Data Sheet for the LTD-VL3020
Product: LTE Wireless Modem
Model name: LTD-VL3020
1. Overview
The LTD-VL3020 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support LTE Band 2, 4, 5, 13. This device acts as the vehicle's telematics system and connects to LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas.
In LTE mode (CAT4), the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data.
The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible.
2. Major Features
Category | Details | Specification |
---|---|---|
Mechanical | Dimensions | 34.0 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length: ±0.15 / height: ±0.2) |
Weight | Max. 10.6 grams | |
Interface | USB, general purpose I/O pins | |
Technology | Temperature* | Operation: -20 °C - +70 °C Storage: -40 °C - +85 °C |
Main chipset | MDM9628 | |
Memory | 4Gb(NAND) / 2Gb(SDRAM) | |
Standard (LTE) | DL Speed: 150 Mbps UL Speed: 50 Mbps |
|
Band | LTE B2, B4, B5, B13 | |
ETC | Power | LTE: Typ. 23dBm (Power Class 3) |
DC power | 4 V | |
Functions | Voice, data, SMS |
3. Interface
3.1 LGA Pad Layout (Top View)
The LGA Pad Layout is a detailed pin map. Due to its complexity, it is best represented by the pin descriptions provided in the following tables.
3.2 Pin Description
Antenna Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
C21 | MAIN_ANT | Input/Output | RF Main Antenna |
AC21 | DIV_ANT | Input | RF Diversity Antenna |
AE17 | GNSS_ANT | Input | GNSS Antenna |
User Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
H6 | ACC_PWR_ON | Input | ACC_PWR_ON |
I5 | BOOT_OK | Output | BOOT_OK |
H4 | MSG | Output | MSG |
G3 | 168H_END | Output | Remote standby mode end |
F20 | MAIN_ANT_DTC_EN | Output | Main ANT Detect Enable |
Z20 | DIV_ANT_DTC_EN | Output | Diversity ANT Detect Enable |
I7 | SPI_LEVEL_SHIFT_EN | Output | SPI LEVEL SHIFT Enable |
AD4 | ETHERNET_DCDC_ENABLE | Output | Ethernet power enable |
F6 | GPIO1 | Input/Output | General purpose I/O |
E5 | GPIO2 | Input/Output (Do not use with External PU) | General purpose I/O |
L6 | GPIO3 | Input/Output (Not support INTERRUPT) | General purpose I/O |
N6 | GPIO4 | Input/Output | General purpose I/O |
ADC Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
E19 | ADC1 | Input | ADC Convertor input for main antenna detect |
AA19 | ADC2 | Input | ADC Convertor input for diversity antenna detect |
PCM Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
W3 | PCM_EN | Output | PCM 3.3 Level Shifter Enable |
X2 | PCM_CLK | Input | PCM Clock |
W1 | PCM_SYNC | Input | PCM Frame Sync |
Y3 | PCM_DIN | Input | PCM Data In |
Y1 | PCM_DOUT | Output | PCM Data Out |
JTAG Pin Description
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
AC7 | MDM_JTAG_TMS | Input/Output | JTAG mode select input |
AD8 | MDM_JTAG_PS_HOLD | Input | JTAG PS HOLD detect |
AD6 | MDM_JTAG_TDI | Input | JTAG data input |
AE7 | MDM_JTAG_TRST_N | Input | JTAG reset for debug |
AB6 | MDM_JTAG_TDO | Output | JTAG debugging |
AB8 | MDM_JTAG_TCK | Input | JTAG clock input |
AE9 | MDM_JTAG_SRST_N | Input | JTAG reset |
USB Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
N2 | USB_HS_DM | Input/Output | USB high speed data (minus) |
M1 | USB_HS_DP | Input/Output | USB high speed data (plus) |
K1 | USB_VBUS | I | USB Power Supply |
L2 | USB_ID | Input | USB ID |
SDIO Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
S1 | SDC_CLK | Output | Secure digital controller clock |
Q1 | SDC_CMD | Output | Secure digital controller command |
T2 | SDC_DATA0 | Input/Output | Secure digital controller data bit 0 |
R2 | SDC_DATA1 | Input/Output | Secure digital controller data bit 1 |
S3 | SDC_DATA2 | Input/Output | Secure digital controller data bit 2 |
Q3 | SDC_DATA3 | Input/Output | Secure digital controller data bit 3 |
SGMII Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
