JLR EBA31 Wireless CSC & WGM
Product Name: Slave RF Communication Module for wBMS
Model Name: APBR000L02.KM00
Customer P/N: 8MDW00004A
1. Introduction
The CSC and its WGM are an integral part of the JLR scalable Battery Management System (BMS), which enables rapid and efficient re-application of proven High Voltage (HV) systems to support future electrification strategy.
- The CSC measures voltage across every series-connected cell and measures temperature at different locations within the cell stack. The CSC is also responsible to perform charge balancing to maximize the battery's energy storage and mitigate the effects of cell self-discharge.
- All CSC's communicate with the WGM using a dedicated wireless network.
- The WGM in turn communicates with the BMCM via 2 (two) twisted-pair isolated SPI channels.
- The CSC has an on-board temperature sensor to monitor CSC temperatures generated by balancing resistor heat dissipation.
- Temperature and voltage measurements are taken by the CSC and measures are taken across every bank of parallel cells and temperature sensors.
- Voltage sense wires are also used for the balancing currents.
2. CSC Operating Environment
| Entry | Customer Requirements (Specifications) | Design Specification | Remarks |
|---|---|---|---|
| 1)Operating temperature range | -40~+85°C Ambient | -40~+105°C Ambient | AEC – Q Component Usage, Accelerated Test Confirmation |
| 2) Storage temperature range | -40 ~ +85°C | -40~+105°C Ambient | AEC – Q Component Usage |
| 3)Standard use | -40~+85°C | -40~+105°C Ambient | AEC-Q Component Usage |
| 7)Use power range | HV Battery: 12.5V ~ 49.5V | HV Battery: 11V ~ 80V | |
| 8)Maximum applied power supply | HV Battery: 0~66V | HV Battery: 0V ~ 85V | |
| 9)Other Terms of Use | 2 BMIC with dedicated connection Wireless communication | Isolated 2 Bank Circuits RF module with PCB antenna | Securing the separation distance between banks in the PCB (5mm at minimum) |
| 10)Product lifespan | 10 years (87600 hours) | 10 years (87600 hours) | RF Battery Simulation for MLA, EMA, JEA Pack AEC_Q Verification through component use and reliability testing (long term) |
| 11) Location / Place of use | Inside the Vehicle Battery Pack | Inside the Vehicle Battery Pack | Customer Requirement: IP30 |
3. WGM Operating Environment
| Entry | Customer Requirements (Specifications) | Design Specification | Remarks |
|---|---|---|---|
| 1)Operating temperature range | -40~+85°C Ambient | -40~+105°C Ambient | AEC – Q Component Usage, Accelerated Test Confirmation |
| 2) Storage temperature range | -40 ~ +85°C | -40~+105°C Ambient | AEC – Q Component Usage |
| 3)Standard use | -40~+85°C | -40~+105°C Ambient | AEC – Q Component Usage |
| 7)Use power range | LV INPUT: 5V+/-0.125 | LV INPUT: 5V+/-0.125 | |
| 8)Maximum applied power supply | LV INPUT: 5V+/-0.125 | HV Battery: 4.21 ~ 8V | |
| 9)Other Terms of Use | Dual Manager Wireless communication | 2 X RF module application RF module with PCB antenna | RF Battery Simulation for MLA, EMA, JEA Pack AEC_Q Verification through component use and reliability testing (long term) |
| 10)Product lifespan | 10 years (87600 hours) | 10 years (87600 hours) | Customer Requirement: IP30 and IP69K support |
| 11) Location / Place of use | Inserted into an opening provided on the battery lid | Inserted into an opening provided on the battery lid |
4. FCC/IC Compliance Statement
This device complies with Part 15 of the FCC Rules and Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
CAUTION: Any Changes or modifications not expressly approved by the manufacturer could void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
A minimum separation distance of 20 cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements.
Industry Canada (IC) Statement
Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement.
Tout changement ou modification non expressement approuve par la partie chargee de la mise en conformite peut annuler le droit de l'utilisateur a utiliser l'equipement.
