MK19 Bluetooth Module
“
Product Information
Specifications
- Product Name: MK19 Bluetooth Module
- Version: 1.0
- Manufacturer: MOKO TECHNOLOGY LTD.
- Website: www.mokosmart.com
Product Usage Instructions
1. Features and Benefits
The MK19 Bluetooth Module is designed for various applications
in the Internet of Things (IoT), advanced wearables, computer
peripherals, and interactive entertainment devices.
2. Applications
- Smart home sensors and controllers
- Industrial IoT sensors and controllers
- Health/fitness sensor and monitor devices
- Wireless payment enabled devices
- Mouse, keyboard, multi-touch trackpad
- Remote controls
- Gaming controllers
3. Product Options
3.1 Hardware Options
The MK19 series offers two models: MK19A and MK19B. The
difference lies in the antenna design. MK19A features a
high-performance PCB antenna, while MK19B requires an external
2.4Ghz antenna connected to a u.FL connector.
3.2 Firmware Options
The default firmware for MK19 series modules is the MOKO
MKBN-L01 series firmware, providing UART wireless transparent
transmission. Custom firmware development is also available through
MOKO Smart.
3.3 Ordering Information
For ordering information and custom model requests, please
contact the sales team at MOKO Smart.
Frequently Asked Questions (FAQ)
Q: Can I use the MK19 module for gaming controllers?
A: Yes, the MK19 module is suitable for gaming controllers as
one of its applications.
Q: How do I select the appropriate antenna for the MK19B
model?
A: The MK19B model requires an external 2.4Ghz antenna connected
to the u.FL connector. You can consult with MOKO Smart’s
development team for assistance in selecting a suitable
antenna.
“`
Datasheet
MK19 Bluetooth Module Datasheet
MK19 Bluetooth Module
Datasheet
Version 1.0
MOKO TECHNOLOGY LTD.
www.mokosmart.com
Revision History
Version V1.0 V1.1
Description Initial release Updated pictures
MK19 Bluetooth Module
Datasheet
Contributor(s) YK Huang YK Huang
Date December 25, 2024 June 13, 2025
1
MK19 Bluetooth Module
Datasheet
Contents
Revision History …………………………………………………………………………………………………………….. 1 1 Instructions ………………………………………………………………………………………………………………… 3
1.1 Features and Benefits …………………………………………………………………………………………… 4 1.2 Applications …………………………………………………………………………………………………………..5 1.3 Product Options …………………………………………………………………………………………………….6
1.3.1 Hardware Options …………………………………………………………………………………………… 6 1.3.2 Firmware Options …………………………………………………………………………………………… 6 1.3.3 Ordering Information ………………………………………………………………………………………. 6 2 Specifications …………………………………………………………………………………………………………….. 7 3 Hardware Design ………………………………………………………………………………………………………… 8 3.1 Block Diagram ……………………………………………………………………………………………………….8 3.2 Pin-out and Pin Assignments ………………………………………………………………………………… 8 4 Mechanical Details ……………………………………………………………………………………………………. 13 4.1 PCBA Mechanical Dimensions …………………………………………………………………………….. 13 4.2 PCB Land Pads Dimensions ………………………………………………………………………………… 14 4.3 u.FL Connector Dimensions ………………………………………………………………………………….15 5. Mounting Design Suggestions ………………………………………………………………………………….. 16 5.1 Recommended Mounting and PCB Layout …………………………………………………………… 16 5.2 Mechanical Enclosure …………………………………………………………………………………………. 17 6. Cautions ………………………………………………………………………………………………………………….. 18 6.1 Reflow Soldering ………………………………………………………………………………………………….18 6.2 Usage Condition Notes ……………………………………………………………………………………….. 19 6.3 Storage Notes …………………………………………………………………………………………………….. 20 Contact ………………………………………………………………………………………………………………………..21
2
MK19 Bluetooth Module
Datasheet
1 Instructions
MK19 is powerful, highly flexible and cost-effective Bluetooth module based on world-leading Nordic® Semiconductor nRF54L15 SoC solution, which integrates an ultra-low power multi-protocol 2.4GHz radio and MCU functionality featuring a 128 MHz Arm® CortexTM-M33 processor, comprehensive peripheral set, and scalable memory configurations to 1.5 MB NVM and 256 KB RAM. MK19 is suited to enable a broad range of applications. The multi-protocol 2.4 GHz radio supports the latest Bluetooth® 6.0 features including Bluetooth Channel Sounding, as well as 802.15.4-2020 for standards such as Thread, Matter, and Zigbee, and a proprietary 2.4 GHz mode supporting up to 4 Mbps for higher throughput. MK19 module brings out all nRF54L15 hardware features and capabilities like RISC-V Coprocessor, high-speed SPI, SPIM, UART, Global RTC, NFC, and up to +8dBm Tx Power and more. MK19 module follows the size and package of most MOKO Bluetooth modules such as the MK02 (nRF52832 SoC), MK07 (nRF52833 SoC), MK08 (nRF52840 SoC) and MK13 (nRF5340 SoC), allowing you to easily and quickly upgrade your hardware to the latest and powerful nRF54L15 Bluetooth solution without re-designing hardware. MK19 module will be programmed using the default MOKO MKBN series firmware and client’s own firmware can be programmed for mass production. After you choose MK19 series module, MOKO Smart will provide technical support for your development. We can power demanding applications, while simplifying designs and reducing BOM costs.
