STMicroelectronics Material Declaration Form

For Product: STM32G431R8I6

General Information

Form Type: Distribute

IPC: 1752

Sectionals: 2

Version: 2

Subsectionals: A-D

Supplier Information

Company Name: STMicroelectronics

Contact Name: MDG CHAMPION

Contact Phone: Refer to Supplier Comment section

Contact Email: Refer to Supplier Comment section

Authorized Representative: MDG Material Declaration champion

Representative Title: Refer to Supplier Comment section

Representative Phone: Refer to Supplier Comment section

Representative Email: Refer to Supplier Comment section

Response Date: 2025-07-08

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier Acceptance: true

Legal Declaration: Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Details

Mfr Item NumberSTM32G431R8I6
Mfr Item Name5321*468XXXX
Amount27
Unit of Measuremg
VersionA
Manufacturing Site9996
Unit TypeEach
ST ECOPACK GradeECOPACK® 2
J-STD-020 MSL Rating3
Classification Temperature260
Number of Reflow Cycles3
Bulk Solder TerminationTin - 3.5Ag
Terminal PlatingNot Applicable
Terminal Base AlloyNAC
Package DesignatorBGA
Package Size5x5
PackageA019 UFBGA 5X5X0.6 64L P 0.5 MM 8526322
Number of Instances64
ShapeBulk solder
Comment0

RoHS Directive Compliance

Directive: RoHS Directive 2011/65/EU - 8 June 2011, Annex II amended by Delegated Directive 2015/863 - 31 March 2015

  • Product(s) meets EU RoHS requirement without any exemptions: true
  • Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
  • Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
  • Product(s) does not meet EU RoHS requirements and is not under exemptions: false

REACH Compliance

Query: Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Response: true

Material Composition Declaration

Note: Substance present with less than 0.001mg will not be declared in this document.

Total Component Mass: 27.0200 mg

Homogeneous MaterialMaterial GroupSubstance CategorySubstanceCASExemptMass (mg)Unit of MeasureConcentration in Homogeneous Material (ppm)Concentration in Product (ppm)
Die or diesM-011 Other inorganic materialsdieSilicon (Si)7440-21-31.703mg96059763032.51
metallizationAluminium (Al)7429-90-50.003mg1876123.10
metallizationCopper (Cu)7440-50-80.030mg166861094.90
metallizationCobalt (Co)7440-48-40.000mg674.40
metallizationTantalum (Ta)7440-25-70.010mg5428356.17
metallizationTitanium (Ti)7440-32-60.000mg20113.19
metallizationTungsten (W)7440-33-70.000mg1348.79
PassivationSilicon Nitride12033-89-50.007mg4222277.04
PassivationSilicon Oxide7631-86-90.019mg10789707.95
Substrate (101427659)Other organic materialsCOREFibrous-Glass-Wool65997-17-31.174mg140762.181843447.69
COREFormaldehyde Polymer with (Chloromethyl)Oxirane28906-96-90.299mg35828.5090911058.84
CORETriazine25722-66-10.299mg35828.5090911058.84
CORESilicon dioxide7631-86-90.730mg87580.827032.71
COPPER FOILCopper (Cu)7440-50-82.502mg30000092598.08
SOLDERMASK (AUS320)Cured ResinProprietary1.385mg166118.105551274.06
SOLDERMASK (AUS320)Phthalocyanine Blue147-14-80.004mg440.0479616135.83
SOLDERMASK (AUS320)Organic PigmentProprietary0.004mg440.0479616135.83
SOLDERMASK (AUS320)SilicaProprietary0.009mg1100.119904339.56
SOLDERMASK (AUS320)Barium sulfate7727-43-70.382mg45764.9880114125.83
SOLDERMASK (AUS320)Talc14807-96-60.039mg4620.5035971426.17
SOLDERMASK (AUS320)Antifoamer and Leveling AgentProprietary0.013mg1540.167866475.39
NI PLATINGNickel (Ni)7440-02-00.136mg16306.954445033.31
AU PLATINGGold (Au)7440-57-51.365mg163669.064750518.13
DAF (EM-760L2-P)Other organic materials0.290mg
GLUESynthetic RubberProprietary0.116mg4000004293.12
GLUEAmorphous Silica7631-86-90.145mg5000005366.40
GLUEPhenol ResinProprietary0.152mg
BONDING WIRE (Cu)Other inorganic materialsBONDING WIRECopper (Cu)7440-50-80.148mg1000001073.28
BONDING WIREPalladium (Pd)7440-05-30.004mg9705005459.51
BONDING WIREGold (Au)7440-57-50.029mg28000157.51
SOLDERBALLS (Sn3.5Ag)Other inorganic materialsSOLDERBALLTin (Sn)7440-31-50.000mg15008.44
SOLDERBALLSilver (Ag)7440-22-41.917mg96500070964.29
Encapsulation (G770FE)Other organic materialsMOLDING COMPOUNDEpoxy Resin AProprietary0.434mg3000016074.76
MOLDING COMPOUNDEpoxy Resin B1675-54-30.434mg3000016074.76
MOLDING COMPOUNDPhenol ResinProprietary0.666mg4600024647.96
MOLDING COMPOUNDSilica(Amorphous) A60676-86-010.482mg724000387937.53
MOLDING COMPOUNDSilica(Amorphous) B7631-86-92.172mg15000080373.80
MOLDING COMPOUNDAluminum Hydroxide21645-51-20.217mg150008037.38
MOLDING COMPOUNDCarbon Black1333-86-40.072mg50002679.13

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