AA11 | EPHY_RST_N or UIM2_RESET | Output | Ethernet PHY reset |
AE11 | EPHY_INT_N or UIM2_DETECT | Input | Ethernet PHY interrupt |
AB10 | SGMII_DATA or UIM2_CLK | Input/Output | SGMII input/Output data |
AD10 | GND | Ground | |
X10 | SGMII_RX_P | Input | SGMII receive - plus |
W11 | SGMII_RX_M | Input | SGMII receive -minus |
Z10 | SGMII_TX_M | Output | SGMII transmit - plus |
Y11 | SGMII_TX_P | Output | SGMII transmit -minus |
AC11 | SGMII_CLK or UIM2_DATA | Output | SGMII clock |
SPI Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
S5 | SPI_MOSI | Output | SPI Serial Output |
T6 | SPI_CLK | Output | SPI Serial Clock |
R6 | SPI_CS_N | Output | SPI Chip Select |
U5 | SPI_MISO | Input | SPI Serial input |
Q5 | SPI_INTERRUPT | Input | MICOM → LGA SPI interrupt |
UART Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
M5 | UART2_TX | Output | UART2 Transmit data |
N4 | UART2_RX | Input | UART2 Receive data |
K5 | UART1_TX | Output | Debug UART5 Transmit Data |
L4 | UART1_RX | Input | Debug UART5 Receive Data |
O5 | UART3_TX | Output | UART6 Transmit data |
P4 | UART3_RX | Input | UART6 Receive data |
USIM Interface Pads
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
I3 | UIM1_PRESENT | Input | Detection of an external UIM card |
H2 | UIM1_CLK | Output | Clock Output to an external UIM card |
E1 | UIM1_RESET | Output | Reset Output to an external UIM card |
G1 | UIM1_DATA | Input/Output | Data connection with an external UIM card |
F2 | VREG_L6_UIM1 | Output | Supply Output for an external UIM card |
E3 | GND | Ground | |
D2 | GND | Ground | |
A1 | GND | Ground | |
C1 | GND | Ground | |
B2 | GND | Ground |
HSIC Pin Description
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
AB2 | HSIC_DATA | Input/Output | HSIC data |
AC1 | HSIC_STB | Input/Output | HSIC Strobe signal |
AD2 | NC | No Connect | |
AE1 | NC | No Connect |
DSRC Pin Description
PAD | NAME | DIRECTION | DESCRIPTION |
---|---|---|---|
Y7 | COEX_UART_RX | Input | LTE receiver sync for coexistence with UART |
Z6 | COEX_UART_TX | Output | LTE transmitter sync for coexistence with UART |
X4 | RFCLK2_QCA | Output | Low noise RF clock Output |
AA3 | NC | Output | No Connect |
(Note: The tables above list various pin descriptions. The full set of GND pins is extensive and omitted for brevity in this transcription, but is available in the original document.)
3.3 USB
This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps.
Pin NO. | Signal Name | Pin I/O (Modem host) | Function Description |
---|---|---|---|
M1 | USB_D+ | IO | USB Differential data line (+) |
N2 | USB_D- | IO | USB Differential data line (-) |
K1 | USB_VBUS | I | USB Power Supply |
3.4 Audio
This module includes a PCM interface. The pull-up and pull-down resistors attached to these pins must provide more than 50 Kohm of resistance.
Pin NO. | Signal Name | Pin I/O (Modem host) | Function Description |
---|---|---|---|
W1 | PCM_SYNC | I | PCM Interface sync |
X2 | PCM_CLK | I | PCM Interface clock |
Y1 | PCM_TXD | O | PCM Interface digital audio data out |
Y3 | PCM_RXD | I | PCM Interface digital audio data in |
3.5 User Interface
Pin No. | Signal Name | Direction | Function |
---|---|---|---|
I5 | BOOT_OK | O | Indicates that the Modem boot is complete. |
C3 | RESET_IN | I | Control line to unconditionally restart the module. |
H4 | MSG | O | Indicates that the Modem receive Urgent message. |
G3 | 168H_END | O | Indicates that the 168hr sleep mode is end. |
H6 | ACC_ON_SLEEP | I | Control line to power on or 168hr sleep mode. |
A3 | Phone_ON | I | Control line to power on / off |
4. Electrical Specifications
4.1 Power Supply Specifications
The host system provides the power supply (VPH_PWR) DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the VPH_PWR. Therefore the VPH_PWR signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module.
