Data Sheet for the LTD-VL3020

Product: LTE Wireless Modem

Model name: LTD-VL3020

1. Overview

The LTD-VL3020 is a personal mobile communication device that incorporates the latest compact radio technology, including smaller and lighter components and support LTE Band 2, 4, 5, 13. This device acts as the vehicle's telematics system and connects to LTE wireless networks and wireless modules to allow voice and data communication. Furthermore, this device can operate on land and water as well as other similar areas.

In LTE mode (CAT4), the device provides uplink speeds of up to 50 Mbps and downlink speeds of up to 150 Mbps for seamless transfer of data such as movies and video calls. The device also supports the transfer of large amounts of data.

The device communicates with the host system via a standard RS-232 or USB port, and AT commands and control commands can be used to send data. Voice calls are also possible.

2. Major Features

Category Details Specification
Mechanical Dimensions 34.0 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length: ±0.15 / height: ±0.2)
Weight Max. 10.6 grams
Interface USB, general purpose I/O pins
Technology Temperature* Operation: -20 °C - +70 °C
Storage: -40 °C - +85 °C
Main chipset MDM9628
Memory 4Gb(NAND) / 2Gb(SDRAM)
Standard (LTE) DL Speed: 150 Mbps
UL Speed: 50 Mbps
Band LTE B2, B4, B5, B13
ETC Power LTE: Typ. 23dBm (Power Class 3)
DC power 4 V
Functions Voice, data, SMS

3. Interface

3.1 LGA Pad Layout (Top View)

The LGA Pad Layout is a detailed pin map. Due to its complexity, it is best represented by the pin descriptions provided in the following tables.

3.2 Pin Description

Antenna Interface Pads

PAD NAME DIRECTION DESCRIPTION
C21MAIN_ANTInput/OutputRF Main Antenna
AC21DIV_ANTInputRF Diversity Antenna
AE17GNSS_ANTInputGNSS Antenna

User Interface Pads

PAD NAME DIRECTION DESCRIPTION
H6ACC_PWR_ONInputACC_PWR_ON
I5BOOT_OKOutputBOOT_OK
H4MSGOutputMSG
G3168H_ENDOutputRemote standby mode end
F20MAIN_ANT_DTC_ENOutputMain ANT Detect Enable
Z20DIV_ANT_DTC_ENOutputDiversity ANT Detect Enable
I7SPI_LEVEL_SHIFT_ENOutputSPI LEVEL SHIFT Enable
AD4ETHERNET_DCDC_ENABLEOutputEthernet power enable
F6GPIO1Input/OutputGeneral purpose I/O
E5GPIO2Input/Output (Do not use with External PU)General purpose I/O
L6GPIO3Input/Output (Not support INTERRUPT)General purpose I/O
N6GPIO4Input/OutputGeneral purpose I/O

ADC Interface Pads

PAD NAME DIRECTION DESCRIPTION
E19ADC1InputADC Convertor input for main antenna detect
AA19ADC2InputADC Convertor input for diversity antenna detect

PCM Interface Pads

PAD NAME DIRECTION DESCRIPTION
W3PCM_ENOutputPCM 3.3 Level Shifter Enable
X2PCM_CLKInputPCM Clock
W1PCM_SYNCInputPCM Frame Sync
Y3PCM_DINInputPCM Data In
Y1PCM_DOUTOutputPCM Data Out

JTAG Pin Description

PAD NAME DIRECTION DESCRIPTION
AC7MDM_JTAG_TMSInput/OutputJTAG mode select input
AD8MDM_JTAG_PS_HOLDInputJTAG PS HOLD detect
AD6MDM_JTAG_TDIInputJTAG data input
AE7MDM_JTAG_TRST_NInputJTAG reset for debug
AB6MDM_JTAG_TDOOutputJTAG debugging
AB8MDM_JTAG_TCKInputJTAG clock input
AE9MDM_JTAG_SRST_NInputJTAG reset

