onsemi MC10EP11, MC100EP11 3.3 V/5 V ECL 1:2 Differential Fanout Buffer
Datasheet
Website: www.onsemi.com
Description
The MC10/100EP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the LVEL11 device. With AC performance much faster than the LVEL11 device, the EP11 is ideal for applications requiring the fastest AC performance available. The 100 Series contains temperature compensation.
Features
- 220 ps Typical Propagation Delay
- Maximum Clock Frequency > 3 GHz Typical
- PECL Mode Operating Range: Vcc = 3.0 V to 5.5 V with VEE = 0 V
- NECL Mode Operating Range: Vcc = 0 V with VEE = -3.0 V to -5.5 V
- Open Input Default State
- Safety Clamp on Inputs
- Q Outputs Will Default LOW with Inputs Open or at VEE
- These Devices are Pb-Free, Halogen Free and are RoHS Compliant
Package Information
The MC10EP11 and MC100EP11 are available in the following packages:
- SOIC-8 NB (CASE 751-07)
- TSSOP-8 (CASE 948R-02)
- DFN-8 (CASE 506AA)
Pin Description
| PIN | FUNCTION |
|---|---|
| D*, D** | ECL Data Inputs |
| Q0, Q0, Q1, Q1 | ECL Data Outputs |
| Vcc | Positive Supply |
| VEE | Negative Supply |
| EP | (DFN-8 only) Thermal exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open. |
* Pins will default LOW when left open.
** Pins will default to high when left open.
Attributes
| Characteristics | Value |
|---|---|
| Internal Input Pulldown Resistor | 75 kΩ |
| Internal Input Pullup Resistor | 37.5 kΩ |
| ESD Protection (Human Body Model) | > 4 kV |
| ESD Protection (Machine Model) | > 200 V |
| ESD Protection (Charged Device Model) | > 2 kV |
| Moisture Sensitivity, Indefinite Time Out of Drypack | Pb-Free Pkg (Level 1 for SOIC-8 NB and DFN-8, Level 3 for TSSOP-8) |
| Flammability Rating (Oxygen Index: 28 to 34) | UL 94 V-0 @ 0.125 in |
| Transistor Count | 73 Devices |
Maximum Ratings
| Symbol | Parameter | Condition 1 | Condition 2 | Rating | Unit |
|---|---|---|---|---|---|
| Vcc | PECL Mode Power Supply | VEE = 0 V | 6 | V | |
| VEE | NECL Mode Power Supply | Vcc = 0 V | -6 | V | |
| VIH | PECL Mode Input Voltage | VEE = 0 V | 6 | V | |
| VIL | NECL Mode Input Voltage | Vcc = 0 V, Vi ≥ VEE | -6 | V | |
| Iout | Output Current | Continuous | 50 | mA | |
| Surge | 100 | ||||
| TA | Operating Temperature Range | -40 to +85 | °C | ||
| Tstg | Storage Temperature Range | -65 to +150 | °C | ||
| θJA | Thermal Resistance (Junction-to-Ambient) | 0 Ifpm | SOIC-8 NB: 190 | °C/W | |
| 500 Ifpm | SOIC-8 NB: 130 | °C/W | |||
| θJC | Thermal Resistance (Junction-to-Case) | Standard Board | SOIC-8 NB: 41 to 44 | °C/W | |
| θJA | Thermal Resistance (Junction-to-Ambient) | 0 Ifpm | TSSOP-8: 185 | °C/W | |
| 500 Ifpm | TSSOP-8: 140 | °C/W | |||
| θJC | Thermal Resistance (Junction-to-Case) | Standard Board | TSSOP-8: 41 to 44 | °C/W | |
| θJA | Thermal Resistance (Junction-to-Ambient) | 0 Ifpm | DFN-8: 129 | °C/W | |
| 500 Ifpm | DFN-8: 84 | °C/W | |||
| θJC | Thermal Resistance (Junction-to-Case) | DFN-8 | 35 to 40 | °C/W | |
| Tsol | Wave Solder (Pb-Free) | <2 to 3 sec @ 260°C | 265 | °C | |
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. JEDEC standard multilayer board - 2S2P (2 signal, 2 power).