Une distance de séparation minimale de 20 cm doit être maintenue entre l'antenne et la personne pour que cet appareil satisfasse aux exigences d'exposition aux RF
Table of Contents
- Application
- Quality
- Appearance and Characteristics
- Application of Bluetooth Low Power module
- Maximum Rating
- Test
- Marking Information
- Mechanical Dimension
- General Features
- Electrical Specification
- Pin Configuration
- Reliability Test Conditions
- Block Diagram
- Reference Circuit
- Packing Information
- Reflow Profile
- RoHS Compliance
- Ordering Information
1. Application
This specification is applied to Wireless communication between the Battery cell monitoring Module and the Battery management system controller.
2. Quality
Quality should meet each condition which mentioned on this specification. However, the items which are not mentioned on this specification follow the inspection agreements and standards which are agree with both companies.
3. Appearance and Characteristics
- Appearance: Appearance should not be contaminated by harmful materials and should not have cracks etc. Mechanical dimensions should meet the contents of clause 8.
- Characteristics: Electrical characteristics should meet the contents of clause 10.
4. Application of Bluetooth Low Power module
- Wireless battery management systems
5. Maximum Rating
| PARAMETER | MIN | MAX | UNIT |
|---|---|---|---|
| Temperature, Junction Range | -40 | +115 | °C |
| Temperature, Storage Range, Ambient | -40 | +125 | °C |
| Operational temperature range | -40 | +85 | °C |
| Supply voltage VDD | 3.135 | 3.465 | V |
8. Mechanical Dimension
1) Module Dimension
The module package is LGA (Land Grid Array) type.
Diagram Description: A diagram showing the top and side views of the LGA module. Key dimensions are labeled: W, L1, L2, T1, T2, W1, W2, c1, c2, a1, a2, a3, b1, b2. A table provides the numerical values for these dimensions in millimeters.
| Mark | Dimension | Mark | Dimension | Mark | Dimension | Mark | Dimension | Mark | Dimension |
|---|---|---|---|---|---|---|---|---|---|
| a1 | 0.60±0.05 | a2 | 1.20±0.1 | a3 | 1.20±0.1 | b1 | 3.25±0.1 | b2 | 0.20±0.05 |
| c1 | 2.20±0.1 | c2 | 6.22±0.1 | L1 | 15.5 - 0.15/+0.3 | L2 | 14.7±0.1 | W | 23.9 - 0.15/+0.3 |
| W1 | 19.2±0.1 | W2 | 4.30±0.1 | T1 | 2.10±0.1 | T2 | 1.0±0.1 |
Notices:
- If the module attached to the set board is flipped during the reflow process, the shield case of the module may detach or fall apart.
- Bur on the router bride surface is allowed up to -0.15 (Without copper foil) +0.6.
2) Recommended Land Pattern
Diagram Description: A top view diagram illustrating the recommended land pattern for the module on a PCB. It shows the overall dimensions (15.5000 x 23.9) and the placement of pads, including an "ANTENNA AREA" marked in red. Dimensions for pad spacing and size are indicated. The stencil recommendation is 90% of PCB LAND.
Key Design Guide: The larger copper cut area is better.
3) Recommended module position
Diagram Description: A diagram illustrating the recommended placement of the module on a main board. It shows a green rectangular area representing the module's recommended position, with dashed red circles indicating areas to avoid copper. Text labels indicate "Edge position is better than center to obtain antenna radiation performance" and "Recommended position". A side view diagram shows a minimum distance of 6mm from the module edge to the ground area on the main board.
Key design guide:
- Distance of module edge is minimum 6mm from ground area in main board.
- Must have no copper plate around antenna position for all layers.
- Do not routing any of power and clock signal under Module digital path.
Additional Note: Don't set any metal case at above of module (chassis or button, PCB). Bottom case is same, but it is ok for plastic mold.
Note: The minimum distance may vary depending on the set environmental conditions. The larger open area is better.
