Tuya T3-M-IPEX Module Datasheet

1. Product Overview

The T3-M-IPEX is a low-power embedded Wi-Fi 6 and Bluetooth dual-mode module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated wireless RF chip T3 and a few peripheral components. It supports both Access Point (AP) and Station (STA) dual-role connections.

1.1. Features

• Low-power 32-bit CPU, can also serve as an application processor.
• Supports a main frequency of 320 MHz.
• Operating voltage: 2.0V - 3.6V.
• Peripherals: 5x PWM, 2x UART, 1x ADC.
• Wi-Fi Connectivity:
  • 802.11 b/g/n/ax
  • Channels 1-14 @ 2.4GHz
  • Supports WEP, WPA/WPA2, WPA/WPA2 PSK (AES), and WPA3 security modes.
  • Maximum output power in 802.11b mode: +17dBm.
  • Supports STA, AP, STA + AP, and Direct working modes.
  • Supports two Wi-Fi and hotspot pairing methods (including Android and iOS devices).
  • Operating temperature: -40℃ to 105℃.
• Bluetooth Connectivity:
  • Full Bluetooth Low Energy v5.4 standard.
  • Supports Bluetooth Low Energy 1 Mbps, 2 Mbps, and Long Range modes (125 Kbps and 500 Kbps).
  • Bluetooth mode supports 6dBm transmit power.
  • Complete Bluetooth coexistence interface.

1.2. Application Fields

• Smart Buildings
• Smart Home / Appliances
• Smart Sockets, Smart Lighting
• Industrial Wireless Control
• Baby Monitors
• Network Cameras
• Smart Public Transportation

2. Module Interface

2.1. Package Dimensions

T3-M-IPEX dimensions: 13±0.35mm (W) × 12.5±0.35mm (L) × 3.75±0.15mm (H). The dimensions of the T3-M-IPEX are shown below:

Top View

Diagram showing the top view of the T3-M-IPEX module with dimensions:

• Overall Width: 13.00 mm
• Overall Length: 12.50 mm
• Component area width: 8.87 mm
• Component area length: 7.37 mm
• Pin pitch (first pin to second): 1.20 mm
• Pin pitch (second to third): 1.00 mm
• Pin pitch (third to fourth): 1.00 mm
• Total pin width: 11.40 mm
• Pin width: 0.80 mm
• Pin spacing: 2.00 mm
• Markings: T3-M-IPEX, CENP25P18P24P32

2.2. Pin Definition

Bottom View

Diagram showing the bottom view of the T3-M-IPEX module with pin labels:

Notes:

• The maximum input voltage for the ADC port is 3.25V. A voltage divider resistor using an MQ level is recommended. A 100nF capacitor for filtering should be placed close to the ADC.
• 'P' indicates a power pin, and 'I/O' indicates an input/output pin.
• For MCU interfacing solutions, refer to the Tuya design document "T3-X Series Module MCU Interfacing Design Guide".

3. Electrical Parameters

3.1. Absolute Electrical Parameters

3.2. Normal Operating Conditions

3.3. RF Power Consumption

3.4. Working Current

4. RF Parameters

4.1. Basic RF Characteristics

4.2. Wi-Fi Transmit Power

4.3. Wi-Fi Receive Sensitivity

4.4. Bluetooth Transmit Power

4.5. Bluetooth Receive Sensitivity

5. Antenna Information

5.1. Antenna Type

The T3-M-IPEX antenna uses an external antenna (3rd generation IPEX antenna connector).

5.2. Minimize Antenna Interference

To optimize Wi-Fi performance, it is recommended to keep the antenna area and other metal components at least 15mm away from the module. For the user's PCB, avoid routing or even covering copper in the antenna area to prevent affecting antenna performance.

6. Packaging Information and Production Guidelines

6.1. Mechanical Dimensions

T3-M-IPEX PCB dimensions: 13±0.35mm (W) × 12.5±0.35mm (L) × 3.75±0.15mm (H).

Diagram showing the top view of the T3-M-IPEX module with dimensions (repeated from Section 2.1 for clarity in this section).

• Overall Width: 13.00 mm
• Overall Length: 12.50 mm
• Component area width: 8.87 mm
• Component area length: 7.37 mm
• Pin pitch (first pin to second): 1.20 mm
• Pin pitch (second to third): 1.00 mm
• Pin pitch (third to fourth): 1.00 mm
• Total pin width: 11.40 mm
• Pin width: 0.80 mm
• Pin spacing: 2.00 mm
• Markings: T3-M-IPEX, CENP25P18P24P32

Side View

Diagram showing the side view of the module with tolerances:

• Unit: mm
• Module form factor tolerance: ±0.35mm
• PCB thickness tolerance: ±0.1mm
• Shield cover height tolerance: ±0.05mm

6.2. Recommended Footprint

Diagram showing the recommended footprint for the T3-M-IPEX module for SMT placement.

Diagram details:

• Pad dimensions and spacing are indicated.
• Total width: 11.70 mm

6.3. Production Guidelines

Tuya provides SMT or through-hole assembly options based on customer's PCB design. For SMT assembly, use the SMT process. For through-hole assembly, use the wave soldering process. After unpacking, modules should be soldered within 24 hours. If not, store them in a dry cabinet with humidity not exceeding 10% RH. The total exposure time should not exceed 168 hours.

