WBR3S User Manual
1 Product Overview
The WBR3S is a low-power embedded Wi-Fi+BT module developed by Tuya. It integrates a highly advanced wireless RF chip (RTL8720CS), several peripherals, an embedded Wi-Fi network protocol stack, a Bluetooth network protocol, and various library functions. The WBR3S features an embedded low-power 32-bit CPU, 512 KB of static random-access memory (SRAM), 4 MB of flash memory, and a rich set of peripherals. It operates as an RTOS platform, integrating all function libraries for Wi-Fi MAC and TCP/IP protocols, enabling the development of custom embedded Wi-Fi products.
1.1 Features
- CPU: Embedded low-power 32-bit CPU, capable of functioning as an application processor.
- Clock Rate: Maximum 200 MHz.
- Working Voltage: 3.0 V to 3.6 V.
- Peripherals: 8 GPIOs, 1 Universal Asynchronous Receiver/Transmitter (UART), and 1 Analog to Digital Converter (ADC).
-
Wi-Fi Connectivity:
- Standard: 802.11b/g/n 1x1 2.4 GHz.
- Channels: 1 to 14 at 2.4 GHz.
- Security: Supports WPA and WPA2 security modes.
- Output Power: Up to +17.5 dBm in 802.11b mode.
- Working Modes: Supports STA, AP, and STA+AP modes.
- Configuration: Supports SmartConfig and AP network configuration methods for Android and iOS devices.
- Antenna: Onboard PCB antenna with a gain of 1.7 dBi at 2.4 GHz.
- Working Temperature: -20°C to 85°C.
-
BT/BLE Connectivity:
- Standard: Supports BLE V5.0.
- Output Power: Up to +9 dBm (default output power is 7dBm).
- Antenna: PCB antenna with a gain of 1.7 dBi at 2.4 GHz (shared with Wi-Fi).
- Working Temperature: -20°C to 85°C.
1.2 Applications
- Intelligent building
- Smart household and home appliances
- Smart socket and light
- Industrial wireless control
- Baby monitor
- Network camera
- Intelligent bus
2 Electrical Parameters
2.1 Absolute Electrical Parameters
| Parameter | Description | Minimum Value | Maximum Value | Unit |
|---|---|---|---|---|
| Ts | Storage temperature | -20 | 85 | °C |
| VBAT | Power supply voltage | 3.0 | 3.6 | V |
| Static electricity voltage (human body model) | TAMB-25°C | - | 2 | KV |
| Static electricity voltage (machine model) | TAMB-25°C | - | 0.5 | KV |
2.2 Normal Working Conditions
| Parameter | Description | Minimum Value | Typical Value | Maximum Value | Unit |
|---|---|---|---|---|---|
| Ta | Working temperature | -20 | - | 85 | °C |
| VBAT | Power supply voltage | 3.0 | 3.3 | 3.6 | V |
| Parameter | Description | Minimum Value | Typical Value | Maximum Value | Unit |
|---|---|---|---|---|---|
| VIL | I/O low-level input | -0.3 | - | VCC*0.25 | V |
| VIH | I/O high-level input | VCC*0.75 | - | VCC | V |
| VOL | I/O low-level output | - | - | VCC*0.1 | V |
| VoH | I/O high-level output | VCC*0.8 | - | VCC | V |
| Imax | I/O drive current | - | - | 12 | mA |
4 RF Parameters
4.1 Basic RF Features
| Parameter | Description |
|---|---|
| Frequency band | 2.412~2.484GHz |
| Wi-Fi standard | IEEE 802.11b/g/n (Channels 1 to 14) |
| Data transmission rate | 802.11b: 1, 2, 5.5, or 11 (Mbit/s); 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s); 802.11n: HT20 MCS0 to MCS7; 802.11n: HT40 MCS0 to MCS7. |
| Antenna type | PCB antenna with a gain of 1.7 dBi at 2.4 GHz |
5 Antenna Information
5.1 Antenna Type
WBR3S uses only an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal Wi-Fi performance, it is recommended that the onboard PCB antenna be placed at least 15 mm away from other metal parts. To maintain antenna performance, the PCB should not be routed or clad with copper in the antenna area. Key layout considerations include:
- Ensure there is no substrate medium directly below or above the printed antenna.
- Ensure the area around the printed antenna is kept clear of metal copper skin to maximize the antenna's radiation effect.
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The WBR3S dimensions are 16mm (W) × 24mm (L) × 3.0mm (H).
6.2 Production Instructions
1. Use an SMT placement machine to mount the module onto the PCB within 24 hours after unpacking and firmware burning. If this timeframe is exceeded, vacuum pack the module again. Bake the module before mounting it onto the PCB.
A. SMT Placement Equipment:
- Reflow soldering machine
- Automated optical inspection (AOI) equipment
- Nozzle with a 6 mm to 8 mm diameter
B. Baking Equipment:
- Cabinet oven
- Anti-static heat-resistant trays
- Anti-static heat-resistant gloves
2. Storage conditions for a delivered module:
- The moisture-proof bag must be kept in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
- The shelf life of a dry-packaged product is 6 months from the date of packaging and sealing.
- The package contains a humidity indicator card (HIC).
3. Bake a module based on HIC status when unpacking:
- A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
- B. If the 30% circle is pink, bake the module for 4 consecutive hours.
- C. If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
- D. If the 30%, 40%, and 50% circles are blue, bake the module for 12 consecutive hours.
4. Baking settings:
- A. Baking temperature: 125±5°C
- B. Baking time: 130°C (Note: This value appears to be a temperature, not a duration, as per typical baking instructions.)
- C. SMT placement ready temperature after natural cooling: < 36°C
- D. The number of drying times: 1
- E. Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for more than 3 months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If solder pads are exposed to air for over 3 months, severe oxidation, dry joints, or solder skips may occur. Tuya is not liable for such issues.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of products for visual inspection and AOI before the first SMT placement to determine proper methods for controlling oven temperature and component placement. Inspect 5 to 10 modules from subsequent batches each hour.
6.3 Storage Conditions
CAUTION: This bag contains MOISTURE-SENSITIVE DEVICES.
- Calculated shelf life in sealed bag: 12 months at < 40°C and < 90% relative humidity (RH).
- Peak package body temperature: 260°C.
- After bag is opened, devices subjected to reflow solder or other high-temperature processes must be:
- a) Mounted within: 168 hours of factory conditions (≤ 30°C/60%RH), OR
- b) Stored at <10% RH.
- Devices require baking before mounting if:
- a) Humidity Indicator Card (HIC) is > 10% when read at 23 ± 5°C, OR
- b) Conditions 3a or 3b are not met.
- If baking is required, devices may be baked for 48 hrs. at 125 ± 5°C.
Note: If device containers cannot be subjected to high temperature or shorter bake times are desired, reference IPC/JEDEC J-STD-033 for bake procedure.
Bag Seal Date: [Field for date]
Note: Level and body temperature defined by IPC/JEDEC J-STD-020.
7 Appendix-Statement
FCC Caution
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously with other radios in a host system, except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required for operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Sub part B compliance testing with the modular transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got a FCC ID: 2ANDL-WBR3S. The final end product must be labeled in area with the following: "Contains Transmitter Module FCC ID: 2ANDL-WBR3S".
This device is intended only for OEM integrators under the following conditions:
- The antenna must be installed such that 20cm is maintained between the antenna and users.
- The transmitter module may not be co-located with any other transmitter or antenna.
Declaration of Conformity European notice
CE
Hangzhou Tuya Information Technology Co., Ltd hereby declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU and 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
Waste Electrical and Electronic Equipment (WEEE) Directive
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body.
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