TinyLogic UHS Two-Input OR Gate

NC7SZ32

Description

The NC7SZ32 is a single two-input OR gate from onsemi's Ultra-High Speed (UHS) series of TinyLogic. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65 V to 5.5 V VCC operating range. The inputs and output are high impedance when VCC is 0 V. Inputs tolerate voltages up to 5.5 V, independent of VCC operating voltage.

Features

  • Ultra-High Speed: tPD = 2.4 ns (Typical) into 50 pF at 5 V VCC
  • High Output Drive: ±24 mA at 3 V VCC
  • Broad VCC Operating Range: 1.65 V to 5.5 V
  • Matches Performance of LCX Operated at 3.3 V VCC
  • Power Down High-Impedance Inputs / Outputs
  • Over-Voltage Tolerance Inputs Facilitate 5 V to 3 V Translation
  • Proprietary Noise / EMI Reduction Circuitry
  • Ultra-Small MicroPak™ Packages
  • Space-Saving SC–74A and SC–88A Packages
  • These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

Logic Symbol

Figure 1 shows the logic symbol for the NC7SZ32. It represents a two-input OR gate where inputs are labeled A and B, and the output is labeled Y. The symbol indicates that the output Y is HIGH if either input A or input B (or both) is HIGH.

Marking Diagrams

Various package types are shown with their corresponding marking diagrams. For example, the SIP6 CASE 127EB shows a marking of HHKK XYZ. The UDFN6 CASE 517DP also shows HHKK XYZ. The SC-74A CASE 318BQ shows 7Z32 M·. The SC-88A CASE 419A-02 shows Z32 M·. The codes are explained: HH, 7Z32, Z32 = Specific Device Code; KK = 2-Digit Lot Run Traceability Code; XY = 2-Digit Date Code Format; Z = Assembly Plant Code; M = Date Code; · = Pb-Free Package (Microdot may be in either location).

Package Options and Ordering Information

Ordering Information

Part Number Top Mark Packages Shipping
NC7SZ32M5X 7Z32 SC-74A 3000 / Tape & Reel
NC7SZ32P5X Z32 SC-88A 3000 / Tape & Reel
NC7SZ32P5X-F22057 Z32 SC-88A 3000 / Tape & Reel
NC7SZ32L6X HH SIP6, MicroPak 5000 / Tape & Reel
NC7SZ32L6X-L22175 HH SIP6, MicroPak 5000 / Tape & Reel
NC7SZ32FHX HH UDFN6, MicroPak2 5000 / Tape & Reel

For information on tape and reel specifications, including part orientation and tape sizes, please refer to the Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Package Dimensions

SIP6 1.45x1.0 (CASE 127EB)

This section details the mechanical outline for the SIP6 1.45x1.0 package (CASE 127EB). It includes a top view, side view, bottom view, and a recommended land pattern. Key dimensions are provided in millimeters, with tolerances specified per ASME Y14.5M-2009. Notes indicate compliance with JEDEC standard MO-252 variation UAAD and that dimensions are in millimeters.

SC-74A (CASE 318BQ)

This section provides the mechanical outline for the SC-74A package (CASE 318BQ). It includes top, side, and end views, along with a recommended soldering footprint. Dimensions are provided in millimeters and inches, with tolerances per ASME Y14.5M, 1994. Notes specify controlling dimensions and maximum lead thickness. A generic marking diagram is also shown, indicating codes for device code, date code, and Pb-Free package status.

SC-88A (SC-70-5/SOT-353) (CASE 419A-02)

This section details the mechanical outline for the SC-88A package (CASE 419A-02), also known as SC-70-5/SOT-353. It includes top, side, and bottom views, a solder footprint, and a generic marking diagram. Dimensions are provided in both inches and millimeters, with notes on dimensioning and tolerances. Various pin styles are listed, though the datasheet pinout or pin assignment should be referred to for specific device configuration.

UDFN6 1.0x1.0, 0.35P (CASE 517DP)

This section presents the mechanical outline for the UDFN6 1.0x1.0, 0.35P package (CASE 517DP). It includes top, side, and bottom views, along with recommended land patterns for space-constrained and universal PCB applications. Dimensions are in millimeters, with tolerances per ASME Y14.5M, 2009. Notes confirm compliance with JEDEC standard MO-252.

Pin Configurations and Definitions

Figure 2 shows the top view of the SC-88A and SC-74A packages with pins labeled A (1), B (2), GND (3), Y (4), and VCC (5/6). Figure 3 shows the top-through view of the MicroPak package with similar pin assignments: A (1), B (2), GND (3), Y (4), NC (5), VCC (6).

Pin Definitions

Pin # SC-88A / SC74A Pin # MicroPak Name Description
1 1 A Input
2 2 B Input
3 3 GND Ground
4 4 Y Output
5 6 VCC Supply Voltage
- 5 NC No Connect

Function Table

The function table for Y = A + B is provided, showing all combinations of HIGH (H) and LOW (L) inputs for A and B, and the resulting output Y.

Inputs Output
A B Y
L L L
L H H
H L H
H H H

H = HIGH Logic Level, L = LOW Logic Level.

Electrical Characteristics

Absolute Maximum Ratings

This table lists the absolute maximum ratings for the device. Stresses exceeding these limits may damage the device or affect reliability.

