Tuya WBR3 Wi-Fi and Bluetooth Module Datasheet

1. Product Overview

WBR3 is a low-power embedded Wi-Fi and Bluetooth module developed by Tuya. It features a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network protocol stack and robust library functions. The WBR3 also includes a low-power KM4 multipoint control unit (MCU), WLAN MAC, 1T1R WLAN, 256 KB static random-access memory (SRAM), and 2 MB flash memory, along with extensive peripherals.

WBR3 operates as an RTOS platform, integrating all function libraries for Wi-Fi MAC and TCP/IP protocols, enabling the development of embedded Wi-Fi products.

Figure 1-1 illustrates the WBR3 architecture. The diagram shows an Antenna connected to a Balun/Filter Circuit and Matching network. This feeds into a 2.4GHz block, which connects to a PA (Power Amplifier) and a Receive block. These, along with an ADC (Analog-to-Digital Converter) and DAC (Digital-to-Analog Converter), interface with the MCU/Peripheral block. The MCU/Peripheral block also connects to a Memory block and a Baseband (PHY) block. The Baseband (PHY) block interfaces with a Peripheral Interface. A 3.3V power source is shown connected to the LDO/SWR block, which also connects to the MCU/Peripheral block. A 40MHz Crystal is shown connected to the MCU/Peripheral block.

1.1 Features

• Embedded low-power KM4 MCU, capable of functioning as an application processor
• Clock rate: 100 MHz
• Working voltage: 3.0 V to 3.6 V
• Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one Log_TX pin
• Wi-Fi connectivity:
• 802.11b/g/n20
• Channels 1 to 14 at 2.4 GHz
• Compatible with Bluetooth low energy (BLE) 4.2 (Up to +9dBm EIRP output power)
• WPA and WPA2 security modes
• Up to +20 dBm EIRP output power in 802.11b mode
• Smart network configuration for Android and iOS devices
• Onboard PCB antenna
• Certified by CE, FCC, and SRRC
• Working temperature: -20°C to +85°C

1.2 Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change History

2. Module Interfaces

2.1 Dimensions and Footprint

WBR3 has two rows of 16 pins (2 x 8) with a 2 mm pin spacing. The WBR3 dimensions (H x W x D) are 2.9±0.15 mm x 16±0.35 mm x 24±0.35 mm.

Figure 2-1 shows the WBR3 front and rear views. The diagram displays two views of the module, indicating the pin layout and overall dimensions. The top view shows the WBR3 branding and component placement. The rear view details pin assignments from 1 to 16 on each side, with labels such as TXD, RXD, GND, VCC, and various A_ pins. Dimensions of 16mm and 24mm are marked.

2.2 Interface Pin Definition

Table 2-1 lists the WBR3 interface pins:

Note: P indicates power supply pins, and I/O indicates input/output pins.

3. Electrical Parameters

3.1 Absolute Electrical Parameters

Table 3-1 lists the absolute electrical parameters:

3.2 Electrical Conditions

Table 3-2 lists the normal electrical conditions:

3.3 RF Current Consumption

Table 3-3 shows the power consumption during constant transmission:

Table 3-4 shows the power consumption during constant receiving:

3.4 Working Current

Table 3-5 shows the WBR3 working current:

4. RF Features

4.1 Basic RF Features

Table 4-1 lists the basic RF features:

4.2 TX Performance

Table 4-2 shows the performance during constant transmission:

4.3 RX Performance

Table 4-3 shows the RX sensitivity:

5. Antenna Information

5.1 Antenna Type

WBR3 uses an onboard PCB antenna with a gain of 2.5 dBi.

5.2 Antenna Interference Reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions

The PCB dimensions (H x W x D) are 0.8±0.1 mm x 16±0.35 mm x 24±0.35 mm. Figure 6-1 shows the WBR3 mechanical dimensions. The diagram displays the top view of the WBR3 module with dimensions of 16mm width and 24mm height, indicating pin rows. Figure 6-2 shows a side view, indicating the module height (0.8mm), shield cover dimensions, and overall length (24mm).

6.2 Recommended PCB Layout

Figure 6-3 shows the WBR3 pins, illustrating the pin numbering and names arranged in two columns of 16 pins each. Figure 6-4 displays the recommended footprint for the WBR3 module on a PCB, including dimensions for the pad layout and overall area.

6.3 Production Instructions

1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
• (1) SMT placement equipment:
• i. Reflow soldering machine
• ii. Automated optical inspection (AOI) equipment
• iii. Nozzle with a 6 mm to 8 mm diameter
• (2) Baking equipment:
• i. Cabinet oven
• ii. Anti-static heat-resistant trays
• iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
• (1) The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
• (2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
• (3) The package contains a humidity indicator card (HIC). Figure 6-5 shows the HIC for WBR3. The card has circles labeled 10% to 60% and instructions for reading its status.
3. Bake a module based on HIC status as follows when you unpack the module package:
• (1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
• (2) If the 30% circle is pink, bake the module for 4 consecutive hours.
• (3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
• (4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
4. Baking settings:
• (1) Baking temperature: 125±5°C
• (2) Alarm temperature: 130°C
• (3) SMT placement ready temperature after natural cooling: < 36°C
• (4) Number of drying times: 1
• (5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

6.4 Recommended Oven Temperature Curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice.

Figure 6-6 shows the oven temperature curve. The graph illustrates a reflow soldering profile with stages including Preheat (150-200°C for 60-120 sec), Ramp up rate (Max. 2°C/sec), Peak temperature (245+0/-5°C), and Ramp down rate (Max. 2.5°C/sec), all plotted against Time (sec).

6.5 Storage Conditions

The document includes a caution notice for moisture-sensitive devices, detailing storage conditions. It specifies a calculated shelf life of 12 months in a sealed bag at < 40°C and < 90% relative humidity (RH). Peak package body temperature is 260°C. After opening the bag, devices must be mounted within 168 hours under factory conditions or stored at < 10% RH. Devices require baking if the Humidity Indicator Card (HIC) shows > 10% at 23 ± 5°C. If baking is required, it can be done for 48 hrs. at 125 ± 5°C. Notes refer to IPC/JEDEC J-STD-033 for bake procedures and IPC/JEDEC J-STD-020 for level and body temperature definitions.

7. MOQ and Packing Information

This section is present but contains no specific details in the provided text.

8. Appendix: Statement

Federal Communications Commission (FCC) Declaration of Conformity

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in host systems, except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required for operating simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

Declaration of Conformity European notice

[CE logo] Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

[WEEE logo] This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.