Switch-mode Power Rectifiers - DPAK-3 Surface Mount Package
MBRD620CT, NRVBD620VCT, SBRV620CT Series
These state-of-the-art devices are designed for use in switching power supplies, inverters and as free wheeling diodes.
Features
- Extremely Fast Switching
- Extremely Low Forward Drop
- Platinum Barrier with Avalanche Guardrings
- NRVBD and SBRV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
- These Devices are Pb-Free and are RoHS Compliant
Mechanical Characteristics:
- Case: Epoxy, Molded
- Weight: 0.4 Gram (Approximately)
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
- ESD Ratings: Machine Model = C, Human Body Model = 3B
Maximum Ratings
Rating | Symbol | MBRD620CT | 630CT | 640CT | 650CT | 660CT | Unit |
---|---|---|---|---|---|---|---|
Peak Repetitive Reverse Voltage, Working Peak Reverse Voltage, DC Blocking Voltage | VRRM, VRWM, VR | 20 | 30 | 40 | 50 | 60 | V |
Average Rectified Forward Current, Tc = 130°C Per Diode, Per Device | IF(AV) | 3 | 6 | A | |||
Peak Repetitive Forward Current, Tc = 130°C (Square Wave, Duty = 0.5) Per Diode | IFRM | 6 | A | ||||
Nonrepetitive Peak Surge Current - (Surge applied at rated load conditions halfwave, single phase, 60 Hz) | IFSM | 75 | A | ||||
Peak Repetitive Reverse Surge Current (2 μs, 1 kHz) | IRRM | 1 | A | ||||
Operating Junction Temperature | TJ | -65 to +175 | °C | ||||
Storage Temperature | Tstg | -65 to +175 | °C | ||||
Voltage Rate of Change (Rated VR) | dv/dt | 10,000 | V/μs |
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA.
Thermal Characteristics Per Diode
Characteristic | Symbol | Value | Unit |
---|---|---|---|
Maximum Thermal Resistance, Junction-to-Case | ReJc | 6 | °C/W |
Maximum Thermal Resistance, Junction-to-Ambient (Note 2) | ROJA | 80 | °C/W |
2. Rating applies when surface mounted on the minimum pad size recommended.
Electrical Characteristics Per Diode
Characteristic | Symbol | Value | Unit |
---|---|---|---|
Maximum Instantaneous Forward Voltage (Note 3) iF = 3 Amps, Tc = 25°C | VF | 0.7 | V |
iF = 3 Amps, Tc = 125°C | 0.65 | V | |
iF = 6 Amps, Tc = 25°C | 0.9 | V | |
iF = 6 Amps, Tc = 125°C | 0.85 | V | |
Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, Tc = 25°C) | IR | 0.1 | mA |
(Rated dc Voltage, Tc = 125°C) | 15 | mA |
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300 μs, Duty Cycle ≤ 2.0%.
Typical Characteristics
Figure 1. Typical Forward Voltage, Per Leg
Figure 2. Typical Reverse Current,* Per Leg
Figure 3. Average Power Dissipation, Per Leg
Figure 4. Current Derating, Case, Per Leg
Figure 5. Current Derating, Ambient, Per Leg
Figure 6. Typical Capacitance, Per Leg
Ordering Information
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
NOTE: Some of the devices on this data sheet have been DISCONTINUED. Please refer to the table on page 5.
