Trenz Electronic TEB0835 Carrier Board Schematics

This document provides a comprehensive overview of the schematics for the Trenz Electronic TEB0835 carrier board.

Variant A Compatibility

Variant A of the TEB0835 carrier board is compatible with modules that have a VIN (Voltage Input) of 5V ±10%.

Revision History

The following table details the revisions made to the TEB0835 carrier board schematics:

REV	Description
-01	Initial revision.
-02	All module's mount holes are connected to GND. CLK_Connectors: Added baluns for each clock input. Internal DSPLL is changed on SI5395A-A-GM. Added ability to use internal DSPLL as a source for each clock. Added clock inputs CLKIN1, CLKIN2 and clock outputs OUT1, OUT2 connected to DSPLL. All clock traces are matched with tolerance 0.2 mm. Lengths of inputs ADC0, ADC2, ADC4, ADC6 are matched with tolerance 0.2 mm. Lengths of outputs DACO and DAC2 are matched with tolerance 0.2 mm. Lengths of outputs DAC4, DAC5, DAC6, DAC7 are matched with tolerance 0.2 mm. In REV02: FTDI is powered from 3.3V_Module. Signal PLL_INTR_N is removed. Signal BOARD_PG is renamed to MODULE_PG. Added ability to select enable signal for internal DC-DCs 3.3V and 1.8V. Added JTAG connector J40. Added VBAT schematic. Added a holder for CR1220 3V battery. Resistor R4 changed to 10K (was 1K).
-03	Added "Legal Notices" page. Added "Power Diagram" page. Added "Clock Diagram" page. Page "TEB0835" updated: Added a table of I2C Slaves; Added PCIe-bracket MECH1; Added four plastic standoffs MP1-MP4 (D01468). Page "ADC_Input_Connectors_1" updated: Connector designators changed (J1→XS1, etc.); RF connector types changed (SMA→SMP); Balun designators changed; Balun types changed; Resistors changed; Net names changed; Added mech part Shield1 (3670412). Page "ADC_Input_Connectors_2" updated: Connector designators changed; RF connector types changed; Balun designators changed; Balun types changed; Resistors changed; Net names changed. Page "DAC_Output_Connectors_1" updated: Connector designators changed; RF connector types changed; Balun designators changed; Balun types changed; Net names changed; Resistors changed; Added mech part Shield2 (3670412). Page "DAC_Output_Connectors_2" updated: Connector designators changed; RF connector types changed; Balun designators changed; Balun types changed; Net names changed; Resistors changed. Page "CLK_Connectors_1" updated: Resistors changed; Connector type changed (J36); Added RFSOC PL synchronization schemes; Added RFSoC Module PLL synchronization. Page "CLK_Connectors_2" updated: Connector types changed; Added synchronization schemes for external clocks. Page "B2B_JB1" updated: Connector designator changed; Module power rail renamed; Added TP33. Page "B2B_JB2" updated: Connector designator changed; Pins 1 and 2 connected to GND; Various clock and signal connections added/modified; Schematic of battery supply changed; Status LEDs renamed and moved; Resistors changed; Added terminators on clock outputs. Page "POWER" updated: Capacitor C37 changed; Transistors T18-T21 replaced. Page "PWR_1V8" updated: DC-DC converter replaced for noise reduction and 12V capability. Page "PWR_3V3" updated: DC-DC converter replaced for noise reduction and 12V capability. Page "PWR_5V" updated: Added switches to disable/enable DC-DC; Added inductors. Page "I2C_MUX" updated: Added pull-up resistors. Page "SD" updated: Load switch replaced with one with integrated overload protection. Page "FTDI" updated: LDO regulator, diodes, capacitors, and inductor added; JTAG switch added; Resistors removed; UART buffer replaced; USB filter added. Page "MicroUSB" updated: Resistor R223 DNP by default. Page "DSPLL" updated: Clock connections updated; CLKIN3 not used. Page "FireFly" updated: Detect network added. Page "FF_0_1" updated: Power switch added; Terminators added; Slide switch added; Pull-up resistors added. Page "EXT_Connectors" updated: MIO and GPIO connectors added; Transistors added; Lightpipe added. Changed screws MECH3, MECH4 from metric M3 to inch UNC4-40 1/4". Added covers MECH2; MECH5 for Shield1 and Shield2. Capacitors C62, C63, C64 marked as DNP for noise reduction. Resistor R181 replaced with 0 Ohm to switch U8 in discontinuous mode of operation.

