Material Declaration Form

General Information

IPC1752Form type*Distribute
Sectionals*Material informationVersion2
Manufacturing informationSubsectionals*A-D

* Required Field

Supplier Information

Company name*STMicroelectronicsResponse Date*2025-07-24
Contact name*Refer to Supplier Comment sectionContact email*Refer to Supplier Comment section
Contact phone*Refer to Supplier Comment sectionRepresentative titleMDRFMaterial Declaration champion
Authorized representative*MDRF CHAMPIONRepresentative email*Refer to Supplier Comment section
Representative phone*Refer to Supplier Comment section

Supplier Comment

Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier acceptance*trueLegal declaration*Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Details

Mfr item numberSTM8AF6268TAXMfr item nameJH5B*79BX141
Amount176VersionA
Unit of measuremgManufacturing site0959
Unit typeEachDate2025-07-24
ST ECOPACK gradeECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating3Classification temperature260Number of reflow cycles3
Bulk solder terminationNot ApplicableTerminal platingNickel/Palladium/Gold (Ni/Pd/Au)Terminal base alloyCopper Alloy
Package designatorQFPPackage size7x7Number of instances48
ShapeGull wing

Package: 5B LQFP 48 7x7x1.4 1 0110596

Comment: 0

RoHS Directive Compliance

QueryList: RoHS Directive 2011/65/EU - 8 June 2011 - Annex II amended by Delegated Directive 2015/863 - 31 March 2015

#DescriptionResponse
1Product(s) meets EU RoHS requirement without any exemptionstrue
2Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)false
3Product(s) meets EU RoHS requirements by application of the selected exemption(s)false
4Product(s) does not meet EU RoHS requirements and is not under exemptionsfalse

Exemption Id.:

REACH Compliance Query

QueryList: REACH-21st January 2025

#DescriptionResponse
1Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACHtrue
CategoryLevel_NameCategoryLevel_Thresholdamount in product (mg)Applicationppm in product
#N/A

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document

Homogeneous materialMaterial groupMassUnit of measureLevelSubstance categorySubstanceCASExemptConcentration
in homogeneous material (ppm)in product (ppm)
Die or diesM-011 Other inorganic materials4.521mgsupplierdieSilicon(Si)7440-21-396527324745
suppliermetallizationAluminium(Al)7429-90-5265468
suppliermetallizationCopper(Cu)7440-50-88848227
suppliermetallizationTitanium(Ti)7440-32-666417
supplierPassivationSilicon Oxide7631-86-914377369
supplierPolymer coatingPIX1 Polyimide AP2210A / HD8820 - Gamma-butyrolactone96-48-08184210
Leadframe (C7025)M-011 Other inorganic materials74.402mgsupplieralloyCopper (Cu)7440-50-8964855407055
supplieralloyNickel (Ni)7440-02-02774611706
supplieralloySilicium (Si)7440-21-360122536
supplieralloyMagnesium (Mg)7439-95-41387585
Leadframe Coating (NiPdAu)M-011 Other inorganic materials0.405mgsuppliercoatingNickel (Ni)7440-02-09148402104
suppliercoatingPalladium (Pd)7440-05-32966068
suppliercoatingGold (Au)7440-57-52775063
suppliercoatingSilver (Ag)7440-22-42775063
Glue epoxy (EN4900)M-011 Other inorganic materials1.954mgsupplierglue or soft solderSilver (Ag)7440-22-47700008532
supplierglue or soft solderEpoxy Cresol Novolak29690-82-22260002504
supplierglue or soft solder1-isopropyl-2,2-dimethyltrimethylene diisobutyrate6846-50-0400044
Bonding wire (Au)M-011 Other inorganic materials0.913mgsupplierBonding wireGold (Au)7440-57-510000005178
Encapsulation (EME-G700LS)M-011 Other inorganic materials94.161mgsupplierMoulding CompoundSolid Epoxy ResinProprietary7206938479
supplierMoulding CompoundPhenol ResinProprietary5147827485
supplierMoulding CompoundSilica, vitreous60676-86-0871305465211
supplierMoulding CompoundCarbon-black1333-86-451482749

• 2022 STMicroelectronics

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