(SMT Process) Instruments or Equipment Required for SMT Placement:

• Pick-and-place machine
• SPI (Solder Paste Inspection)
• Reflow soldering machine

(Wave Soldering Process) Instruments or Equipment Required for Wave Soldering:

• Wave soldering equipment
• Wave soldering fixture
• Temperature-controlled soldering iron
• Solder bars, solder wire, flux
• Furnace temperature tester

Instruments or Equipment Required for Baking:

• Cabinet type baking oven
• Anti-static high-temperature resistant tray
• Anti-static high-temperature resistant gloves

Tuya Module Storage Conditions:

• Moisture-proof bags must be stored in an environment with temperature <40℃ and humidity ≤90% RH.
• The shelf life of dried and packaged products is 12 months from the date of sealing.
• The sealed package contains a humidity indicator card.

Diagram of a humidity indicator card showing different levels (10%, 20%, 30%, 40%, 50%, 60%) and instructions for use.

Tuya modules require baking under the following conditions if moisture is suspected:

• The vacuum seal bag is found to be damaged before unpacking.
• The humidity indicator card is missing from the packaging bag after unpacking.
• The humidity indicator card shows a color reading of 10% or higher (pink color).
• Total exposure time after unpacking exceeds 168 hours.
• More than 12 months have passed since the initial sealing date.

Baking Parameters:

• Baking temperature: Reel packaging 40℃, humidity ≤5% RH. Tray packaging 125℃, humidity ≤5% RH (for high-temperature resistant trays, not for blister trays).
• Baking time: Reel packaging 168 hours, tray packaging 12 hours.
• Alarm temperature setting: Reel packaging 50℃, tray packaging 135℃.
• After cooling to 36℃ or below under natural conditions, production can proceed.

Important Notes during Production:

• If the exposure time after baking exceeds 168 hours and the module is not used, it must be baked again.
• If the exposure time exceeds 168 hours without baking, it is not recommended to use reflow or wave soldering for this batch of modules. Due to the module being a Level 3 moisture-sensitive device, exceeding the allowable exposure time may lead to moisture absorption, potentially causing device failure or poor soldering during high-temperature soldering.
• Throughout the entire production process, ensure electrostatic discharge (ESD) protection for the modules.
• To ensure product pass rates, it is recommended to use SPI and AOI testing equipment to monitor solder paste printing and placement quality.

6.4. Recommended Reflow Soldering Curve

According to the chosen process, SMT recommends reflow soldering curves, and wave soldering recommends wave soldering curves. The recommended reflow temperature is slightly different from the actual measured temperature. The temperatures shown below are actual measured temperatures.

Method 1: SMT Process (Recommended Reflow Soldering Curve for SMT)

Set the reflow temperature according to the reflow soldering curve requirements. The reflow temperature curve is shown below:

Diagram of a reflow soldering temperature curve with axes labeled:

• A: Temperature Axis
• B: Time Axis
• C: Liquidus temperature range: 217-220℃
• D: Preheat ramp rate: 1-3℃/S
• E: Preheating time: 60-120S, Preheating temperature range: 150-200°C
• F: Time above liquidus: 50-70S
• G: Peak temperature: 235-245°C
• H: Cooling ramp rate: 1-4℃/S

The recommended curve is based on SAC305 solder paste. For other solder pastes, set the reflow temperature according to the solder paste manufacturer's specifications.

Method 2: Wave Soldering Process (Wave Soldering Curve)

Set the wave soldering temperature according to the recommendations. The peak temperature is 260℃±5℃. The wave soldering temperature curve is shown below:

Diagram of a wave soldering process graph indicating different zones.

6.5. Storage Conditions

Warning: Moisture-Sensitive Device

The moisture-proof bag contains moisture-sensitive devices.

MSL Level: 3

If default, refer to the adjacent barcode label.

1. Calculated shelf life of the device in the sealed bag: 12 months under conditions of <40℃ and <90% relative humidity (RH).
2. Sealing date of the moisture-proof bag: Refer to the production date. If default, refer to the adjacent barcode label.
3. Peak package temperature: 260℃. If default, refer to the adjacent barcode label.
4. After opening the bag, devices to be used in reflow soldering or other high-temperature processes must be:
   • a) Mounted within 168 hours in a workshop environment ≤30°C/60% RH, or
   • b) Stored according to J-STD-033.
5. Before mounting, devices require baking if:
   • a) When read at 23±5°C, the humidity indicator card shows >10% for MSL 2a-5a level devices, or >60% for MSL 2 level devices.
   • b) Conditions in 3a or 3b above are not met.
6. If baking is required, refer to the baking procedures in IPC/JEDEC J-STD-033.

Note 1: IPC/JEDEC J-STD-020 specifies the MSL level and peak package temperature.

7. Module MOQ and Packaging Information

8. Appendix: Statements

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note

This device has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radio.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

CE

Hangzhou Tuya Information Technology Co., Ltd hereby declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU).

Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.