STMicroelectronics Material Declaration Form

General Information

IPC Standard: 1752

Form Type: Distribute

Sectionals:

Version: 2

Subsectionals: A-D

*: Required Field

Supplier Information

Company name*: STMicroelectronics

Contact name*: Refer to Supplier Comment section

Contact phone*: Refer to Supplier Comment section

Authorized representative*: MDRF CHAMPION

Representative phone*: Refer to Supplier Comment section

Supplier comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Response Date*: 2025-07-24

Contact email*: Refer to Supplier Comment section

Representative title: MDRFMaterial Declaration champion

Representative email*: Refer to Supplier Comment section

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier acceptance*: true

Legal declaration*: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Information

Mfr item number: STM32F205RGY6TR

Mfr item name: H0N6*411CCCV

Amount: 15

Version: A

Unit of measure: mg

Manufacturing site: 9989

Unit type: Each

Date: 2025-07-24

ST ECOPACK grade: ECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating: 1

Bulk solder termination: Tin/Silver/Copper (SAC405)

Classification temperature: 260

Number of reflow cycles: 3

Terminal plating: Not Applicable

Terminal base alloy: NAC

Package designator: WLCSP

Package size: NA

Number of instances: 66

Shape: Bulk solder

Package: A0FX WLCSP 66L DIE 411 P 0.4 MM 8295275

Compliance Queries

RoHS Directive 2011/65/EU

Query: RoHS Directive 2011/65/EU - 8 June 2011 – Annex II amended by Delegated Directive 2015/863 - 31 March 2015

  • 1 - Product(s) meets EU RoHS requirement without any exemptions
  • 2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)
  • 3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)
  • 4 - Product(s) does not meet EU RoHS requirements and is not under exemptions
Exemption Id. Description Response
true
false
false
false

REACH-25th June 2025

Query: Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application Response ppm in product
#N/Atrue

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document.

Homogeneous material Material group Substance category Substance CAS Exempt Mass Unit of measure Concentration in homogeneous material (ppm) Concentration in product (ppm)
die or diesOther inorganic materialssupplierSilicon (Si)7440-21-312.485mg961394789582
metallizationOther inorganic materialssupplierAluminium (Al)7429-90-50.024mg19221579
metallizationOther inorganic materialssupplierCopper (Cu)7440-50-80.235mg1882315459
metallizationOther inorganic materialssupplierTantalum (Ta)7440-25-70.029mg23231908
metallizationOther inorganic materialssupplierTitanium (Ti)7440-32-60.002mg160132
metallizationOther inorganic materialssupplierTungsten (W)7440-33-70.001mg8066
passivationSilicon Oxide(SiO2)California 65Silicon Oxide(SiO2)7631-86-90.054mg43253552
passivationIndium Tin oxide (In2O3:SnO2)supplierIndium Tin oxide (In2O3:SnO2)50926-11-90.137mg109739012
ChemicalsPolyamide ResinsupplierPolyamide Resin63428-83-10.011mg830000694
ChemicalsAcrylate EstersupplierAcrylate EsterProprietary0.001mg10000084
ChemicalsTetraethylene glycol dimethacrylatesupplierTetraethylene glycol dimethacrylate109-17-10.001mg5000042
ChemicalsOxybisdiphthalic anhydridesupplierOxybisdiphthalic anhydride1823-59-20.000mg2000017
AlloysCopper TargetsupplierCopper7440-50-80.105mg10000006907
AlloysTitanium TargetsupplierTitanium7440-32-60.007mg1000000460
AlloysRDL (Cu)supplierAluminum7429-90-50.118mg9752077762
AlloysRDL (Cu)supplierCopper7440-50-80.003mg24793197
AlloysUBM (Cu)supplierNickel7440-02-00.045mg9183672960
AlloysUBM (Cu)supplierVanadium7440-62-20.004mg81633263
AlloysCoatingsupplierCopper7440-50-80.525mg100000034536
AlloysSolder Balls (SAC405)supplierTin7440-31-51.812mg954966119169
AlloysSolder Balls (SAC405)supplierSilver7440-22-40.076mg400304995
AlloysSolder Balls (SAC405)supplierCopper7440-50-80.009mg5004624

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