9. General Features
9.1 RF Module for wBMS
ADRF Chipset Features:
- Low Power 2.4GHz radio
- RF frequency range: 2400MHz to 2483.5 MHz ISM band
- 1Mbps data rate options
- Transmit output power: +8dBm
- On-chip temperature sensor
- On-chip LDO power
- Integrated RF match
- Integrated transmit and receive switch
- Microcontroller with a memory protection unit (MPU)
- Secure JTAG port supporting code download
Security:
- Hardware root of trust
- Secure boot
- Secure update with roll-back protection
- Hardware accelerator supporting AES-128, AES-256, ECC-256, and SHA-256
- True random number generator (TRNG)
Memory:
- SRAM with SECDED ECC
- Flash with SECDED ECC
- ROM with SECDED ECC
- Anti-fuse OTP
Interfaces:
- SPI x 2
- GPIO ports
- UART x 2
- On-chip POR
11. Pin Configuration
Diagram Description: A diagram showing the top view of the module with pin numbers indicated. It illustrates the physical layout of the 40 pins.
| No. | Pin Name | I/O | Description |
|---|---|---|---|
| 1 | GND | Ground | |
| 2 | SPI2_MISO | I | SPI2 MISO for BMIC |
| 3 | SPI2_SCK | I | SPI2 SCK for BMIC |
| 4 | SPI2_CS | I | SPI2 CS for BMIC |
| 5 | SPI2_MOSI | O | SPI2 MOSI for BMIC |
| 6 | GND | GND | |
| 7 | SPI1_MISO | I | SPI1 MISO for Master MCU |
| 8 | SPI1_SCK | I | SPI1 SCK for Master MCU |
| 9 | SPI1_CS | I | SPI1 CS for Master MCU |
| 10 | SPI1_MOSI | O | SPI1 MOSI for Master MCU |
| 11 | GND | Ground | |
| 12 | SPIO_MOSI | O | Serial DATA OUT |
| 13 | SPIO_MISO | I | Serial DATA IN |
| 14 | GND | GND | |
| 15 | SPIO_SCK | I | Pull-up during Reset to enter Secure debug area |
| 16 | SPIO_CS | I | Chip Select |
| 17 | GND | GND | |
| 18 | UART1_RX | I/O | UART Rx Interface to Manufacturing Test Firmware |
| 19 | UART1_TX | I/O | UART Tx Interface to Manufacturing Test Firmware |
| 20 | GPIO9 | I/O | General-Purpose Input and Output |
| 21 | ADC1_IO | I | Analog Input |
| 22 | ADC2_IO | I | Analog Input |
| 23 | GND | Ground | |
| 24 | VDD | I | 3.3 Supply input |
| 25 | VDD | I | 3.3 Supply input |
| 26 | GND | GND | |
| 27 | /RESET | I | Hardware Reset |
| 28 | JTAG_TDI | I | JTAG Data In. |
| 29 | JTAG_TCK | I | JTAG Clock |
| 30 | JTAG_TMS | I/O | JTAG Mode Selection |
| 31 | JTAG_TDO | O | JTAG Trace Data Output |
| 32 | GPIO0 | I/O | General-Purpose Input and Output |
| 33 | UARTO_TX | I/O | Wired Manager to Manager Interface |
| 34 | UARTO_RX | I/O | Wired Manager to Manager Interface |
| 35 | GPIO1 | I/O | General-Purpose Input and Output |
| 36 | GND | GND | |
| 37 | GND | GND | |
| 38 | GND | GND | |
| 39 | GND | GND | |
| 40 | GND | GND |
13. Block Diagram
Diagram Description: A block diagram illustrating the RF Based BLE ADRF8801 module. It shows the module connected to a 2.4GHz Antenna via a BPF (Band Pass Filter). Internal connections to the ADRF8801 chip include VDD_3V3, SPI x 2, UART x 2, GPIO x3, ADC x2, JTAG Debug, and RESET. A 40MHz Crystal is also shown connected to the module.
14. Reference Circuit (Slave)
Diagram Description: A schematic diagram showing a typical reference circuit for the module. It depicts the module (labeled WBMS-ADRF88**) connected to external components such as resistors (e.g., R2, R5, R8, R13, R15, R19, R31, R32, R33), capacitors (e.g., C1, C2, C3), and an antenna. Various pins of the module are shown connected to these components and to ground (GND) or power (VDD) rails. The diagram includes labels for interfaces like SPI, UART, GPIO, ADC, and JTAG.
