STMicroelectronics Material Declaration Form
For Product: STM32G431R8I6
General Information
Form Type: Distribute
IPC: 1752
Sectionals: 2
Version: 2
Subsectionals: A-D
Supplier Information
Company Name: STMicroelectronics
Contact Name: MDG CHAMPION
Contact Phone: Refer to Supplier Comment section
Contact Email: Refer to Supplier Comment section
Authorized Representative: MDG Material Declaration champion
Representative Title: Refer to Supplier Comment section
Representative Phone: Refer to Supplier Comment section
Representative Email: Refer to Supplier Comment section
Response Date: 2025-07-08
Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html
Uncertainty Statement
While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement
Supplier Acceptance: true
Legal Declaration: Standard
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.
Product Details
Mfr Item Number | STM32G431R8I6 |
---|---|
Mfr Item Name | 5321*468XXXX |
Amount | 27 |
Unit of Measure | mg |
Version | A |
Manufacturing Site | 9996 |
Unit Type | Each |
ST ECOPACK Grade | ECOPACK® 2 |
J-STD-020 MSL Rating | 3 |
Classification Temperature | 260 |
Number of Reflow Cycles | 3 |
Bulk Solder Termination | Tin - 3.5Ag |
Terminal Plating | Not Applicable |
Terminal Base Alloy | NAC |
Package Designator | BGA |
Package Size | 5x5 |
Package | A019 UFBGA 5X5X0.6 64L P 0.5 MM 8526322 |
Number of Instances | 64 |
Shape | Bulk solder |
Comment | 0 |
RoHS Directive Compliance
Directive: RoHS Directive 2011/65/EU - 8 June 2011, Annex II amended by Delegated Directive 2015/863 - 31 March 2015
- Product(s) meets EU RoHS requirement without any exemptions: true
- Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
- Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
- Product(s) does not meet EU RoHS requirements and is not under exemptions: false
REACH Compliance
Query: Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH
Response: true
Material Composition Declaration
Note: Substance present with less than 0.001mg will not be declared in this document.
Total Component Mass: 27.0200 mg
Homogeneous Material | Material Group | Substance Category | Substance | CAS | Exempt | Mass (mg) | Unit of Measure | Concentration in Homogeneous Material (ppm) | Concentration in Product (ppm) |
---|---|---|---|---|---|---|---|---|---|
Die or dies | M-011 Other inorganic materials | die | Silicon (Si) | 7440-21-3 | 1.703 | mg | 960597 | 63032.51 | |
metallization | Aluminium (Al) | 7429-90-5 | 0.003 | mg | 1876 | 123.10 | |||
metallization | Copper (Cu) | 7440-50-8 | 0.030 | mg | 16686 | 1094.90 | |||
metallization | Cobalt (Co) | 7440-48-4 | 0.000 | mg | 67 | 4.40 | |||
metallization | Tantalum (Ta) | 7440-25-7 | 0.010 | mg | 5428 | 356.17 | |||
metallization | Titanium (Ti) | 7440-32-6 | 0.000 | mg | 201 | 13.19 | |||
metallization | Tungsten (W) | 7440-33-7 | 0.000 | mg | 134 | 8.79 | |||
Passivation | Silicon Nitride | 12033-89-5 | 0.007 | mg | 4222 | 277.04 | |||
Passivation | Silicon Oxide | 7631-86-9 | 0.019 | mg | 10789 | 707.95 | |||
Substrate (101427659) | Other organic materials | CORE | Fibrous-Glass-Wool | 65997-17-3 | 1.174 | mg | 140762.1818 | 43447.69 | |
CORE | Formaldehyde Polymer with (Chloromethyl)Oxirane | 28906-96-9 | 0.299 | mg | 35828.50909 | 11058.84 | |||
CORE | Triazine | 25722-66-1 | 0.299 | mg | 35828.50909 | 11058.84 | |||
CORE | Silicon dioxide | 7631-86-9 | 0.730 | mg | 87580.8 | 27032.71 | |||
COPPER FOIL | Copper (Cu) | 7440-50-8 | 2.502 | mg | 300000 | 92598.08 | |||
SOLDERMASK (AUS320) | Cured Resin | Proprietary | 1.385 | mg | 166118.1055 | 51274.06 | |||
SOLDERMASK (AUS320) | Phthalocyanine Blue | 147-14-8 | 0.004 | mg | 440.0479616 | 135.83 | |||
SOLDERMASK (AUS320) | Organic Pigment | Proprietary | 0.004 | mg | 440.0479616 | 135.83 | |||
SOLDERMASK (AUS320) | Silica | Proprietary | 0.009 | mg | 1100.119904 | 339.56 | |||
SOLDERMASK (AUS320) | Barium sulfate | 7727-43-7 | 0.382 | mg | 45764.98801 | 14125.83 | |||
SOLDERMASK (AUS320) | Talc | 14807-96-6 | 0.039 | mg | 4620.503597 | 1426.17 | |||
SOLDERMASK (AUS320) | Antifoamer and Leveling Agent | Proprietary | 0.013 | mg | 1540.167866 | 475.39 | |||
NI PLATING | Nickel (Ni) | 7440-02-0 | 0.136 | mg | 16306.95444 | 5033.31 | |||
AU PLATING | Gold (Au) | 7440-57-5 | 1.365 | mg | 163669.0647 | 50518.13 | |||
DAF (EM-760L2-P) | Other organic materials | 0.290 | mg | ||||||
GLUE | Synthetic Rubber | Proprietary | 0.116 | mg | 400000 | 4293.12 | |||
GLUE | Amorphous Silica | 7631-86-9 | 0.145 | mg | 500000 | 5366.40 | |||
GLUE | Phenol Resin | Proprietary | 0.152 | mg | |||||
BONDING WIRE (Cu) | Other inorganic materials | BONDING WIRE | Copper (Cu) | 7440-50-8 | 0.148 | mg | 100000 | 1073.28 | |
BONDING WIRE | Palladium (Pd) | 7440-05-3 | 0.004 | mg | 970500 | 5459.51 | |||
BONDING WIRE | Gold (Au) | 7440-57-5 | 0.029 | mg | 28000 | 157.51 | |||
SOLDERBALLS (Sn3.5Ag) | Other inorganic materials | SOLDERBALL | Tin (Sn) | 7440-31-5 | 0.000 | mg | 1500 | 8.44 | |
SOLDERBALL | Silver (Ag) | 7440-22-4 | 1.917 | mg | 965000 | 70964.29 | |||
Encapsulation (G770FE) | Other organic materials | MOLDING COMPOUND | Epoxy Resin A | Proprietary | 0.434 | mg | 30000 | 16074.76 | |
MOLDING COMPOUND | Epoxy Resin B | 1675-54-3 | 0.434 | mg | 30000 | 16074.76 | |||
MOLDING COMPOUND | Phenol Resin | Proprietary | 0.666 | mg | 46000 | 24647.96 | |||
MOLDING COMPOUND | Silica(Amorphous) A | 60676-86-0 | 10.482 | mg | 724000 | 387937.53 | |||
MOLDING COMPOUND | Silica(Amorphous) B | 7631-86-9 | 2.172 | mg | 150000 | 80373.80 | |||
MOLDING COMPOUND | Aluminum Hydroxide | 21645-51-2 | 0.217 | mg | 15000 | 8037.38 | |||
MOLDING COMPOUND | Carbon Black | 1333-86-4 | 0.072 | mg | 5000 | 2679.13 |