System Overview

The TEB0835 carrier board serves as a platform for the TE0835-03 RFSOC module. It includes various connectors and interfaces for peripherals and expansion.

Key components and connections include:

RFSOC Module TE0835-03: The core processing unit.
Clock Generation: Features a PLL (SI5395A-A-GM) for clock distribution.
Connectors: Includes JB1, JB2 for module connection, J36, J37, J42, J43, J45, J46 for clock inputs/outputs and external connections, J23, J25 for FireFly connections, J29 for Micro USB, J30 for Micro USB, J31 for Ethernet, J44 for MIO, J45 for GPIO, J28 for MicroSD card.
Interfaces: PCIe Edge Connector, USB, Ethernet (RJ45), MicroSD Card Socket, JTAG/UART interface.
Power Management: Includes power sequencing, voltage regulation, and protection circuits.
I2C Multiplexer (U7): Manages I2C communication with various devices.
FTDI Chip (U12): Provides USB to Serial communication.
FAN Controller (U9): Manages fan speed.

Supported Voltage Ranges

Power Rail	Direction	Range	Tolerance	Description	Note
12V_input_A	IN	12V	±10%	External Power	MiniFit 6-pin conn
12V_input_B	IN	12V	±10%	External Power	PCIe Edge conn
V_MODULE	OUT	5V	±3%	Micromodule Power	12V±10% (Option)
5V	OUT	5V	±3%	MicroUSB	-
3.3V	OUT	3.3V	±3%	J44, J45 FireFly conn	-
3.3V SD	OUT	3.3V	±3%	J28 SD Card Socket	-
1.8V	OUT	1.8V	±3%	J44, J45 FireFly conn	-
FF0_VCC	OUT	1.8V	±3%	J44 FireFly conn	-
FF1_VCC	OUT	1.8V	±3%	J45 FireFly conn	-

Component Descriptions and Connections

The schematics detail the connections for various components and interfaces:

ADC Input Connectors: Multiple connectors (XS1-XS8) are used for Analog-to-Digital Converter inputs, featuring SMP connectors and baluns.
DAC Output Connectors: Connectors (XS9-XS16) for Digital-to-Analog Converter outputs, also using SMP connectors and baluns.
Clock Connectors: Connectors (J20, J27, J32-J36) for clock signals, including SMA and U.FL connectors, with associated circuitry for signal integrity.
B2B Connectors (JB1, JB2): High-density connectors for module interface, carrying numerous signals including power, data, clocks, and control signals.
Power Section: Details the power distribution, including input connectors (PCIe 6-pin), voltage regulators (LTC4365ITS8#TRMPBF, TPS62913RPUR), and protection circuits.
Ethernet PHY (TRJG4820G4NL): Handles Ethernet communication.
Micro USB Connector (J29, J30): For USB connectivity.
MicroSD Card Socket (J28): For SD card storage.
FireFly Connectors (J23, J24, J25, J22): High-speed connectors for optical or electrical data transmission.
MIO and GPIO Connectors (J44, J45): General purpose input/output and multiplexed I/O connectors.
FTDI Chip (U12, U13, U14, U15, U16): Facilitates USB-to-serial communication and JTAG interface.
I2C Multiplexer (U7): Manages I2C bus traffic.
PLL (U5, U6): Clock generation and distribution.
SD Card Level Shifter (U11): Adapts voltage levels for SD card communication.

Schematic Details

The document includes detailed schematics for various functional blocks:

ADC Input Connectors (Pages 7-8)
DAC Output Connectors (Pages 9-10)
Clock Connectors (Pages 11-12)
B2B Connectors (Pages 13-14)
Power Supply Circuits (Pages 15-18)
I2C Multiplexer (Page 19)
PCIe Connector (Page 20)
SD Card Interface (Page 21)
FTDI Interface (Page 22)
Micro USB Interface (Page 23)
Ethernet PHY (Page 24)
DSPLL (Page 25)
FireFly Interface (Page 26)
FF_0_1 (Page 27)
External Connectors (Page 28)

Important Notes

The MIT License governs the usage of the schematics and documentation.
Schematics and handouts are provided for informational purposes only.

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