USB Interface Pads

PAD NAME DIRECTION DESCRIPTION
N2USB_HS_DMInput/OutputUSB high speed data (minus)
M1USB_HS_DPInput/OutputUSB high speed data (plus)
K1USB_VBUSIUSB Power Supply
L2USB_IDInputUSB ID

SDIO Interface Pads

PAD NAME DIRECTION DESCRIPTION
S1SDC_CLKOutputSecure digital controller clock
Q1SDC_CMDOutputSecure digital controller command
T2SDC_DATA0Input/OutputSecure digital controller data bit 0
R2SDC_DATA1Input/OutputSecure digital controller data bit 1
S3SDC_DATA2Input/OutputSecure digital controller data bit 2
Q3SDC_DATA3Input/OutputSecure digital controller data bit 3

SGMII Interface Pads

PAD NAME DIRECTION DESCRIPTION
AA11EPHY_RST_N or UIM2_RESETOutputEthernet PHY reset
AE11EPHY_INT_N or UIM2_DETECTInputEthernet PHY interrupt
AB10SGMII_DATA or UIM2_CLKInput/OutputSGMII input/Output data
AD10GNDGround
X10SGMII_RX_PInputSGMII receive - plus
W11SGMII_RX_MInputSGMII receive -minus
Z10SGMII_TX_MOutputSGMII transmit - plus
Y11SGMII_TX_POutputSGMII transmit -minus
AC11SGMII_CLK or UIM2_DATAOutputSGMII clock

SPI Interface Pads

PAD NAME DIRECTION DESCRIPTION
S5SPI_MOSIOutputSPI Serial Output
T6SPI_CLKOutputSPI Serial Clock
R6SPI_CS_NOutputSPI Chip Select
U5SPI_MISOInputSPI Serial input
Q5SPI_INTERRUPTInputMICOM → LGA SPI interrupt

UART Interface Pads

PAD NAME DIRECTION DESCRIPTION
M5UART2_TXOutputUART2 Transmit data
N4UART2_RXInputUART2 Receive data
K5UART1_TXOutputDebug UART5 Transmit Data
L4UART1_RXInputDebug UART5 Receive Data
O5UART3_TXOutputUART6 Transmit data
P4UART3_RXInputUART6 Receive data

USIM Interface Pads

PAD NAME DIRECTION DESCRIPTION
I3UIM1_PRESENTInputDetection of an external UIM card
H2UIM1_CLKOutputClock Output to an external UIM card
E1UIM1_RESETOutputReset Output to an external UIM card
G1UIM1_DATAInput/OutputData connection with an external UIM card
F2VREG_L6_UIM1OutputSupply Output for an external UIM card
E3GNDGround
D2GNDGround
A1GNDGround
C1GNDGround
B2GNDGround

HSIC Pin Description

PAD NAME DIRECTION DESCRIPTION
AB2HSIC_DATAInput/OutputHSIC data
AC1HSIC_STBInput/OutputHSIC Strobe signal
AD2NCNo Connect
AE1NCNo Connect

DSRC Pin Description

PAD NAME DIRECTION DESCRIPTION
Y7COEX_UART_RXInputLTE receiver sync for coexistence with UART
Z6COEX_UART_TXOutputLTE transmitter sync for coexistence with UART
X4RFCLK2_QCAOutputLow noise RF clock Output
AA3NCOutputNo Connect

(Note: The tables above list various pin descriptions. The full set of GND pins is extensive and omitted for brevity in this transcription, but is available in the original document.)

3.3 USB

This device supports universal serial bus (USB) connections for high-speed data communication. The relevant hardware satisfies the USB 2.0 specifications and supports maximum communications speeds of 480 Mbps.

