STMicroelectronics Material Declaration Form

Document Version: IPC1752

Active Date: 2025-07-09

General Information

Form Type: Distribute

IPC: 1752

Version: 2

Subsectionals: A-D

Material Information: Material information

Manufacturing Information: Manufacturing information

Supplier Information

Company Name: STMicroelectronics

Contact Name: MDG CHAMPION

Contact Phone: Refer to Supplier Comment section

Contact Email: Refer to Supplier Comment section

Authorized Representative: MDGMaterial Declaration champion

Representative Title: Refer to Supplier Comment section

Representative Phone: Refer to Supplier Comment section

Representative Email: Refer to Supplier Comment section

Supplier Comment: Online Technical Support - STMicroelectronics: http://www.st.com/web/en/support/support.html

Response Date: 2025-07-09

Product Details

Mfr Item Number: STM32L562RET6P

Mfr Item Name: 645W*472XXXZ

Amount: 359

Unit of Measure: mg

Version: A

Manufacturing Site: 998Z

Unit Type: Each

ST ECOPACK Grade: ECOPACK® 2

Date: 2025-07-09

Manufacturing Information

J-STD-020 MSL Rating: 3

Bulk Solder Termination: Not Applicable

Package Designator: QFP

Classification Temperature: 260

Terminal Plating: Tin (Sn), matte, annealed

Package Size: 10x10

Package: 5W LQFP 64 10x10x1.4 10051434

Number of Reflow Cycles: 3

Terminal Base Alloy: Copper Alloy

Number of Instances: 64

Shape: Gull wing

Compliance Queries

RoHS Directive 2011/65/EU

Query: Product(s) meets EU RoHS requirement without any exemptions

Response: true

Query: Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)

Response: false

Query: Product(s) meets EU RoHS requirements by application of the selected exemption(s)

Response: false

Query: Product(s) does not meet EU RoHS requirements and is not under exemptions

Response: false

REACH - 21st January 2025

Query: Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

Response: true

Material Composition Declaration

Note: Substances present with less than 0.001mg will not be declared in this document.

Homogeneous MaterialMaterial GroupSubstance CategorySubstanceCASMass (mg)Unit of MeasureConcentration in Homogeneous Material (ppm)Concentration in Product (ppm)
Die or diesM-011 Other inorganic materialsdieSilicon (Si)7440-21-314.485mg91173840306.25
metallizationAluminium (Al)7429-90-50.064mg4032178.25
metallizationCopper (Cu)7440-50-80.598mg376341663.73
metallizationTantalum (Ta)7440-25-70.192mg12097534.79
metallizationTitanium (Ti)7440-32-60.007mg44819.81
metallizationTungsten (W)7440-33-70.007mg44819.81
PassivationSilicon Nitride12033-89-50.149mg9409415.95
PassivationSilicon Oxide7631-86-90.384mg241941069.57
Glue epoxy (EN4900GC)Other Organic MaterialsAcrylic resinProprietary0.064mg70000177.70
Polybutadiene derivativeProprietary0.018mg2000050.77
Butadiene copolymerProprietary0.014mg1500038.08
AcrylateProprietary0.049mg54000137.08
Epoxy resinProprietary0.027mg3000076.16
PeroxideProprietary0.007mg800020.31
AdditiveProprietary0.016mg1800045.69
MetalsSilver7440-22-40.716mg7850001992.81
Encapsualtion (EME-G700LAL-A)Other Organic MaterialsEpoxy ResinProprietary12.980mg5500036118.81
Phenol ResinProprietary4.956mg2100013790.82
GlassSilica(Amorphous)A60676-86-0188.800mg800000525364.48
GlassSilica(Amorphous)B7631-86-928.084mg11900078147.97
Organic CompoundsCarbon Black1333-86-41.180mg50003283.53
Bonding wire (Cu)Bonding WireCopper7440-50-80.804mg9655002236.64
MetalsPalladium7440-05-30.026mg3100071.81
MetalsGold7440-57-50.003mg35008.11
Plating anode (Sn)Other inorganic materialsTin7440-31-51.438mg10000004001.05
Leadframe (C7025 + Ag)Copper & its alloysCopper7440-50-8101.536mg973499282538.63
MetalsIron7439-89-62.377mg227906614.34
MetalsPhosphor7723-14-00.026mg25072.56
MetalsZinc7440-66-60.131mg1260365.69
MetalsSiliver7440-22-40.229mg2200638.51
MetalsLead7439-92-10.000mg10.29

PDF preview unavailable. Download the PDF instead.

v1 Microsoft Excel for Microsoft 365

Related Documents

Preview STMicroelectronics Material Declaration Form for STM32L552RET6Q
Official material declaration form from STMicroelectronics for the STM32L552RET6Q component, detailing material composition, RoHS compliance, and REACH information.
Preview STMicroelectronics STM32L072CZT7 Material Declaration - RoHS & REACH Compliance
Detailed material declaration for the STMicroelectronics STM32L072CZT7 microcontroller, including RoHS and REACH compliance status and full material composition breakdown.
Preview STMicroelectronics Material Declaration Form for STM32MP235FAK3
Material declaration form from STMicroelectronics detailing the composition, RoHS compliance, and REACH status for the STM32MP235FAK3 component, including detailed substance breakdown.
Preview STMicroelectronics STM32L073CBT6 Material Declaration
Material declaration form for the STMicroelectronics STM32L073CBT6 component, detailing substance compliance with RoHS and REACH regulations, and material composition.
Preview STMicroelectronics STM32MP253FAK3 Material Declaration Form (IPC-1752)
This document provides the material declaration for the STMicroelectronics STM32MP253FAK3 component, adhering to the IPC-1752 standard. It details material composition, RoHS compliance, and REACH substance information.
Preview STMicroelectronics Material Declaration Form for STM32MP255FAK3
This document provides a detailed material declaration for the STMicroelectronics STM32MP255FAK3 component, following the IPC-1752 standard. It includes information on RoHS and REACH compliance, manufacturing details, and a comprehensive breakdown of the material composition.
Preview STMicroelectronics Material Declaration for STM32G473CET6 (IPC1752)
Detailed material declaration form from STMicroelectronics for the STM32G473CET6 component, including substance composition, RoHS, and REACH compliance data, following IPC1752 standard.
Preview STMicroelectronics STM32L562RET6 Material Declaration Form
Detailed material declaration for the STMicroelectronics STM32L562RET6 component, providing comprehensive information on its composition, compliance with RoHS and REACH directives, and manufacturing details, adhering to IPC-1752 standards.