STMicroelectronics Material Declaration Form

General Information

IPC1752
Form typeDistribute
Sectionals
Material information
Manufacturing information
Version2
SubsectionalsA-D

Supplier Information

Company name*STMicroelectronics
Contact name*Refer to Supplier Comment section
Contact phone*Refer to Supplier Comment section
Authorized representative*MDRF CHAMPION
Representative phone*Refer to Supplier Comment section
Response Date*2025-08-20
Contact email*Refer to Supplier Comment section
Representative titleMDRFMaterial Declaration champion
Representative email*Refer to Supplier Comment section

Supplier comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal statement

Supplier acceptance*true
Legal declaration*Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Details

Mfr item numberSTM32F103VDT7
Mfr item nameEK1L*414XXX2
Amount681
Unit of measuremg
VersionA
Manufacturing site9991
Unit typeEach
Date2025-08-20
ST ECOPACK gradeECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating3
Bulk solder terminationNot Applicable
Classification temperature260
Terminal platingTin (Sn), matte
Package designatorQFP
Package size14x14
Number of reflow cycles3
Terminal base alloyCopper Alloy
Number of instances100
ShapeGull wing
Package1L LQFP 100 14x14x1.4 10086901

Compliance Information

RoHS Directive 2011/65/EU - 8 June 2011

Response: true

REACH - 25th June 2025

Response: true

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document

Homogeneous materialMaterial groupSubstance categorySubstanceCASExemptMassUnit of measureConcentration in homogeneous material (ppm)Concentration in product (ppm)
Die or diesM-011 Other inorganic materialsdieSilicon (Si)7440-21-32.744mg7837754027
metallizationmetallizationAluminium (Al)7429-90-50.051mg1456775
metallizationmetallizationCopper (Cu)7440-50-80.257mg73408377
metallizationmetallizationCobalt (Co)7440-48-40.048mg1371070
metallizationmetallizationTitanium (Ti)7440-32-60.014mg399921
metallizationmetallizationTungsten (W)7440-33-70.028mg799841
PassivationPassivationSilicon Nitride12033-89-50.034mg971250
PassivationPassivationSilicon Oxide7631-86-90.325mg92831477
Leadframe (Cu)LeadframeLeadframeCopper (Cu)7440-50-8175.150mg944000257029
LeadframeLeadframeSilver (Ag)7440-22-42.783mg150004084
LeadframeLeadframeMagnesium (Mg)7439-95-40.325mg1750476
LeadframeLeadframeSilicon (Si)7440-21-31.345mg72501974
LeadframeLeadframeNickel (Ni)7440-02-05.937mg320008713
Glue epoxy (CRM 1076WA)Glue or tapeGlue or tapeSilver Powder7440-22-42.639mg7540003873
Glue or tapeGlue or tapeBisphenol F Type Epoxy Resin9003-36-50.105mg30000154
Glue or tapeGlue or tapeEpoxy resinProprietary0.245mg70000360
Glue or tapeGlue or tapeDiluentProprietary0.088mg25000128
Glue or tapeGlue or tapeEthylene dimethacrylate97-90-50.280mg80000411
Glue or tapeGlue or tape1,4-Cyclohexanedimethanol diglycidyl ether14228-73-00.105mg30000154
Glue or tapeGlue or tapeDicyandiamide461-58-50.019mg550028
Glue or tapeGlue or tape1,1-Di(t-butylperoxy)cyclohexane3006-86-80.019mg550028
Bonding wire (Au)Bonding wireBonding wireAu7440-57-51.582mg9885002321
Bonding wireBonding wirePd7440-05-30.018mg1150027
Encapsulation (EME-G631SH)Molding CompoundMolding CompoundEpoxy Resin AProprietary9.328mg2000013689
Molding CompoundMolding CompoundEpoxy Resin BProprietary9.328mg2000013689
Molding CompoundMolding CompoundPhenol ResinProprietary25.652mg5500037644
Molding CompoundMolding CompoundCarbon Black1333-86-42.565mg55003764
Molding CompoundMolding CompoundSilica(Amorphous) A60676-86-0349.567mg749500512982
Molding CompoundMolding CompoundSilica(Amorphous) B7631-86-969.960mg150000102665
External Plating (Sn)Matte SnMatte SnTin (Sn)7440-31-520.898mg99990030667
Impurities7440-05-30.002mg1003

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