Device | Package | Shipping |
---|---|---|
MBRD620CTT4G | DPAK (Pb-Free) | 2500 / Tape & Reel |
MBRD640CTT4G | 2500 / Tape & Reel | |
MBRD650CTT4G | 2500 / Tape & Reel | |
MBRD660CTT4G | 2500 / Tape & Reel | |
SBRV660VCTT4G* | 2500 / Tape & Reel | |
SNRVBD660CTT4G* | 2500 / Tape & Reel | |
DISCONTINUED (Note 4) | ||
MBRD630CTT4G | DPAK (Pb-Free) | 2500 / Tape & Reel |
MBRD640CTG | 75 Units / Rail | |
NRVBD640CTG* | 75 Units / Rail | |
NRVBD640CTG-VF01* | 75 Units / Rail | |
NRVBD640CTT4G* | 2500 / Tape & Reel | |
NRVBD640VCTT4G* | 2500 / Tape & Reel | |
SBRV640VCTT4G* | 2500 / Tape & Reel | |
MBRD650CTG | 75 Units / Rail | |
NRVBD650CTG-VF01* | 2500 / Tape & Reel | |
NRVBD650CTT4G* | 2500 / Tape & Reel | |
NRVBD650CTT4G-VF01* | 75 Units / Rail | |
MBRD660CTG | 75 Units / Rail | |
NRVBD660CTG* | 75 Units / Rail | |
NRVBD660CTG-VF01* | DPAK (Pb-Free) | 75 Units / Rail |
MBRD660CTRLG | 1800 / Tape & Reel | |
NRVBD660CTRLG* | 1800 / Tape & Reel | |
NRVBD660CTT4G* | 2500 / Tape & Reel |
*For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*NRVBD and SBRV Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
4. DISCONTINUED: These devices are not recommended for new design. Please contact your onsemi representative for information. The most current information on these devices may be available on www.onsemi.com.
Mechanical Case Outline
DPAK (SINGLE GAUGE) CASE 369C ISSUE G
DATE: 31 MAY 2023
NOTES:
- DIMENSIONING AND TOLERANCING ASME Y14.5M, 1994.
- CONTROLLING DIMENSION: INCHES
- THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3, AND Z.
- DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.
- DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY.
- DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
- OPTIONAL MOLD FEATURE.
DIM | INCHES | MILLIMETERS | ||
---|---|---|---|---|
MIN. | MAX. | MIN. | MAX. | |
A | 0.086 | 0.094 | 2.18 | 2.38 |
A1 | 0.000 | 0.005 | 0.00 | 0.13 |
b | 0.025 | 0.035 | 0.63 | 0.89 |
b2 | 0.028 | 0.045 | 0.72 | 1.14 |
b3 | 0.180 | 0.215 | 4.57 | 5.46 |
c | 0.018 | 0.024 | 0.46 | 0.61 |
c2 | 0.018 | 0.024 | 0.46 | 0.61 |
D | 0.235 | 0.245 | 5.97 | 6.22 |
E | 0.250 | 0.265 | 6.35 | 6.73 |
e | 0.090 BSC | 2.29 BSC | ||
H | 0.370 | 0.410 | 9.40 | 10.41 |
L | 0.055 | 0.070 | 1.40 | 1.78 |
L1 | 0.114 REF | 2.90 REF | ||
L2 | 0.020 BSC | 0.51 BSC | ||
L3 | 0.035 | 0.050 | 0.89 | 1.27 |
L4 | 0.040 | 1.01 | ||
Z | 0.155 | 3.93 |
GENERIC MARKING DIAGRAM*
RECOMMENDED MOUNTING FOOTPRINT*
*FOR ADDITIONAL INFORMATION ON OUR PB-FREE STRATEGY AND SOLDERING DETAILS, PLEASE DOWNLOAD THE ON SEMICONDUCTOR SOLDERING AND MOUNTING TECHNIQUES REFERENCE MANUAL, SOLDERRM/D.
PINOUT STYLES:
- STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
- STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
- STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE
- STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE
- STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE
- STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2
- STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER
- STYLE 8: PIN 1. N/C 2. CATHODE
- STYLE 9: PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE
- STYLE 10: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE
DOCUMENT NUMBER: 98AON10527D
DESCRIPTION: DPAK (SINGLE GAUGE)
*This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "", may or may not be present. Some products may not follow the Generic Marking.
Additional Information
TECHNICAL PUBLICATIONS:
Technical Library: www.onsemi.com/design/resources/technical-documentation
onsemi Website: www.onsemi.com
ONLINE SUPPORT:
www.onsemi.com/support
For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales