Tuya T3-E2 Module Specification

1. Product Overview

The T3-E2 is a low-power embedded Wi-Fi 6 and Bluetooth dual-mode module developed by Hangzhou Tuya Information Technology Co., Ltd. It is composed of a highly integrated wireless RF chip, the T3, and a small number of peripheral components. The module supports both AP and STA dual-role connections.

1.1. Features

• Integrated low-power 32-bit CPU, can serve as an application processor.
• Main frequency up to 320MHz.
• Operating voltage: 2.0V - 3.6V.
• Peripherals: 5x PWM, 3x UART, 1x SDIO, 1x I2C, 7x ADC, 1x SPI.
• Wi-Fi Connectivity: 802.11 b/g/n/ax.
• Supports channels 1-14 at 2.4GHz.
• Supports WEP, WPA/WPA2, WPA/WPA2 PSK (AES), and WPA3 security modes.
• 802.11b mode with maximum output power of +17dBm.
• Supports STA, AP, STA+AP, and Direct working modes.
• Supports both Bluetooth and AP pairing methods (including Android and iOS devices).
• Onboard PCB antenna with a peak gain of 1.73 dBi.
• Operating temperature: -40℃ to 105℃.
• Bluetooth Connectivity: Low-power Bluetooth v5.4 full standard.
• Bluetooth mode supports 6dBm transmit power.
• Integrated Bluetooth coexistence interface.
• Onboard PCB antenna with a peak gain of 1.73 dBi.

1.2. Application Areas

• Smart Building
• Smart Home / Appliances
• Smart Sockets, Smart Lights
• Industrial Wireless Control
• Baby Monitors
• Network Cameras
• Smart Public Transport

2. Module Interface

2.1. Dimensions and Package

The T3-E2 module dimensions are: 13.2±0.35mm (Width) × 16.6±0.35mm (Length) × 2.6±0.15mm (Height).

Bottom View Description: The module has a rectangular shape with pins arranged around the perimeter. An exposed area is visible in the center.

2.2. Pin Definition

Note: ADC input voltage level maximum is 3.25V; place a 100nF capacitor to ground near the ADC input. 'P' indicates a power pin, 'I/O' indicates an input/output pin. For MCU connection schemes, refer to the Tuya design document 'T3-X Series Module MCU Connection Design Guide'.

3. GPIO Function Multiplexing Table

For detailed usage, please refer to the SDK documentation.

* Indicates software not yet supported.

4. Electrical Parameters

4.1. Absolute Electrical Parameters

4.2. Normal Operating Conditions

4.3. RF Power Consumption

4.4. Operating Current

Notes: Low-power long-life standby current: typical 150μA @DTIM10. The data above is based on a 3.3V regulated power supply and firmware version v6.0.6. Test data may vary slightly under different test environments.

5. RF Parameters

5.1. Basic RF Characteristics

5.2. Wi-Fi Transmit Performance

5.3. Wi-Fi Receive Performance

5.4. Bluetooth Transmit Performance

5.5. Bluetooth Receive Performance

6. Antenna Information

6.1. Antenna Type

The T3-E2 antenna is an onboard PCB antenna.

6.2. Reducing Antenna Interference

When using the PCB onboard antenna on the Wi-Fi module, to ensure optimal Wi-Fi performance, it is recommended that the module's antenna area and other metal components be kept at least 15mm apart. For the user's PCB, avoid routing traces or applying copper plating in the antenna area to prevent interference with antenna performance.

7. Packaging Information and Production Guidance

7.1. Mechanical Dimensions

The T3-E2 PCB dimensions are: 13.2±0.35mm (Width) × 16.6±0.35mm (Length) × 0.8±0.1mm (Height).

Top View Description: The diagram shows the top view of the module with dimensions indicating the layout and antenna pattern.

7.2. Recommended Footprint

The diagram shows the recommended PCB footprint for the T3-E2 module, including precise dimensions and designated keep-out areas for traces and solder mask.

7.3. Production Guidance

1. Tuya recommends using SMT machines for module placement. Soldering should be completed within 24 hours after opening the package. If the package is not fully used, it is recommended to store it in a dry cabinet with humidity not exceeding 10% RH, or re-seal it in a vacuum bag and record the exposure time. Total exposure time should not exceed 168 hours.
2. SMT placement requires equipment such as: Pick-and-place machine, SPI, Reflow oven, Temperature profiler, AOI.
3. Baking requires equipment such as: Baking oven, Anti-static high-temperature trays.

7.4. Baking Parameters

Baking parameters are as follows:

• Baking Temperature: Reel packaging: 40℃, humidity ≤5% RH. Tray packaging: 125℃, humidity ≤5% RH (for high-temperature resistant trays, not blister trays).
• Baking Time: Reel packaging: 168 hours. Tray packaging: 12 hours.
• Alarm Temperature Setting: Reel packaging: 50℃. Tray packaging: 135℃.

Production can proceed after natural cooling to below 36℃. If the exposure time exceeds 168 hours after baking without use, re-bake the module. If the exposure time exceeds 168 hours without baking, it is not recommended to use reflow soldering for this batch of modules, as the module is a Level 3 moisture-sensitive device. Prolonged exposure may lead to moisture absorption, potentially causing device failure or poor soldering during high-temperature welding.

Ensure electrostatic discharge (ESD) protection for the module throughout the production process. To ensure product qualification, it is recommended to use SPI and AOI testing equipment to monitor solder paste printing and placement quality.

7.5. Recommended Reflow Curve

Set the temperature according to the reflow soldering curve diagram. The peak temperature is 245℃. The reflow temperature curve is shown below:

Reflow Curve Description:

• A: Temperature Axis
• B: Time Axis
• C: Liquidus Temperature: 217-220℃
• D: Ramp-up Rate: 1-3℃/S
• E: Soak Time: 60-120S, Soak Temperature: 150-200℃
• F: Time Above Liquidus: 50-70S
• G: Peak Temperature: 235-245℃
• H: Ramp-down Rate: 1-4℃/S

The recommended curve uses SAC305 solder paste as an example. For other solder pastes, follow the recommendations in the solder paste specification sheet.

8. Module MOQ and Packaging Information

8.1. Module MOQ and Packaging Information

9. Appendix: Statements

9.1. FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

9.2. Note

This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

9.3. Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

9.4. Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

9.5. Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

9.6. WEEE Directive

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the human body.