1. Product Overview

WBR1 is a low-power embedded Wi-Fi and Bluetooth module developed by Tuya. It features a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network protocol stack and robust library functions. WBR1 also includes a low-power KM4 multipoint control unit (MCU), WLAN MAC, 1T1R WLAN, 256 KB static random-access memory (SRAM), and 2 MB flash memory, along with extensive peripherals.

WBR1 serves as an RTOS platform that integrates all function libraries for Wi-Fi MAC and TCP/IP protocols, enabling the development of embedded Wi-Fi products.

Figure 1-1 illustrates the WBR1 architecture. The architecture comprises an Antenna connected via a Balun/Filter Circuit and Matching network to a 2.4GHz RF front-end. This front-end includes PA (Power Amplifier) and Transmit/Receive blocks, which interface with a Baseband (PHY) processor. The Baseband is linked to an MCU/Peripheral block and a MAC layer. Memory (SRAM and Flash) is also integrated. Power is supplied via a 3.3V line, and a 40MHz Crystal provides clocking. A Peripheral Interface connects the module to external components.

1.1 Features

• Embedded low-power KM4 MCU, capable of functioning as an application processor.
• Clock rate: 100 MHz.
• Working voltage: 3.0 V to 3.6 V.
• Peripherals: seven GPIOs and two universal asynchronous receivers/transmitters (UARTs).
• Wi-Fi connectivity:
• 802.11b/g/n20.
• Channels 1 to 14 at 2.4 GHz.
• Compatible with Bluetooth low energy (BLE) 4.2 (Up to +9dBm EIPR output power).
• WPA and WPA2 security modes.
• Up to +20 dBm EIPR output power in 802.11b mode.
• Smart network configuration for Android and iOS devices.
• Onboard PCB antenna.
• Certified by CE, FCC, and SRRC.
• Working temperature: -20°C to +85°C.

1.2 Applications

• Intelligent building.
• Smart household and home appliances.
• Smart socket and light.
• Industrial wireless control.
• Baby monitor.
• Network camera.
• Intelligent bus.

Change History

2. Module Interfaces

2.1 Dimensions and Footprint

WBR1 features two rows of 16 pins (2 x 8) with a 2 mm pin spacing. The WBR1 dimensions are 2.9±0.15 mm (Height) x 18±0.35 mm (Width) x 23.5±0.35 mm (Depth).

Figure 2-1 shows the WBR1 front and rear views. The front view displays the WBR1 branding and pin numbering from 1 to 18, arranged in two rows. Pin functions are listed on the right side, including Vin, Tx, Rx, GND, 3V3, EN, A_x (GPIO/PWM pins), Log_Rx, and Log_Tx. The rear view indicates component placement on the PCB. Dimensions are marked: 23.5mm vertically and 18mm horizontally.

2.2 Interface Pin Definition

Note: P indicates power supply pins, and I/O indicates input/output pins.

3. Electrical Parameters

3.1 Absolute Electrical Parameters

3.2 Electrical Conditions

3.3 RF Current Consumption

Table 3-3 Power consumption during constant transmission

Table 3-4 Power consumption during constant receiving

3.4 Working Current

Table 3-5 WBR1 working current

4. RF Features

4.1 Basic RF Features

4.2 TX Performance

Table 4-2 Performance during constant transmission

4.3 RX Performance

Table 4-3 RX sensitivity

5. Antenna Information

5.1 Antenna Type

WBR1 utilizes an onboard PCB antenna with a gain of 2.5 dBi.

5.2 Antenna Interference Reduction

To ensure optimal Wi-Fi performance with the onboard PCB antenna, it is recommended that the antenna be positioned at least 15 mm away from other metal parts.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions

The PCB dimensions are 0.8±0.1 mm (Height) x 18±0.35 mm (Width) x 23.5±0.35 mm (Depth).

Figure 6-1 shows the WBR1 mechanical dimensions, illustrating the top view with key measurements: 18mm width and a vertical dimension of 23.5mm, with internal component layout. Figure 6-2 provides a side view, indicating a thickness of 0.8mm and a pin height of 2.9mm. The default dimensional tolerance is ±0.35 mm.

6.2 Recommended PCB Layout

Figure 6-3 displays the WBR1 pinout, numbering pins 1 through 18. Pin 1 is VCC, Pin 2 is TX, Pin 3 is RX, Pin 4 is 3V3, Pin 5 is GND. Pins 6-13 are GPIO/PWM/UART pins (A_2 to A_17). Pin 14 is GND, Pin 15 is GND, Pin 16 is EN (Enable), Pin 17 is A_18, and Pin 18 is GND.

Figure 6-4 illustrates a recommended PCB layout for integrating the WBR1 module, showing two rows of 18 pads with dimensions for pad area, spacing, and width.