DC Characteristics (PECL)
Vcc = 3.3 V, VEE = 0 V (Note 1)
| Symbol | Characteristic | -40°C | 25°C | 85°C | Unit | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Min | Typ | Max | Min | Typ | Max | Min | Typ | Max | |||
| IEE | Negative Power Supply Current | 20 | 29 | 37 | 20 | 30 | 39 | 22 | 31 | 40 | mA |
| VOH | Output HIGH Voltage (Note 2) | 2165 | 2290 | 2415 | 2230 | 2355 | 2480 | 2290 | 2415 | 2540 | mV |
| VOL | Output LOW Voltage (Note 2) | 1365 | 1490 | 1615 | 1430 | 1555 | 1680 | 1490 | 1615 | 1740 | mV |
| VIH | Input HIGH Voltage (Single-Ended) | 2090 | 2415 | 2155 | 2480 | 2215 | 2540 | mV | |||
| VIL | Input LOW Voltage (Single-Ended) | 1365 | 1690 | 1430 | 1755 | 1490 | 1815 | mV | |||
| VIHCMR | Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) | 2.0 | 3.3 | 2.0 | 3.3 | 2.0 | 3.3 | V | |||
| IH | Input HIGH Current | 150 | 150 | 150 | μA | ||||||
| IL | Input LOW Current | 0.5 | -150 | 0.5 | -150 | 0.5 | -150 | μA | |||
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm.
1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to -2.2 V.
2. All loading with 50 Ω to Vcc - 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
DC Characteristics (PECL)
Vcc = 5.0 V, VEE = 0 V (Note 1)
| Symbol | Characteristic | -40°C | 25°C | 85°C | Unit | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Min | Typ | Max | Min | Typ | Max | Min | Typ | Max | |||
| IEE | Negative Power Supply Current | 20 | 29 | 37 | 20 | 30 | 39 | 22 | 31 | 40 | mA |
| VOH | Output HIGH Voltage (Note 2) | 3865 | 3990 | 4115 | 3930 | 4055 | 4180 | 3990 | 4115 | 4240 | mV |
| VOL | Output LOW Voltage (Note 2) | 3065 | 3190 | 3315 | 3130 | 3255 | 3380 | 3190 | 3315 | 3440 | mV |
| VIH | Input HIGH Voltage (Single-Ended) | 3790 | 4115 | 3855 | 4180 | 3915 | 4240 | mV | |||
| VIL | Input LOW Voltage (Single-Ended) | 3065 | 3390 | 3130 | 3455 | 3190 | 3515 | mV | |||
| VIHCMR | Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) | 2.0 | 5.0 | 2.0 | 5.0 | 2.0 | 5.0 | V | |||
| IH | Input HIGH Current | 150 | 150 | 150 | μA | ||||||
| IL | Input LOW Current | 0.5 | -150 | 0.5 | -150 | 0.5 | -150 | μA | |||
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm.
1. Input and output parameters vary 1:1 with VCC.
2. All loading with 50 Ω to Vcc - 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
DC Characteristics (NECL)
Vcc = 0 V; VEE = -3.0 V to -5.5 V (Note 1)
| Symbol | Characteristic | -40°C | 25°C | 85°C | Unit | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Min | Typ | Max | Min | Typ | Max | Min | Typ | Max | |||
| IEE | Negative Power Supply Current | 20 | 29 | 37 | 20 | 30 | 39 | 22 | 31 | 40 | mA |
| VOH | Output HIGH Voltage (Note 2) | -1145 | -1020 | -895 | -1145 | -1020 | -895 | -1145 | -1020 | -895 | mV |
| VOL | Output LOW Voltage (Note 2) | -1945 | -1820 | -1695 | -1945 | -1820 | -1695 | -1945 | -1820 | -1695 | mV |
| VIH | Input HIGH Voltage (Single-Ended) | -1225 | -880 | -1225 | -880 | -1225 | -880 | mV | |||
| VIL | Input LOW Voltage (Single-Ended) | -1945 | -1625 | -1945 | -1625 | -1945 | -1625 | mV | |||
| VIHCMR | Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) | VEE + 2.0 | 0.0 | VEE + 2.0 | 0.0 | VEE + 2.0 | 0.0 | V | |||
| IH | Input HIGH Current | 150 | 150 | 150 | μA | ||||||
| IL | Input LOW Current | 0.5 | -150 | 0.5 | -150 | 0.5 | -150 | μA | |||
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm.