Pin No. | Signal Name | Direction | MIN | TYP | MAX |
---|---|---|---|---|---|
A7,C7,B8,A9, B14,A15,B16, A17 | VPH_PWR (for PAM / for PMIC) | I | 3.9 V | 4 V | 4.1 V |
4.2 Logic Level Specifications
4.2.1 Digital Logic Level Specifications
Signal Name | Type | Low | High | Unit | ||
---|---|---|---|---|---|---|
Min | Max | Min | Max | |||
BOOT_OK | O | 0 | 0.45 | 1.35 | 1.8 | V |
RESET_IN | I | -0.3 | 0.63 | 1.17 | 1.8 | |
MSG | O | 0 | 0.45 | 1.35 | 1.8 | |
96H_END | O | 0 | 0.45 | 1.35 | 1.8 | |
ACC_ON_SLEEP | I | 0 | 0.63 | 1.17 | 1.8 |
5. RF Specifications
5.1 LTE
5.1.1 Receiver
- Bandwidth: 3GPP TS 36.521-1 Table 5.4.2.1-1
- Frequency: B2(1930~1990 MHz), B4(2110~2155 MHz), B5(869~894 MHz), B13(746~756 MHz)
- Modulation method: QPSK, 16QAM and 64QAM
- RX Sensitivity:
- B2, B5 (≤-94.3dBm @QPSK, BW: 10MHz)
- B4 (≤-96.3dBm @QPSK, BW: 10MHz)
- B13 (≤-93.3dBm @QPSK, BW: 10MHz)
5.1.2 Transmitter
- Frequency: B2(1850~1910 MHz), B4(1710~1755 MHz), B5(824~849 MHz), B13(777~787 MHz)
- Maximum RF Output: Power class 3, 20.3dBm ~ 25.7dBm max.
- Modulation method: QPSK and 16QAM
- Baseband to RF Direct conversion (Zero IF)
6. Mechanical Specifications
6.1 Environment Specifications
- Storage temp.: -40 °C - +85 °C
- Operating temp.: -20 °C - +70 °C
- (-20 °C - +70 °C : 3GPP specifications are satisfied)
- (-30 °C - -20 °C, +70 °C - +80 °C: May cause performance degradation)
- Operating humidity: 80% (60°C) relative humidity
6.2 Mechanical Dimensions
Category | Specification |
---|---|
Dimensions | 34.0 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length: ±0.15 / height: ±0.2) |
Weight | Max. 10.6 grams |
Figure 2. Mechanical dimension: A diagram illustrating the physical dimensions of the module.
7. General Specifications
7.1 LTE (B2, B4, B5, B13)
試驗 項目 (Test Item) | Spec. | Test Temperature | Frequency | TX Channel | |||
---|---|---|---|---|---|---|---|
Low | Mid. | High | |||||
Maximum Output Power(class 3) | 20.3~25.7dBm | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS | |
Frequency Error | ±0.1 ppm | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS | |
Error Vector Magnitude(EVM) | 12.5%↓ (16QAM, 50 RB) |
Normal | Low, Mid, High | PASS | PASS | PASS | |
Relative Carrier Leakage Power | Carrier Leakage (3.2dBm ± 3.2dB) |
-24.2 dBc | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS |
In-band emission | In-band emission (3.2dBm ± 3.2dB) |
-24.2 dBc | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS |
EVM equalizer spectrum flatness | EVM equalizer spectrum flatness Range 1 | 5.4 dB↓ | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS |
Spectrum emission mask | Spectrum Emission Mask upper/lower Area 1 | -16.5 dBm↓ | Normal | Low, Mid, High | PASS | PASS | PASS |
Spectrum Emission Mask upper/lower Area 2 | -8.5 dBm↓ | PASS | PASS | PASS | |||
Spectrum Emission Mask upper/lower Area 3 | -11.5 dBm↓ | PASS | PASS | PASS | |||
Spectrum Emission Mask upper/lower Area 4 | -23.5 dBm↓ | PASS | PASS | PASS | |||
Adjacent Channel Leakage Power Ratio (ACLR) | ACLR E-UTRA ± | -29.2dB↓ | Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS |
ACLR UTRA Offset 1 ± | -32.2dB↓ | PASS | PASS | PASS | |||
ACLR UTRA Offset 2 ± | -35.2dB↓ | PASS | PASS | PASS | |||
Reference Sensitivity Level @ 10MHz | Ref Sense throughput shall be ≥ 95% | ≤-96.3dBm (B4) ≤-93.3dBm (B13) ≤-94.3dBm (B2, B5) @QPSK, BW: 10MHz Rx Chain-Dual |
Normal, Temp L, Temp H | Low, Mid, High | PASS | PASS | PASS |
[CTO] symbol noted in Maximum Output Power and Reference Sensitivity Level sections.
8. RFx Information
The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use.
Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting.
This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions: (1) this module does not cause interference, (2) this module accepts any interference that may cause undesired operation.
8.1 Information for the Integrator
The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter.