onsemi FFH75H60S Hyperfast Diode

75 A, 600 V

The FFH75H60S is a hyperfast diode with soft recovery characteristics. It offers a half recovery time of ultrafast diodes and features silicon nitride passivated ionimplanted epitaxial planar construction. These devices are suitable for freewheeling/clamping diodes and diodes in various switching power supplies and power switching applications. Its low stored charge and hyperfast soft recovery minimize ringing and electrical noise, reducing power loss in switching transistors.

Features

Applications

Absolute Maximum Ratings

ParameterSymbolRatingsUnit
Peak Repetitive Reverse VoltageVRRM600V
Working Peak Reverse VoltageVR600V
DC Blocking VoltageVR600V
Average Rectified Forward Current (TC = 105°C)IF(AV)75A
Non-repetitive Peak Surge Current 60 Hz Single Half-Sine WaveIFSM750A
Operating Junction and Storage TemperatureTJ, TSTG-65 to 175°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Thermal Characteristics

ParameterSymbolMinMaxUnit
Maximum Thermal Resistance, Junction to CaseRθJC0.4°C/W

Package Marking and Ordering Information

DeviceDevice MarkingPackagePacking MethodReel SizeTape WidthQuantity
FFH75H60SFFH75H60STO-247-2LDTubeN/AN/A30

Electrical Characteristics

ParameterConditionsMinTypMaxUnit
VF (Note 1)IF = 75 A, TC = 25°C1.82.2V
IR (Note 1)IF = 75 A, TC = 125°C1.62.0V
VR = 600 V, TC = 25°C100µA
VR = 600 V, TC = 125°C1.0mA
trrIF = 75 A, dlF/dt = 200 A/µs, VR = 390 V, TC = 25°C4075ns
IF = 75 A, dlF/dt = 200 A/µs, VR = 390 V, TC = 125°C23ns
IF = 75 A, dlF/dt = 200 A/µs, VR = 390 V, TC = 125°C17ns
Qrr80nC
WAVLAvalanche Energy (L = 40 mH)20mJ

Notes:

  1. Product parametric performance is indicated in the Electrical Characteristics and/or other sections of the data sheet. Performance may not be indicated by the Electrical Characteristics if operated under different conditions.
  2. Pulse: Test Pulse Width = 300 µs, Duty Cycle = 2%.

Test Circuits and Waveforms

Figure 1. Diode Reverse Recovery Test Circuit & Waveform

trr Test Circuit: A circuit diagram shows an IGBT, a resistor (R), a current sense resistor, and the DUT (Device Under Test). The diagram illustrates control of gate voltage (VGE) amplitude and rate of change (dlF/dt) and forward current (IF).

trr Waveforms and Definitions: A graph shows current (I) and voltage (V) waveforms over time. Key parameters labeled include IF, IRM, ta, tb, and trr.

Figure 2. Unclamped Inductive Switching Test Circuit & Waveform

Avalanche Energy Test Circuit: A circuit diagram shows a voltage source (VDD), an inductor (L), a resistor (R), and the DUT. The diagram also includes a switch (Q1) and a current sense resistor.

Avalanche Current and Voltage Waveforms: A graph shows current (I) and voltage (V) waveforms over time during an unclamped inductive switching event. Key parameters labeled include IL, VAVL, t1, and t2.

Typical Performance Characteristics

Figure 3. Typical Forward Voltage Drop vs. Forward Current

A graph shows forward current (IF) in Amperes on the y-axis versus forward voltage (VF) in Volts on the x-axis. Curves are plotted for different case temperatures: 25°C, 75°C, and 125°C.

Figure 4. Typical Reverse Current vs. Reverse Voltage

A graph shows reverse current (IR) in µA on the y-axis versus reverse voltage (VR) in Volts on the x-axis. Curves are plotted for different case temperatures: 25°C, 75°C, and 125°C.

Figure 5. Typical Junction Capacitance

A graph shows junction capacitance (CJ) in pF on the y-axis versus reverse voltage (VR) in Volts on the x-axis. The typical capacitance at 0 V is noted as 681 pF. Curves are plotted for different case temperatures: 25°C, 75°C, and 125°C.

Figure 6. Typical Reverse Recovery Time vs. di/dt

A graph shows typical reverse recovery time (trr) in ns on the y-axis versus the rate of change of forward current (dlF/dt) in A/µs on the x-axis. Curves are plotted for IF = 75 A at different case temperatures: 25°C, 75°C, and 125°C.

Figure 7. Typical Reverse Recovery Current vs. di/dt

A graph shows typical reverse recovery current (Irr) in A on the y-axis versus the rate of change of forward current (dlF/dt) in A/µs on the x-axis. Curves are plotted for IF = 75 A at different case temperatures: 25°C, 75°C, and 125°C.

Figure 8. Forward Current Derating Curve

A graph shows average forward current (IF(AV)) in Amperes on the y-axis versus case temperature (TC) in °C on the x-axis. The curve shows how the maximum allowable average forward current decreases as the case temperature increases.

Figure 9. Transient Thermal Response Curve

A graph shows transient thermal response (ZθJC) in °C/W on the y-axis versus rectangular pulse duration in seconds on the x-axis. Multiple curves represent different duty factors. Notes indicate ZθJC(t) = 0.4°C/W Max, Duty Factor D = t1/t2, and TJM - TC = PDM * ZθJC(t).

Mechanical Case Outline

TO-247-2LD, CASE 340CL, ISSUE A

A diagram shows the mechanical dimensions of the TO-247-2LD package. The diagram includes labels for various dimensions (A, A1, A2, b, b2, c, D, D1, D2, E, E1, E2, e, L, L1, ØP, P1, Q, S) with corresponding millimeter measurements provided in a table.

Generic Marking Diagram

A diagram illustrates the typical marking on the device, including placeholders for specific device code, assembly location, year, work week, and lot code. It also notes the potential presence of a Pb-Free indicator.

Document Number: 98AON13850G

Description: TO-247-2LD

Date: 03 DEC 2019

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