Material Declaration Form

Document ID: IPC 1752

Form Type: Distribute

Version: 2

Date: 2025-07-07

Supplier Information

Company Name: STMicroelectronics

Contact Name: Refer to Supplier Comment section

Contact Phone: Refer to Supplier Comment section

Contact Email: Refer to Supplier Comment section

Authorized Representative: MDG CHAMPION

Representative Title: MDGMaterial Declaration champion

Representative Phone: Refer to Supplier Comment section

Representative Email: Refer to Supplier Comment section

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier Acceptance: true

Legal Declaration: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Information

Mfr Item Number: STM32L071CBT3

Mfr Item Name: ME5B*447XXXZ

Amount: 187

Unit of Measure: mg

Manufacturing Site: 0959

Unit Type: Each

Date: 2025-07-07

ST ECOPACK Grade: ECOPACK® 2

Manufacturing Information

J-STD-020 MSL Rating: 2

Classification Temperature: 260

Number of Reflow Cycles: 3

Bulk Solder Termination: Not Applicable

Terminal Plating: Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Base Alloy: Copper Alloy

Package Designator: QFP

Package Size: 7x7

Number of Instances: 48

Package: 5B LQFP 48 7x7x1.4 10110596

Shape: Gull wing

Comment: 0

RoHS Compliance

Directive: RoHS Directive 2011/65/EU - 8 June 2011, Annex II amended by Delegated Directive 2015/863 - 31 March 2015

  • 1. Product(s) meets EU RoHS requirement without any exemptions: true
  • 2. Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
  • 3. Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
  • 4. Product(s) does not meet EU RoHS requirements and is not under exemptions: false

REACH Compliance

Query: REACH - 21st January 2025

  • 1. Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH: true

Category Level Name: #N/A

Category Level Threshold: #N/A

Amount in Product (mg): #N/A

Application: #N/A

Response: true

Material Composition Declaration

Note: Substances present with less than 0.001mg will not be declared in this document.

Homogeneous Material Material Group Mass (mg) Unit of Measure Level Substance Category Substance CAS Exempt Mass (mg) Unit of Measure Concentration in Homogeneous Material (ppm) Concentration in Product (ppm)
Die or dies M-011 Other inorganic materials 9.574 mg supplier die Silicon (Si) 7440-21-3 9.236 mg 964674 49465.18
supplier metallization Aluminium (Al) 7429-90-5 0.025 mg 2627 134.70
supplier metallization Copper (Cu) 7440-50-8 0.102 mg 10692 548.25
supplier metallization Tantalum (Ta) 7440-25-7 0.011 mg 1158 59.38
supplier metallization Titanium (Ti) 7440-32-6 0.014 mg 1506 77.22
supplier metallization Tungsten (W) 7440-33-7 0.001 mg 116 5.95
supplier Passivation Silicon Nitride 12033-89-5 0.027 mg 2780 142.55
supplier Passivation Silicon Oxide 7631-86-9 0.157 mg 16447 843.35
Leadframe (C7025) M-011 Other inorganic materials 75.592 mg supplier alloy Copper (Cu) 7440-50-8 72.936 mg 964855.2438 390618.80
supplier alloy Nickel (Ni) 7440-02-0 2.097 mg 27745.86018 11232.83
supplier alloy Silicium (Si) 7440-21-3 0.454 mg 6011.603039 2433.78
supplier alloy Magnesium (Mg) 7439-95-4 0.105 mg 1387.293009 561.64
Leadframe Coating (NiPdAu) M-011 Other inorganic materials 0.406 mg supplier coating Nickel (Ni) 7440-02-0 0.371 mg 914840 1987.15
supplier coating Palladium (Pd) 7440-05-3 0.012 mg 29660 64.43
supplier coating Gold (Au) 7440-57-5 0.011 mg 27750 60.28
supplier coating Silver (Ag) 7440-22-4 0.011 mg 27750 60.28
Glue epoxy (EN4900) M-011 Other inorganic materials 1.954 mg supplier glue or soft solder Silver (Ag) 7440-22-4 1.661 mg 850000 8895.81
supplier glue or soft solder Acrylate Proprietary 0.197 mg 101000 1057.03
supplier glue or soft solder Additive Proprietary 0.020 mg 4000 41.86
supplier glue or soft solder Butadiene Proprietary 0.008 mg 10000 104.66
supplier glue or soft solder Organic Filler Proprietary 0.018 mg 9000 94.19
supplier glue or soft solder Polybutadiene Proprietary 0.043 mg 22000 230.24
supplier glue or soft solder peroxide cyclohexylidenebis 3006-86-8 0.008 mg 4000 41.86
Bonding wire (Ag96.5) M-011 Other inorganic materials 0.538 mg supplier Bonding wire Silver (Ag) 7440-22-4 0.519 mg 965000 2780.49
supplier Bonding wire Gold (Au) 7440-57-5 0.002 mg 3800 10.95
supplier Bonding wire Palladium (Pd) 7440-05-3 0.016 mg 29200 84.14
supplier Bonding wire Platinum (Pt) 7440-06-4 0.001 mg 2000 5.76
Encapsulation (EME_G700LS) M-011 Other inorganic materials 98.654 mg supplier Moulding Compound Solid Epoxy Resin Proprietary 7.399 mg 75000 39626.79
supplier Moulding Compound Phenol Resin Proprietary 2.960 mg 30000 15850.72
supplier Moulding Compound Silica, vitreous 60676-86-0 80.354 mg 814500 430346.97
supplier Moulding Compound Carbon-black 1333-86-4 0.543 mg 5500 2905.96
supplier Moulding Compound Silicon oxide 7631-86-9 7.399 mg 75000 39626.79

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