 | mg | 320000 | 78582 | |||
Substrate | Gold (Au) | 7440-57-5 | 0.392 | mg | 20000 | 4911 | |||
Substrate | Nickel(Ni) | 7440-02-0 | 1.371 | mg | 70000 | 17190 | |||
Substrate | Acrylic Resin | Proprietary | 0.979 | mg | 50000 | 12278 | |||
Substrate | Barium Sulfate | 7727-43-7 | 0.587 | mg | 30000 | 7367 | |||
Substrate | Silica | 7631-86-9 | 0.392 | mg | 20000 | 4911 | |||
Substrate | Talc containing no asbestiform fibers | 14807-96-6 | 0.392 | mg | 20000 | 4911 | |||
Substrate | Dipropylene Glycol Monomethyl Ether | 34590-94-8 | 0.392 | mg | 20000 | 4911 | |||
Substrate | 3-Methoxy-3-Methyl Butyl-Acetate | Proprietary | 0.392 | mg | 20000 | 4911 | |||
Substrate | Epoxy Resin | 85954-11-6 | 0.587 | mg | 30000 | 7367 | |||
Substrate | Copper & its alloys | 19.579 | mg | ||||||
DAF (ATB-125-12) | Precious metals | Glue or tape | Butadiene, acrylonitrile polymer, carboxy-terminate | 68610-41-3 | 2.778 | mg | 650000 | 34844 | |
Glue or tape | Formaldehyde, polymer with (chloromethyl)oxirane | 37382-79-9 | 1.069 | mg | 250000 | 13402 | |||
Glue or tape | Dapsone | 80-08-0 | 0.256 | mg | 60000 | 3216 | |||
Glue or tape | [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane | 2530-83-8 | 0.085 | mg | 20000 | 1072 | |||
Glue or tape | Reaction product: bisphenol-A-(epichlorhydrin); epoxy resin (number average molecular weight <= 700) | 25068-38-6 | 0.085 | mg | 20000 | 1072 | |||
Bonding wire (Cu) | Precious metals | Bonding wire | Copper (Cu) | 7440-50-8 | 0.517 | mg | 965500 | 6479 | |
Bonding wire | Palladium (Pd) | 7440-05-3 | 0.017 | mg | 31000 | 208 | |||
Bonding wire | Gold (Au) | 7440-57-5 | 0.002 | mg | 3500 | 23 | |||
Encapsulation (KE-G1250AAS) | Other inorganic materials | Molding Compound | Silica(Fused) | 60676-86-0 | 33.683 | mg | 900000 | 422462 | |
Molding Compound | Epoxy resin | Proprietary | 1.984 | mg | 53000 | 24878 | |||
Solder Balls (96.5Sn 3.5Ag) | Other Nonferrous metals & alloys | Molding Compound | Phenol resin | Proprietary | 1.609 | mg | 43000 | 20184 | |
Molding Compound | Carbon Black | 1333-86-4 | 0.150 | mg | 4000 | 1878 | |||
Matte Sn | Tin (Sn) | 7440-31-5 | 3.098 | mg | 965000 | 38852 | |||
Matte Sn | Silver (Ag) | 7440-22-4 | 0.112 | mg | 35000 | 1409 |