General Information
| IPC | 1752 |
| Form type* | Distribute |
| Sectionals* | Material information |
| Version | 2 |
| Subsectionals* | Manufacturing information |
| *: Required Field |
Supplier Information
| Company name* | STMicroelectronics |
| Contact name* | Refer to Supplier Comment section |
| Contact phone* | Refer to Supplier Comment section |
| Authorized representative* | MDG CHAMPION |
| Representative phone* | Refer to Supplier Comment section |
| Response Date* | 2025-09-09 |
| Contact email* | Refer to Supplier Comment section |
| Representative title | MDGMaterial Declaration champion |
| Representative email* | Refer to Supplier Comment section |
Supplier comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
| Supplier acceptance* | true |
| Legal declaration* | Standard |
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Product Details
| Mfr item number | BLUENRG-345MC |
| Mfr item name | Y3M2*F1618B9 |
| Amount | 107 |
| Version | A |
| Manufacturing site | P1C7 |
| Unit type | Each |
| Date | 2025-09-09 |
| ST ECOPACK grade | ECOPACK® 2 |
Manufacturing Information
| J-STD-020 MSL rating | 3 |
| Classification temperature | 260 |
| Number of reflow cycles | 3 |
| Bulk solder termination | Not Applicable |
| Terminal plating | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal base alloy | Copper Alloy |
| Package designator | QFN |
| Package size | 6x6 |
| Number of instances | 48 |
| Shape | Flat |
Comment: Package: A0BE VFQFPN 6x6x0.9 48L PITCH 0.4 8205966
Compliance Information
RoHS Directive 2011/65/EU
- Product(s) meets EU RoHS requirement without any exemptions (Response: true)
- Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply) (Response: false)
- Product(s) meets EU RoHS requirements by application of the selected exemption(s) (Response: false)
- Product(s) does not meet EU RoHS requirements and is not under exemptions (Response: false)
REACH
- Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH (Response: true)
| CategoryLevel_Name | CategoryLevel_Threshold | amount in product (mg) | Application | Response |
|---|---|---|---|---|
| #N/A | 0 | ppm in product |
Material Composition Declaration
Note: Substance present with less 0.001mg will not be declared in this document.
| Homogeneous material | Material group | Mass (Homogeneous Material) | Unit of measure (Homogeneous Material) | Level | Substance category | Substance | CAS | Exempt | Mass (Substance) | Unit of measure (Substance) | Concentration in homogeneous material (ppm) | Concentration in product (ppm) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | die | Silicon (Si) | 7440-21-3 | 7.026 | mg | 948281 | 65892.32 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | metallization | Aluminium (Al) | 7429-90-5 | 0.018 | mg | 2455 | 170.59 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | metallization | Copper (Cu) | 7440-50-8 | 0.163 | mg | 21946 | 1524.94 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | metallization | Tantalum (Ta) | 7440-25-7 | 0.052 | mg | 7060 | 490.57 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | metallization | Titanium (Ti) | 7440-32-6 | 0.002 | mg | 307 | 21.33 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | metallization | Tungsten (W) | 7440-33-7 | 0.001 | mg | 153 | 10.63 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | Passivation | Silicon Nitride | 12033-89-5 | 0.041 | mg | 5525 | 383.91 | |
| Die or dies | M-011 Other inorganic materials | 7.409 | mg | supplier | Passivation | Silicon Oxide | 7631-86-9 | 0.106 | mg | 14273 | 991.77 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | supplier | Glue or tape | Silver (Ag) | 7440-22-4 | 1.004 | mg | 800000 | 9411.97 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | supplier | Glue or tape | Methylene diacrylate polymer | 42594-17-2 | 0.206 | mg | 164000 | 1929.45 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | supplier | Glue or tape | Epoxy resin | 68475-94-5 | 0.031 | mg | 25000 | 294.12 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | supplier | Glue or tape | Epoxycyclohexylethyltrimethoxysilane | 3388-04-3 | 0.006 | mg | 5000 | 58.82 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | SVHC | Glue or tape | Bis(a,a-dimethylbenzyl) peroxide | 80-43-3 | 0.006 | mg | 5000 | 58.82 | |
| Glue epoxy (QMI-519) | Precious metals | 1.255 | mg | supplier | Glue or tape | Palladium (Pd) | 7440-05-3 | 0.001 | mg | 1000 | 11.76 | |
| Bonding wire (CuPd) | Precious metals | 0.345 | mg | supplier | Bonding wire | Copper (Cu) | 7440-50-8 | 0.341 | mg | 990000 | 3198.63 | |
| Bonding wire (CuPd) | Precious metals | 0.345 | mg | supplier | Bonding wire | Others | Proprietary | 0.003 | mg | 10000 | 32.31 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Silica vitreous | 60676-86-0 | 40.510 | mg | 880000 | 379910.28 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Biphenyl epoxy resin | 85954-11-6 | 2.302 | mg | 50000 | 21585.81 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Phenolic resin | 205830-20-2 | 1.795 | mg | 39000 | 16836.93 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Epoxy type resin A | Proprietary | 0.921 | mg | 20000 | 8634.32 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Epoxy type resin B | Proprietary | 0.414 | mg | 9000 | 3885.45 | |
| Encapsulation (CEL 9240ZHF10W) | M-011 Other inorganic materials | 46.034 | mg | supplier | Molding Compound | Carbon black | 1333-86-4 | 0.092 | mg | 2000 | 863.43 | |
| Leadframe (C194) | Copper & its alloys | 51.165 | mg | supplier | Leadframe | Copper (Cu) | 7440-50-8 | 50.029 | mg | 977801.9666 | 469181.43 | |
| Leadframe (C194) | Copper & its alloys | 51.165 | mg | supplier | Leadframe | Iron (Fe) | 7439-89-6 | 1.083 | mg | 21169.16364 | 10157.66 | |
| Leadframe (C194) | Copper & its alloys | 51.165 | mg | supplier | Leadframe | Zinc (Zn) | 7440-66-6 | 0.049 | mg | 961.6233428 | 461.42 | |
| Leadframe (C194) | Copper & its alloys | 51.165 | mg | supplier | Leadframe | Phosphorus (P) | 7723-14-0 | 0.003 | mg | 67.24639034 | 32.27 | |
| External Plating (Ni/Pd/Au) | M-011 Other inorganic materials | 0.423 | mg | supplier | Plating | Nickel (Ni) | 7440-02-0 | 0.389 | mg | 918899.4478 | 3647.14 | |
| External Plating (Ni/Pd/Au) | M-011 Other inorganic materials | 0.423 | mg | supplier | Plating | Palladium (Pd) | 7440-05-3 | 0.029 | mg | 69332.73903 | 275.18 | |
| External Plating (Ni/Pd/Au) | M-011 Other inorganic materials | 0.423 | mg | supplier | Plating | Gold (Au) | 7440-57-5 | 0.005 | mg | 11767.81316 | 46.71 |