6.3 Production Instructions

1. Use an SMT placement machine to mount the module onto the PCB within 24 hours of unpacking and firmware burning. If this timeframe is exceeded, vacuum pack the module again and bake it before mounting.
2. SMT placement equipment:
   • Reflow soldering machine.
   • Automated optical inspection (AOI) equipment.
   • Nozzle with a 6 mm to 8 mm diameter.
3. Baking equipment:
   • Cabinet oven.
   • Anti-static heat-resistant trays.
   • Anti-static heat-resistant gloves.
4. Storage conditions for a delivered module:
   • The moisture-proof bag should be kept in an environment with temperature below 30°C and relative humidity lower than 70%.
   • The shelf life of a dry-packaged product is six months from the date of packaging and sealing.
   • The package includes a humidity indicator card (HIC). Figure 6-5 shows the HIC, which indicates humidity levels via color changes (e.g., blue for low humidity, pink for higher humidity).
5. Bake a module based on HIC status:
   • If 30%, 40%, and 50% circles are blue: bake for 2 consecutive hours.
   • If the 30% circle is pink: bake for 4 consecutive hours.
   • If the 30% and 40% circles are pink: bake for 6 consecutive hours.
   • If the 30%, 40%, and 50% circles are pink: bake for 12 consecutive hours.
6. Baking settings:
   • Baking temperature: 125±5°C.
   • Alarm temperature: 130°C.
   • SMT placement ready temperature after natural cooling: < 36°C.
   • Number of drying times: 1.
   • Rebaking condition: The module must be soldered within 12 hours after baking.
7. Do not use SMT to process modules unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for PCBs. If solder pads are exposed to air for over three months, they may oxidize severely, leading to dry joints or solder skips. Tuya is not liable for such issues.
8. Before SMT placement, implement electrostatic discharge (ESD) protective measures.
9. To reduce reflow defect rates, conduct visual inspection and AOI on 10% of products before the first SMT placement to determine optimal oven temperature and placement methods. Inspect 5 to 10 modules hourly from subsequent batches.

6.4 Recommended Oven Temperature Curve

Perform SMT placement following the reflow oven temperature curve shown in Figure 6-6. The highest temperature is 245°C. Based on IPC/JEDEC standards, reflow soldering should be performed on a module at most twice. The curve depicts preheating (150-200°C for 60-120 sec, ramp up max 2°C/sec), a peak temperature of 245+0/-5°C (slope 1-2°C/sec max), and a ramp-down rate of max 2.5°C/sec.

6.5 Storage Conditions

The document details storage conditions, including the use of moisture-proof bags, shelf life for dry-packaged products (six months), and reliance on a Humidity Indicator Card (HIC) to determine if baking is required. Specific conditions for baking are provided based on the HIC readings.

7. MOQ and Packing Information

Details regarding Minimum Order Quantity (MOQ) and packing information are provided.

8. Appendix: Statement

Federal Communications Commission (FCC) Declaration of Conformity

FCC Caution: Changes or modifications not expressly approved by the responsible party for compliance may void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules, subject to two conditions: (1) it may not cause harmful interference, and (2) it must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device per FCC Part 15. These limits aim to provide reasonable protection against harmful interference in residential installations. The equipment generates, uses, and can radiate radio frequency energy. Improper installation or use may cause harmful interference to radio communications. While no guarantee against interference is provided for specific installations, users experiencing interference with radio or television reception are encouraged to try correcting it by reorienting/relocating the antenna, increasing separation between equipment and receiver, connecting to a different circuit, or consulting a dealer or technician.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits for an uncontrolled environment. It should be installed and operated with a minimum distance of 20cm between the radiator and the user's body.

Important Note

This radio module must not be co-located or operated simultaneously with other radios in a host system unless in accordance with FCC multi-transmitter product procedures. Additional testing and authorization may be required for simultaneous operation with other radios.

The availability of specific channels and operational frequency bands is country-dependent and firmware-programmed at the factory. Firmware settings are not accessible by the end user.

The host product manufacturer is responsible for compliance with other FCC rules applicable to the host, not covered by the modular transmitter grant. The final host product requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual must include all required regulatory information and warnings, including the requirement for installation and operation with a minimum distance of 20 cm between the radiator and the user's body.

This device has FCC ID: 2ANDL-WBR1. The final end product must be labeled: “Contains Transmitter Module FCC ID:2ANDL-WBR1”.

This device is intended for OEM integrators under the following conditions: 1) The antenna must be installed such that 20cm is maintained between the antenna and users. 2) The transmitter module may not be co-located with any other transmitter or antenna. Meeting these conditions means further transmitter testing may not be required, but the OEM integrator remains responsible for testing their end-product for additional compliance requirements.

Declaration of Conformity European notice

Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU and 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale or to a municipal recycling collection point.