TinyLogic UHS Dual Buffer NC7WZ16

Description

The NC7WZ16 is a dual buffer from onsemi's Ultra-High Speed Series of TinyLogic. It is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a very broad Vcc operating range. The device operates over the 1.65 V to 5.5 V Vcc range. The inputs and outputs are high impedance when Vcc is 0 V. Inputs tolerate voltages up to 5.5 V independent of VCC operating voltage.

Features

• Ultra-High Speed: tpd = 2.4 ns (Typical) into 50 pF at 5 V VCC
• High Output Drive: ±24 mA at 3 V VCC
• Broad Vcc Operating Range: 1.65 V to 5.5 V
• Matches Performance of LCX when Operated at 3.3 V VCC
• Power Down High-Impedance Inputs / Outputs
• Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
• Proprietary Noise / EMI Reduction Circuitry
• Ultra-Small MicroPak™ Packages
• Space-Saving SC-88 Package
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Logic Symbol

The logic symbol depicts a dual buffer. Input A1 connects to output Y1, and input A2 connects to output Y2. The symbol indicates that the output follows the input (Y = A).

Marking Diagrams

Various marking diagrams are provided for different package types, including SIP6, UDFN6, and SC-88. These diagrams illustrate the top mark and explain the meaning of the characters, which typically include the specific device code, lot run traceability code, date code, assembly plant code, and assembly operation month.

Pin Configurations

SC-88 (Top View)

The SC-88 package is a 6-lead package. Pin 1 is identified, and the pins are assigned as follows: A1, GND, A2, Y2, Vcc, Y1.

MicroPak (Top Through View)

The MicroPak package is also a 6-lead package. Pin 1 is identified, and the pins are assigned as follows: A1, GND, A2, Y2, Vcc, Y1.

Pin Definitions

Function Table

The function table shows that the output (Y) is equivalent to the input (A) for both buffer gates.

H = HIGH Logic Level, L = LOW Logic Level.

Absolute Maximum Ratings

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Recommended Operating Conditions

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. Unused inputs must be held HIGH or LOW. They may not float.

DC Electrical Characteristics

This section details the DC electrical characteristics across various Vcc voltages and temperatures, including HIGH/LOW level input voltages (VIH, VIL), HIGH/LOW level output voltages (VOH, VOL) under different load conditions, input leakage current (IIN), power-off leakage current (IOFF), and quiescent supply current (ICC).

AC Electrical Characteristics

This section provides propagation delay times (tPLH, tPHL) for various Vcc voltages and load conditions (CL = 15 pF, RL = 1 MΩ and CL = 50 pF, RL = 500 Ω). It also specifies input capacitance (CIN) and power dissipation capacitance (CPD).

Note 4 explains that CPD is the internal equivalent capacitance derived from dynamic operating current consumption at no output loading and 50% duty cycle. The relationship is ICCD = (CPD)(Vcc)(fin) + (Iccstatic).

The AC test circuits and waveforms illustrate the setup for measuring propagation delays and ICCD current.

Device Ordering Information

Note: Some devices are marked as DISCONTINUED and are not recommended for new designs. Please refer to the onsemi website for the most current information.

Package Dimensions

SIP6 1.45x1.0, CASE 127EB

This section details the mechanical outline for the SIP6 package, specifying dimensions in millimeters and conforming to JEDEC standard MO-252 variation UAAD and ASME Y14.5M-2009. Key dimensions include body length, width, and lead pitch.

SC-88 (SC-70 6 Lead), 1.25x2, CASE 419AD

This section provides the mechanical outline for the SC-88 (SC-70 6 Lead) package. It includes a table of dimensions for height (A, A1, A2), width (b), thickness (c), body length (D), body width (E), lead span (E1), lead pitch (e), and lead length (L, L1, L2). Angles (θ, θ1) are also specified. Dimensions are in millimeters and conform to JEDEC MO-203.

SC-88 2.00x1.25x0.90, 0.65P, CASE 419B-02

This section details the mechanical outline for the SC-88 package with dimensions 2.00x1.25x0.90 and 0.65P pitch. It includes notes on dimensioning, tolerances, mold flash, and lead flatness. A table lists dimensions (A, A1, A2, b, c, D, E, E1, e, L, L2) and tolerances (aaa, bbb, ccc, ddd). Recommended mounting footprints are also provided.

UDFN6 1.0x1.0, 0.35P, CASE 517DP

This section outlines the UDFN6 package dimensions, which is a 1.0x1.0 mm package with a 0.35 mm pitch. It includes a top view, side view, and bottom view with detailed dimensions and tolerances conforming to JEDEC MO-252 standard and ASME Y14.5M-2009. Recommended land patterns for both space-constrained and universal applications are shown.

Additional Information

For technical publications and documentation, visit the onsemi Technical Library at www.onsemi.com/design/resources/technical-documentation.

For online support and to contact sales representatives, visit www.onsemi.com/support.