Material Declaration Form

STMicroelectronics

Document Status: ACTIVE: 7/24/2025

Brand Slogan: STRIVE FOR EXCELLENCE

General Information

IPC	1752	Form type*	Distribute
Sectionals*		Material information
Manufacturing information		Version	2
Subsectionals*	A-D	*: Required Field

Supplier Information

Company name*	STMicroelectronics	Response Date*	2025-07-24
Contact name*	Refer to Supplier Comment section	Contact email*	Refer to Supplier Comment section
Contact phone*	Refer to Supplier Comment section	Authorized representative*	MDRF CHAMPION
Representative phone*	Refer to Supplier Comment section	Representative title	MDRFMaterial Declaration champion
Representative email*	Refer to Supplier Comment section

Supplier comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier acceptance*	true	Legal declaration*	Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Information

Mfr item number	STM8AF6248TAY	Mfr item name	JI5B*79BX141
Amount	176	Unit of measure	mg
Manufacturing site	0959	Unit type	Each
Date	2025-07-24	ST ECOPACK grade	ECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating	3	Bulk solder termination
Classification temperature	260	Terminal plating	Nickel/Palladium/Gold (Ni/Pd/Au)
Package designator	QFP	Terminal base alloy	Copper Alloy
Package size	7x7	Number of reflow cycles	3
Number of instances	48	Shape	Gull wing
Comment	Package: 5B LQFP 48 7x7x1.4 10110596

RoHS Compliance

QueryList: RoHS Directive 2011/65/EU - 8 June 2011 - Annex II amended by Delegated Directive 2015/863 - 31 March 2015

1 - Product(s) meets EU RoHS requirement without any exemptions
2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)
4 - Product(s) does not meet EU RoHS requirements and is not under exemptions

Exemption Id.	Description	Response
		true
		false
		false
		false

REACH Compliance

QueryList: REACH - 21st January 2025

1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

CategoryLevel_Name	CategoryLevel_Threshold	amount in product (mg)	Application	ppm in product	Response
#N/A	0				true

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document.

Mfr Item Name	Homogeneous material	Material group	Mass	Unit of measure	Level	Substance category	Substance	CAS	Mass	Unit of measure	Concentration in homogeneous material (ppm)	Concentration in product (ppm)
JI5B*79BX141	Die or dies	M-011 Other inorganic materials	4.521	mg	supplier	die	Silicon(Si)	7440-21-3	4.364	mg	965273	24745
	metallization	M-011 Other inorganic materials			supplier	metallization	Aluminium(Al)	7429-90-5	0.012	mg	2654	68
	metallization	M-011 Other inorganic materials			supplier	metallization	Copper(Cu)	7440-50-8	0.040	mg	8848	227
	metallization	M-011 Other inorganic materials			supplier	metallization	Titanium(Ti)	7440-32-6	0.003	mg	664	17
	Passivation	M-011 Other inorganic materials			supplier	Passivation	Silicon Oxide	7631-86-9	0.065	mg	14377	369
	Polymer coating	M-011 Other inorganic materials			supplier	Polymer coating	PIX1 Polyimide AP2210A / HD8820 - Gamma-buty 96-48-0		0.037	mg	8184	210
Leadframe (C7025)	alloy	M-011 Other inorganic materials	74.402	mg	supplier	alloy	Copper (Cu)	7440-50-8	71.787	mg	964855	407055
	alloy	M-011 Other inorganic materials			supplier	alloy	Nickel (Ni)	7440-02-0	2.064	mg	27746	11706
	alloy	M-011 Other inorganic materials			supplier	alloy	Silicium (Si)	7440-21-3	0.447	mg	6012	2536
	alloy	M-011 Other inorganic materials			supplier	alloy	Magnesium (Mg)	7439-95-4	0.103	mg	1387	585
Leadframe Coating (NiPdAu)	coating	M-011 Other inorganic materials	0.405	mg	supplier	coating	Nickel (Ni)	7440-02-0	0.371	mg	914840	2104
	coating	M-011 Other inorganic materials			supplier	coating	Palladium (Pd)	7440-05-3	0.012	mg	29660	68
	coating	M-011 Other inorganic materials			supplier	coating	Gold (Au)	7440-57-5	0.011	mg	27750	63
	coating	M-011 Other inorganic materials			supplier	coating	Silver (Ag)	7440-22-4	0.011	mg	27750	63
Glue epoxy (EN4900)	glue or soft solder	M-011 Other inorganic materials	1.954	mg	supplier	glue or soft solder	Silver (Ag)	7440-22-4	1.505	mg	770000	8532
	glue or soft solder	M-011 Other inorganic materials			supplier	glue or soft solder	Epoxy Cresol Novolak	29690-82-2	0.442	mg	226000	2504
	glue or soft solder	M-011 Other inorganic materials			supplier	glue or soft solder	1-isopropyl-2,2-dimethyltrimethylene diisobutyrate 6846-50-0	6846-50-0	0.008	mg	4000	44
Bonding wire (Au)	Bonding wire	M-011 Other inorganic materials	0.913	mg	supplier	Bonding wire	Gold (Au)	7440-57-5	0.913	mg	1000000	5178
Encapsulation (EME-G700LS)	Moulding Compound	M-011 Other inorganic materials	94.161	mg	supplier	Moulding Compound	Solid Epoxy Resin	Proprietary	6.786	mg	72069	38479
	Moulding Compound	M-011 Other inorganic materials			supplier	Moulding Compound	Phenol Resin	Proprietary	4.847	mg	51478	27485
	Moulding Compound	M-011 Other inorganic materials			supplier	Moulding Compound	Silica, vitreous	60676-86-0	82.043	mg	871305	465211
	Moulding Compound	M-011 Other inorganic materials			supplier	Moulding Compound	Carbon-black	1333-86-4	0.485	mg	5148	2749

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