1. Input and output parameters vary 1:1 with Vcc.
2. All loading with 50 Ω to Vcc - 2.0 V.
3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal.
AC Characteristics
Vcc = 3.3 V, VEE = 0 V or Vcc = 3.0 V to 5.5 V; VEE = 0 V (Note 1)
| Symbol | Characteristic | -40°C | 25°C | 85°C | Unit | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Min | Typ | Max | Min | Typ | Max | Min | Typ | Max | |||
| fmax | Maximum Frequency (Figure 2) | > 3 | > 3 | > 3 | GHz | ||||||
| tPLH, tPHL | Propagation Delay to Output Differential CLK to Q, Q | 140 | 200 | 250 | 160 | 220 | 270 | 180 | 240 | 300 | ps |
| tSKEW | Within Device Skew Q0, Q1 (Note 2) | 10 | 15 | 15 | 20 | 20 | 25 | ps | |||
| Device-to-Device Skew | 110 | 110 | 120 | 120 | ps | ||||||
| JITTER | Random Clock Jitter (RMS) (Figure 2) | 0.2 | < 1 | 0.2 | < 1 | 0.2 | < 1 | ps | |||
| VINPP | Input Voltage Swing Sensitivity (Differential Configuration) | 150 | 800 | 1200 | 150 | 800 | 1200 | 150 | 800 | 1200 | mV |
| tr, tf | Output Rise/Fall Times Q, Q (20% - 80%) @ 1.0 GHz | 70 | 120 | 170 | 80 | 130 | 180 | 90 | 150 | 200 | ps |
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm.
1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 Ω to Vcc - 2.0 V.
2. Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs.
Figures
Figure 2. Output Voltage Amplitude (VOUTPP) RMS Jitter vs. Input Clock Frequency at Ambient Temperature
A graph showing Output Voltage Amplitude (mV) on the Y-axis and Input Frequency (MHz) on the X-axis. The graph displays a curve that starts around 800mV at 0 MHz and decreases to approximately 400mV at 3000 MHz. A secondary Y-axis on the right shows RMS Jitter (ps) which increases from 1 ps at 0 MHz to 9 ps at 3000 MHz.
Figure 3. AC Reference Measurement
A diagram illustrating AC reference measurement for differential signals. It shows input signals D and D_bar, and output signals Q and Q_bar. Propagation delays tPLH and tPHL are indicated. VOUTPP is defined as VOH(Q) - VOL(Q), and VINPP is defined as VIH(CLK) - VIL(CLK).
Figure 4. Typical Termination for Output Driver and Device Evaluation
A circuit diagram showing typical termination for output driver and device evaluation. It depicts a driver device and a receiver device connected via transmission lines with 50 Ω characteristic impedance. Termination resistors of 50 Ω are shown connected to VTT, where VTT = Vcc - 2.0 V.
Ordering Information
| Device | Package | Shipping† |
|---|---|---|
| MC10EP11DG | SOIC-8 NB (Pb-Free) | 98 Units / Tube |
| MC10EP11DR2G | SOIC-8 NB (Pb-Free) | 2500 / Tape & Reel |
| MC100EP11DG | SOIC-8 NB (Pb-Free) | 98 Units / Tube |
| MC100EP11DR2G | SOIC-8 NB (Pb-Free) | 2500 / Tape & Reel |
| MC100EP11DTG | TSSOP-8 (Pb-Free) | 100 Units / Tube |
| MC100EP11DTR2G | TSSOP-8 (Pb-Free) | 2500 / Tape & Reel |
| MC100EP11MNR4G | DFN-8 (Pb-Free) | 1000 / Tape & Reel |
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DISCONTINUED (Note 3)
| Device | Package | Shipping† |
|---|---|---|
| MC10EP11DTG | TSSOP-8 (Pb-Free) | 100 Units / Tube |
3. DISCONTINUED: This device is not recommended for new design. Please contact your onsemi representative for information. The most current information on this device may be available on www.onsemi.com.