Symbol Parameter Min Max Unit
VCC Supply Voltage -0.5 6.5 V
VIN DC Input Voltage -0.5 6.5 V
VOUT DC Output Voltage -0.5 6.5 V
IIK DC Input Diode Current - -50 mA
IOK DC Output Diode Current - -50 mA
IOUT DC Output Current - ±50 mA
ICC or IGND DC VCC or Ground Current - ±50 mA
TSTG Storage Temperature Range -65 +150 °C
TJ Junction Temperature Under Bias - +150 °C
TL Junction Lead Temperature (Soldering, 10 Seconds) - +260 °C
PD Power Dissipation in Still Air SC-74A - 390 mW
SC-88A - 332 mW
MicroPak-6 - 812 mW
MicroPak2™-6 - 812 mW
ESD Human Body Model, JEDEC: JESD22-A114 - 4000 V
Charge Device Model, JEDEC: JESD22-C101 - 2000 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

Recommended Operating Conditions

This table specifies the recommended operating conditions for the device to ensure proper functionality and reliability. Note 1 states that unused inputs must be held HIGH or LOW and may not float.

Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating - 1.65 5.50 V
Supply Voltage Data Retention - 1.50 5.50 V
VIN Input Voltage - 0 5.5 V
VOUT Output Voltage - 0 VCC V
TA Operating Temperature - -40 +85 °C
tr, tf Input Rise and Fall Times VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V
VCC = 3.3 V ±0.3 V 0 10 ns
VCC = 5.0 V ±0.5 V 0 5 ns
qJA Thermal Resistance SC-74A - 320 °C/W
SC-88A - 377 °C/W
MicroPak-6 - 154 °C/W
MicroPak2-6 - 154 °C/W

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Unused inputs must be held HIGH or LOW. They may not float.

DC Electrical Characteristics

This table details the DC electrical characteristics across different VCC voltages and temperatures.

Symbol Parameter VCC (V) Conditions TA = +25°C TA = -40 to +85°C Unit
Min Typ Max Min Max
VIH HIGH Level Input Voltage 1.65 to 1.95 - 0.65 VCC - - 0.65 VCC - V
2.30 to 5.50 - 0.70 VCC - - 0.70 VCC - V
VIL LOW Level Input Voltage 1.65 to 1.95 - - 0.35 VCC - 0.35 VCC - V
2.30 to 5.50 - - 0.30 VCC - 0.30 VCC - V
VOH HIGH Level Output Voltage 1.65 VIN = VIH or VIL, IOH = –100 µA 1.55 1.65 - 1.55 - V
1.80 - 1.70 1.80 - 1.70 - V
2.30 - 2.20 2.30 - 2.20 - V
3.00 - 2.90 3.00 - 2.90 - V
4.50 - 4.40 4.50 - 4.40 - V
VOL LOW Level Output Voltage 1.65 IOH = -4 mA 1.29 1.52 - 1.29 - V
2.30 IOH = -8 mA 1.90 2.15 - 1.90 - V
3.00 IOH = -16 mA 2.40 2.80 - 2.40 - V
3.00 IOH = -24 mA 2.30 2.68 - 2.30 - V
4.50 IOH = -32 mA 3.80 4.20 - 3.80 - V
VOH HIGH Level Output Voltage 1.65 VIN = VIH or VIL, IOL = 100 µA - 0.00 0.10 - 0.10 V
1.80 - 0.00 0.10 - 0.10 - V
2.30 - 0.00 0.10 - 0.10 - V
3.00 - 0.00 0.10 - 0.10 - V
4.50 - 0.00 0.10 - 0.10 - V
VOL LOW Level Output Voltage 1.65 IOL = 4 mA - 0.80 0.24 - 0.24 V
2.30 IOL = 8 mA - 0.10 0.30 - 0.30 V
3.00 IOL = 16 mA - 0.15 0.40 - 0.40 V
3.00 IOL = 24 mA - 0.22 0.55 - 0.55 V
4.50 IOL = 32 mA - 0.22 0.55 - 0.55 V
IIN Input Leakage Current 1.65 to 5.50 VIN = 5.5 V, GND - ±1 - ±10 µA
IOFF Power Off Leakage Current 0 VIN or VOUT = 5.5 V - 1 - 10 µA
ICC Quiescent Supply Current 1.65 to 5.50 VIN = 5.5 V, GND - 2.0 - 20 µA

AC Electrical Characteristics

This section provides AC electrical characteristics, including propagation delays and capacitances, with associated test circuits and waveforms.

Propagation Delay
Symbol Parameter VCC (V) Conditions TA = +25°C TA = -40 to +85°C Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay (Figure 4, 5) 1.65 CL = 15 pF, RL = 1 MΩ - 5.5 12.0 - 12.7 ns
1.80 - 4.6 10.0 - 10.5 ns
2.50 ±0.30 - 3.0 7.0 - 7.5 ns
3.30 ±0.30 - 2.4 4.7 - 5.0 ns
5.00 ±0.50 - 1.9 4.1 - 4.4 ns
3.30 ±0.30 CL = 50 pF, RL = 500 Ω - 3.0 5.2 - 5.5 ns
5.00 ±0.50 - 2.4 4.5 - 4.8 ns
CIN Input Capacitance 0.00 - - 4 - - pF
CPD Power Dissipation Capacitance (Note 2) (Figure 6) 3.30 - - 20 - - pF
5.00 - - 26 - - pF

2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic).

Test Circuits and Waveforms

Figure 4 shows the AC Test Circuit with load (CL) and source resistance (RL). Figure 5 illustrates the AC Waveforms, showing input and output signals with timing parameters like tPLH and tPHL. Figure 6 shows the ICCD Test Circuit.

Models: NC7SZ32M5X 2 Input OR Logic Gate, NC7SZ32M5X, 2 Input OR Logic Gate, OR Logic Gate, Logic Gate

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