Pin NO. Signal Name Pin I/O (Modem host) Function Description
M1USB_D+IOUSB Differential data line (+)
N2USB_D-IOUSB Differential data line (-)
K1USB_VBUSIUSB Power Supply

3.4 Audio

This module includes a PCM interface. The pull-up and pull-down resistors attached to these pins must provide more than 50 Kohm of resistance.

Pin NO. Signal Name Pin I/O (Modem host) Function Description
W1PCM_SYNCIPCM Interface sync
X2PCM_CLKIPCM Interface clock
Y1PCM_TXDOPCM Interface digital audio data out
Y3PCM_RXDIPCM Interface digital audio data in

3.5 User Interface

Pin No. Signal Name Direction Function
I5BOOT_OKOIndicates that the Modem boot is complete.
C3RESET_INIControl line to unconditionally restart the module.
H4MSGOIndicates that the Modem receive Urgent message.
G3168H_ENDOIndicates that the 168hr sleep mode is end.
H6ACC_ON_SLEEPIControl line to power on or 168hr sleep mode.
A3Phone_ONIControl line to power on / off

4. Electrical Specifications

4.1 Power Supply Specifications

The host system provides the power supply (VPH_PWR) DC 4 V, 2.5 A to the device. The internal power supply module manages the power supplied to the integral circuits and maintains constant voltages. This module also controls each power block to minimize power consumption. In particular, the PAM (power amplifier module) consumes a lot of power, so it receives a direct power supply of 4 V from the VPH_PWR. Therefore the VPH_PWR signal inputs only the supply power of the PAM, even when the absolute rating is higher. In addition, the entire power input module blocks and protects against high surges and ESD in the NAD module.

Pin No. Signal Name Direction MIN TYP MAX
A7,C7,B8,A9, B14,A15,B16, A17 VPH_PWR (for PAM / for PMIC) I 3.9 V 4 V 4.1 V

4.2 Logic Level Specifications

4.2.1 Digital Logic Level Specifications

Signal Name Type Low High Unit
Min Max Min Max
BOOT_OKO00.451.351.8V
RESET_INI-0.30.631.171.8
MSGO00.451.351.8
96H_ENDO00.451.351.8
ACC_ON_SLEEPI00.631.171.8

5. RF Specifications

5.1 LTE

5.1.1 Receiver

5.1.2 Transmitter

6. Mechanical Specifications

6.1 Environment Specifications

6.2 Mechanical Dimensions

Category Specification
Dimensions 34.0 x 40.0 x 3.5 mm (L x W x T) (Tolerance – width, length: ±0.15 / height: ±0.2)
Weight Max. 10.6 grams

Figure 2. Mechanical dimension: A diagram illustrating the physical dimensions of the module.

7. General Specifications

7.1 LTE (B2, B4, B5, B13)

試驗 項目 (Test Item) Spec. Test Temperature Frequency TX Channel
Low Mid. High
Maximum Output Power(class 3) 20.3~25.7dBm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Frequency Error ±0.1 ppm Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Error Vector Magnitude(EVM) 12.5%↓
(16QAM, 50 RB)
Normal Low, Mid, High PASS PASS PASS
Relative Carrier Leakage Power Carrier Leakage
(3.2dBm ± 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
In-band emission In-band emission
(3.2dBm ± 3.2dB)
-24.2 dBc Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
EVM equalizer spectrum flatness EVM equalizer spectrum flatness Range 1 5.4 dB↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
Spectrum emission mask Spectrum Emission Mask upper/lower Area 1 -16.5 dBm↓ Normal Low, Mid, High PASS PASS PASS
Spectrum Emission Mask upper/lower Area 2 -8.5 dBm↓ PASS PASS PASS
Spectrum Emission Mask upper/lower Area 3 -11.5 dBm↓ PASS PASS PASS
Spectrum Emission Mask upper/lower Area 4 -23.5 dBm↓ PASS PASS PASS
Adjacent Channel Leakage Power Ratio (ACLR) ACLR E-UTRA ± -29.2dB↓ Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS
ACLR UTRA Offset 1 ± -32.2dB↓ PASS PASS PASS
ACLR UTRA Offset 2 ± -35.2dB↓ PASS PASS PASS
Reference Sensitivity Level @ 10MHz Ref Sense throughput shall be ≥ 95% ≤-96.3dBm (B4)
≤-93.3dBm (B13)
≤-94.3dBm (B2, B5)
@QPSK, BW: 10MHz
Rx Chain-Dual
Normal, Temp L, Temp H Low, Mid, High PASS PASS PASS