Resource Reference of Application Notes
- AN1405/D - ECL Clock Distribution Techniques
- AN1406/D - Designing with PECL (ECL at +5.0 V)
- AN1503/D - ECLinPS™ I/O SPICE Modeling Kit
- AN1504/D - Metastability and the ECLinPS Family
- AN1568/D - Interfacing Between LVDS and ECL
- AN1672/D - The ECL Translator Guide
- AND8001/D - Odd Number Counters Design
- AND8002/D - Marking and Date Codes
- AND8020/D - Termination of ECL Logic Devices
- AND8066/D - Interfacing with ECLinPS
- AND8090/D - AC Characteristics of ECL Devices
ECLinPS is a registered trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries.
Mechanical Case Outline - DFN8 2x2, 0.5P
CASE 506AA, ISSUE F
DATE: 04 MAY 2016
NOTES:
- DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
- CONTROLLING DIMENSION: MILLIMETERS.
- DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP.
- COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
| DIM | MIN | MAX |
|---|---|---|
| A | 0.80 | 1.00 |
| A3 | 0.20 REF | |
| A1 | 0.00 | 0.05 |
| b | 0.20 | 0.30 |
| D | 2.00 BSC | |
| D2 | 1.10 | 1.30 |
| E | 2.00 BSC | |
| E2 | 0.70 | 0.90 |
| e | 0.50 BSC | |
| K | 0.30 REF | |
| L | 0.25 | 0.35 |
| L1 | 0.10 |
RECOMMENDED SOLDERING FOOTPRINT*
*For additional information on our Pb-Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC MARKING DIAGRAM*
XX = Specific Device Code
M = Date Code
Pb-Free Device
*This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "", may or may not be present. Some products may not follow the Generic Marking.
Mechanical Case Outline - SOIC-8 NB
CASE 751-07, ISSUE AK
DATE: 16 FEB 2011
NOTES:
- DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
- CONTROLLING DIMENSION: MILLIMETER.
- DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
- MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
- DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
- 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07.
MILLIMETERS / INCHES
| DIM | MIN | MAX | MIN | MAX |
|---|---|---|---|---|
| A | 4.80 | 5.00 | 0.189 | 0.197 |
| B | 3.80 | 4.00 | 0.150 | 0.157 |
| C | 1.35 | 1.75 | 0.053 | 0.069 |
| D | 0.33 | 0.51 | 0.013 | 0.020 |
| G | 1.27 BSC | 0.050 BSC | ||
| H | 0.10 | 0.25 | 0.004 | 0.010 |
| J | 0.19 | 0.25 | 0.007 | 0.010 |
| K | 0.40 | 1.27 | 0.016 | 0.050 |
| M | 0° | 8° | 0° | 8° |
| N | 0.25 | 0.50 | 0.010 | 0.020 |
| S | 5.80 | 6.20 | 0.228 | 0.244 |
SOLDERING FOOTPRINT*
*For additional information on our Pb-Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC MARKING DIAGRAM*
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
Pb-Free Package
*This information is generic. Please refer to device data sheet for actual part marking. Pb-Free indicator, "G" or microdot "", may or may not be present. Some products may not follow the Generic Marking.
Mechanical Case Outline - TSSOP-8 3.00x3.00x0.95
CASE 948R-02, ISSUE A
DATE: 07 APR 2000
NOTES:
- DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
- CONTROLLING DIMENSION: MILLIMETER.
- DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
- DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
- TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
- DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-.
MILLIMETERS / INCHES
| DIM | MIN | MAX | MIN | MAX |
|---|---|---|---|---|
| A | 2.90 | 3.10 | 0.114 | 0.122 |
| B | 2.90 | 3.10 | 0.114 | 0.122 |
| C | 0.80 | 1.10 | 0.031 | 0.043 |
| D | 0.05 | 0.15 | 0.002 | 0.006 |
| F | 0.40 | 0.70 | 0.016 | 0.028 |
| G | 0.65 BSC | 0.026 BSC | ||
| K | 0.25 | 0.40 | 0.010 | 0.016 |
| L | 4.90 BSC | 0.193 BSC | ||
| M | 0° | 6° | 0° | 6° |
Legal Information
onsemi, onsemi., and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
Additional Information
Technical Publications:
- Technical Library: www.onsemi.com/design/resources/technical-documentation
- onsemi Website: www.onsemi.com
Online Support:
- www.onsemi.com/support
- For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales
