Tuya WBR2 Wi-Fi and Bluetooth Module

1. Product Overview

WBR2 is a low-power embedded Wi-Fi and Bluetooth module developed by Tuya. It features a highly integrated RF chip (RTL8720CF) with an embedded Wi-Fi network protocol stack and robust library functions. The WBR2 also includes a low-power KM4 microcontroller unit (MCU), a WLAN MAC, a 1T1R capable WLAN baseband, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WBR2 functions as an RTOS platform integrating all function libraries for Wi-Fi MAC and TCP/IP protocols, enabling the development of embedded Wi-Fi and Bluetooth products.

Figure 1-1 illustrates the WBR2 architecture.

1.1 Features

• Embedded low-power KM4 MCU, capable of functioning as an application processor.
• Clock rate: 100 MHz.
• Working voltage: 3.0 V to 3.6 V.
• Peripherals: Six GPIOs and one universal asynchronous receiver/transmitter (UART).
• Wi-Fi connectivity:
  • 802.11b/g/n20 standard.
  • Supports channels 1 to 14 at 2.4 GHz.
  • Compatible with Bluetooth low energy (BLE) 4.2, with up to +9dBm EIPR output power.
  • Supports WPA and WPA2 security modes.
  • Up to +20 dBm EIRP output power in 802.11b mode.
  • EZ net pairing mode for Android and iOS devices.
  • Onboard PCB antenna.
  • Certified by CE, FCC, and SRRC.
• Working temperature: -20°C to +85°C.

1.2 Application Scenarios

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change History

2. Module Interfaces

2.1 Dimensions and Footprint

The WBR2 module features two rows of pins with a 2 mm pin spacing. The module dimensions are 2.9±0.15 mm (Height) x 15±0.35 mm (Width) x 18±0.35 mm (Depth). Figure 2-1 shows the front and rear views of the WBR2 module.

2.2 Interface Pin Definition

Note: 'P' indicates a power supply pin, and 'I/O' indicates an input/output pin.

3. Electrical Parameters

3.1 Absolute Electrical Parameters

3.2 Working Conditions

3.3 RF Current Consumption

Current consumption during constant transmission

Current consumption during constant receiving

3.4 Working Current

4. RF Features

4.1 Basic RF Features

4.2 TX Performance

4.3 RX Performance

5. Antenna Information

5.1 Antenna Type

WBR2 utilizes an onboard PCB antenna with a gain of 2.5 dBi.

5.2 Antenna Interference Reduction

To ensure optimal Wi-Fi performance when using the onboard PCB antenna, it is recommended that the antenna be positioned at least 15 mm away from other metal parts.

6. Packaging Information and Production Instructions

6.1 Mechanical Dimensions

The PCB dimensions are 0.8±0.1 mm (Height) x 15±0.35 mm (Width) x 18±0.35 mm (Depth), as illustrated in Figure 6-1.

6.2 Recommended PCB Layout

6.3 Production Instructions

1. Wave soldering is the preferred method for soldering the module onto PCBs, especially for Tuya-developed modules with through-hole mounting. Hand soldering should only be used if a wave soldering machine is unavailable. Soldering must be completed within 24 hours of unpacking the module. If this timeframe is exceeded, repack the module in a vacuum-sealed bag.

(1) Required materials for soldering:

• Wave soldering machine
• Wave soldering fixture
• Constant-temperature iron
• Wave solder bar, wire, and flux
• Oven temperature tester

(2) Baking equipment:

• Cabinet oven
• Anti-static heat-resistant trays
• Anti-static heat-resistant gloves

2. Bake the module if any of the following conditions apply:

• The vacuum package is damaged before the module is unpacked.
• The package does not contain a humidity indicator card (HIC).
• After unpacking, the HIC shows that the 30% and higher rate circles are pink.
• Production is not completed within 72 hours after the module is unpacked.
• The module has been packed for more than six months.

3. Baking settings:

• Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack mode.
• Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode.
• Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode.
• Production ready temperature after natural cooling: < 36°C.
• Number of baking times: 1.
• Rebaking condition: Production is not completed within 72 hours after baking.

4. Do not wave solder modules that have been unpacked for over three months. The PCBs use Electroless Nickel Immersion Gold (ENIG). If solder pads are exposed to air for over three months, they may oxidize severely, leading to dry joints or solder skips. Tuya is not liable for such issues.

5. Implement electrostatic discharge (ESD) protective measures throughout the production process.

6. For optimal product quality, ensure the following requirements are met:

• Flux amount
• Wave height
• Amount of tin dross and copper in the solder pot
• Wave soldering fixture window and thickness
• Oven temperature curve for wave soldering

6.4 Recommended Oven Temperature Curve and Soldering Temperature

Set the oven temperature according to recommendations for wave soldering. The peak temperature should be 260±5°C. Figure 6-4 provides the oven temperature curve for wave soldering.

6.5 Storage Conditions

Storage conditions for a delivered module are as follows:

1. The moisture-proof bag should be kept in an environment with a temperature below 30°C and relative humidity lower than 70%.
2. The shelf life of a dry-packaged product is six months from the date of packaging and sealing.
3. The package contains a Humidity Indicator Card (HIC).

The moisture-sensitive device packaging includes a label with the following information:

• CAUTION: This bag contains MOISTURE-SENSITIVE DEVICES, LEVEL 3.
• Calculated shelf life in sealed bag: 12 months at < 40°C and < 90% relative humidity (RH).
• Peak package body temperature: 260°C.
• After bag is opened, devices subjected to reflow solder or other high-temperature processes must be:
  • Mounted within 168 hours of factory conditions, OR
  • Stored at < 30°C/60%RH, OR
  • Stored at <10% RH.
• Devices require baking before mounting if:
  • Humidity Indicator Card (HIC) reads > 10% at 23 ± 5°C, OR
  • Conditions 3a or 3b are not met.
• If baking is required, devices may be baked for 48 hours at 125 ± 5°C. Refer to IPC/JEDEC J-STD-033 for bake procedures if device containers cannot withstand high temperatures or shorter bake times are desired.
• Bag Seal Date: [Placeholder for date].
• Note: Level and body temperature defined by IPC/JEDEC J-STD-020.

7. MOQ and Packing Information

Details regarding Minimum Order Quantity (MOQ) and packing information are provided in this section (specific details not detailed in the provided OCR text).

8. Appendix: Statement

Federal Communications Commission (FCC) Declaration of Conformity

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment causes harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in a host system, except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required for simultaneous operation with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host, not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

This device has FCC ID: 2ANDL-WBR2. The final end product must be labeled in a visible area with the following: "Contains Transmitter Module FCC ID: 2ANDL-WBR2".

This device is intended only for OEM integrators under the following conditions:

1. The antenna must be installed such that 20 cm is maintained between the antenna and users.
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as these two conditions are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements with this module installed.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU and 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.