Material Declaration Form

General Information

Form type*	Distribute	IPC	1752
Sectionals*		Version	2
Material information		Subsectionals*	A-D
Manufacturing information		*: Required Field

Supplier Information

Company name*	STMicroelectronics	Response Date*	2025-07-24
Contact name*	Refer to Supplier Comment section	Contact email*	Refer to Supplier Comment section
Contact phone*	Refer to Supplier Comment section	Authorized representative*	MDRF CHAMPION
Representative phone*	Refer to Supplier Comment section	Representative title	MDRFMaterial Declaration champion
Representative email*	Refer to Supplier Comment section
Supplier comment	Refer to Supplier Comment section

Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Legal Statement

Supplier acceptance*	true	Legal declaration*	Standard

Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier's liability and the Company's remedies for issues that arise regarding information the Supplier provides in this form.

Product Information

Mfr item number	STM8AF6268TCX	Mfr item name	JE5B*79BX141	Amount	176
Version	A	Unit of measure	mg	Manufacturing site	0959
Unit type	Each	date	2025-07-24	ST ECOPACK grade	ECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating	3	Bulk solder termination	Not Applicable
Package designator	QFP	Classification temperature	260
Terminal plating	Nickel/Palladium/Gold (Ni/Pd/Au)	Package size	7x7
Package: 5B LQFP 48 7x7x1.4 10110596		Number of reflow cycles	3
Terminal base alloy	Copper Alloy	Number of instances	48
Shape	Gull wing	Comment	0

RoHS Compliance

Directive 2011/65/EU - 8 June 2011, Annex II amended by Delegated Directive 2015/863 - 31 March 2015

RoHS Compliance Status:

Product(s) meets EU RoHS requirement without any exemptions: true
Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply): false
Product(s) meets EU RoHS requirements by application of the selected exemption(s): false
Product(s) does not meet EU RoHS requirements and is not under exemptions: false

REACH Compliance

REACH - 21st January 2025

REACH Compliance Status:

Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH: true

Material Composition Declaration

Note: Substance present with less than 0.001mg will not be declared in this document.

Homogeneous material	Material group	Substance category	Substance	CAS	Mass (mg)	Unit of measure	Concentration in homogeneous material (ppm)	Concentration in product (ppm)
Die or dies	M-011 Other inorganic materials	die	Silicon(Si)	7440-21-3	4.364	mg	965273	24745
		metallization	Aluminium(Al)	7429-90-5	0.012	mg	2654	68
		metallization	Copper(Cu)	7440-50-8	0.040	mg	8848	227
		metallization	Titanium(Ti)	7440-32-6	0.003	mg	664	17
		Passivation	Silicon Oxide	7631-86-9	0.065	mg	14377	369
		Polymer coating	PIX1 Polyimide AP2210A / HD8820 - Gamma-buty 96-48-0		0.037	mg	8184	210
Leadframe (C7025)	M-011 Other inorganic materials	alloy	Copper (Cu)	7440-50-8	71.787	mg	964855	407055
		alloy	Nickel (Ni)	7440-02-0	2.064	mg	27746	11706
		alloy	Silicium (Si)	7440-21-3	0.447	mg	6012	2536
		alloy	Magnesium (Mg)	7439-95-4	0.103	mg	1387	585
Leadframe Coating (NiPdAu)	M-011 Other inorganic materials	coating	Nickel (Ni)	7440-02-0	0.371	mg	914840	2104
		coating	Palladium (Pd)	7440-05-3	0.012	mg	29660	68
		coating	Gold (Au)	7440-57-5	0.011	mg	27750	63
		coating	Silver (Ag)	7440-22-4	0.011	mg	27750	63
Glue epoxy (EN4900)	M-011 Other inorganic materials	glue or soft solder	Silver (Ag)	7440-22-4	1.505	mg	770000	8532
		glue or soft solder	Epoxy Cresol Novolak	29690-82-2	0.442	mg	226000	2504
		glue or soft solder	1-isopropyl-2,2-dimethyltrimethylene diisobutyrate	6846-50-0	0.008	mg	4000	44
Bonding wire (Au)	M-011 Other inorganic materials	Bonding wire	Gold (Au)	7440-57-5	0.913	mg	1000000	5178
Encapsulation (EME-G700LS)	M-011 Other inorganic materials	Moulding Compound	Solid Epoxy Resin	Proprietary	6.786	mg	72069	38479
		Moulding Compound	Phenol Resin	Proprietary	4.847	mg	51478	27485
		Moulding Compound	Silica, vitreous	60676-86-0	82.043	mg	871305	465211
		Moulding Compound	Carbon-black	1333-86-4	0.485	mg	5148	2749

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