[CTO] symbol noted in Maximum Output Power and Reference Sensitivity Level sections.

8. RFx Information

The strength of the RF field produced by the wireless module or modules embedded in the TCU is well within all international RF exposure limits known at this time. Because the wireless modules embedded in the TCU emit less than the maximum amount of energy permitted in radio frequency safety standards and recommendations, the manufacturer believes these modules are safe for use.

Regardless of the power levels, care should be taken to minimize human contact during normal operation. This module should be remain more than 20 cm (8 inches) from the body when wireless devices are on and transmitting.

This transmitter must not be collocated or operated in conjunction with any other antenna or transmitter. Operation is subject to the following two conditions: (1) this module does not cause interference, (2) this module accepts any interference that may cause undesired operation.

8.1 Information for the Integrator

The integrator must not provide information to the end user regarding how to install or remove this RF module in the user manual of the end product. The user manual that is provided by the integrator for end users must include the following information in a prominent location. To comply with FCC RF exposure requirements, the antenna used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operated in conjunction with any other antenna or transmitter.

Models: VL3020, YZP-VL3020, YZPVL3020, LTD-VL3020 LTE Wireless Modem, LTE Wireless Modem

File Info : application/pdf, 20 Pages, 566.13KB

PDF preview unavailable. Download the PDF instead.

GetApplicationAttachment.html?id=5143498 Microsoft PowerPoint 2010

Related Documents

Preview LG Innotek WL1SB21 Wireless Audio Module User Manual
Comprehensive user manual for the LG Innotek WL1SB21, a compact and low-power wireless audio module. This document details features, technical specifications, operating conditions, pin descriptions, outline drawings, packing information, and regulatory compliance statements for FCC and ISED.
Preview LG Innotek 4PPoE WLAN Bridge Manual - ETPFFRPP01
User manual for the LG Innotek ETPFFRPP01 4PPoE WLAN Bridge, detailing its appearance, button/LED descriptions, installation guide, and FCC/ISED statements.
Preview LG Innotek JLR EBA31 Wireless CSC & WGM Technical Specifications
Technical specifications for the LG Innotek JLR EBA31 Wireless CSC & WGM, a Slave RF Communication Module for wBMS. Details include introduction, operating environments for CSC and WGM, FCC/IC compliance, application, quality, appearance, maximum ratings, mechanical dimensions, general features, pin configuration, block diagram, and reference circuit.
Preview LG Innotek WL1NB6V2 Wireless Audio Module User Manual
User manual for the LG Innotek WL1NB6V2 Wireless Audio Module, detailing features, specifications, block diagram, operating conditions, interface, pin descriptions, outline drawing, packing information, and regulatory compliance details.
Preview LG Innotek ETGFFRBU01 Wi-Fi Dongle User Manual
User manual for the LG Innotek ETGFFRBU01 Wi-Fi Dongle, detailing features, specifications, operating conditions, pin descriptions, outline drawings, and compliance information.
Preview LG Innotek ETGBBTBP01 Blue Adapter User Manual
User manual for the LG Innotek ETGBBTBP01 Blue Adapter, detailing its features, specifications, pin descriptions, and regulatory compliance.
Preview LG Innotek LGD521 Dashcam User Manual
This user manual provides comprehensive instructions for the LG Innotek LGD521 dashcam, covering safety precautions, product specifications, installation, operation, and troubleshooting.