3
MK19 Bluetooth Module
Datasheet 1.1 Features and Benefits
Multi-protocol radio supporting o Bluetooth 6.0 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps o IEEE 802.15.4-2020 (Thread, Matter, Zigbee) o Proprietary 2.4 GHz (up to 4 Mbps data rates)
MCU o Arm® CortexTM-M33, 128 MHz o 1524 KB non-volatile memory (RRAM) and 256 KB RAM o 505 EEMBC CoreMark® score running from non-volatile memory, 3.95 CoreMark per MHz o Single-precision floating-point unit (FPU) o Memory protection unit (MPU) o Digital signal processing (DSP) instructions
Peripherals o 128 Mhz RISC-V Coprocessor o Two realtime counters (RTC), and one global RTC (GRTC) that can run in System OFF mode and implement a shared system timer. o Five fully featured serial interfaces with EasyDMA, supporting I2C, SPI controller/peripheral, and UART o 14-bit ADC o Three pulse width modulator (PWM) units with EasyDMA o I2S two channel Inter-IC sound interface o Pulse density modulation (PDM) interface o Near field communication (NFC) o Two quadrature decoders (QDEC) o Embedded inductors for DC/DC converter o 32.768 kHz crystal oscillator o 34 half-hole pins and 4 debug pads o 28 GPIOs o 1.7V to 3.6V supply voltage
4
1.2 Applications
MK19 Bluetooth Module
Datasheet
Internet of things (IOT) o Smart home sensors and controllers o Industrial IoT sensors andcontrollers
Advanced wearables o Health/fitness sensor and monitor devices o Wireless payment enabled devices
Advanced computer peripherals and I/O devices o Mouse o Keyboard o Multi-touch trackpad
Interactive entertainment devices o Remote controls o Gaming controllers
5
1.3 Product Options
MK19 Bluetooth Module
Datasheet
1.3.1 Hardware Options
There are two different models (MK19A and MK19B) of MK19 series Bluetooth modules. Both models have same dimensions and pin assignments. The difference is in the antenna design. MK19A embeds a high-performance PCB antenna. MK19B uses a u.FL connector (receptacle) and requires an external 2.4Ghz antenna. MOKO smart development team can assist you in selecting high-performance antennas that suit your needs.
MK19A PCB antenna is used. No need to design another antenna. u.FL connector will not be mounted on the PCB.
MK19B The PCB antenna is disabled. You need to select an external 2.4Ghz antenna to connect to the u.FL connector.
Figure 1: MK19A and MK19B
1.3.2 Firmware Options
For customers to use, MK19 series modules will be programmed default MOKO MKBN-L01 series firmware, which has the functions of UART Wireless Transparent Transmission.
MOKO Smart can help you develop the firmware and can also program your own firmware to modules when manufacture.
Firmware Version
Firmware Features
MKBN-L01
UART wireless transparent transmission
Note: This document is a Hardware Datasheet only it does not cover the software aspects of the MK19 If you want to get more information about firmware or SDKs of MK19, please contact sales of MOKO Smart.
1.3.3 Ordering Information
Product Model
MK19A MK19B
Antenna
PCB u.FL connector
32.768kHz XTAL
Yes Yes
Firmware Version
MKBN-L01 MKBN-L01
Remark
Default model Default model
MOKO Smart can provide the default model modules as samples to you to test or develop without MOQ. But if you want the custom models, there will be a MOQ requirement.
6
MK19 Bluetooth Module
Datasheet
Please contact sales team of MOKO Smart to get more ordering information.
2 Specifications
Detail
Chip Bluetooth Version MCU RAM Flash Tx Power
Receiver Sensitivity
Clock Control
Power Supply Power Regulator
Power Consumption
Antenna Quantity of Pin GPIO Operating Temperature
Module Dimensions
Description
nRF54L15 Bluetooth 6.0 ARM® Cortex®-M33, 128 MHz 256 KB 1524 KB non-volatile memory (RRAM) -46 dBm to +8 dBm, 1 dB step size from -10 dBm to +8 dBm
-96 dBm sensitivity in 1 Mbps Bluetooth® LE mode -104 dBm sensitivity in 125 kbps Bluetooth® LE mode -101 dBm sensitivity in IEEE 802.15.4 with a 37 bytes packet length
On-chip 128 MHz phase-locked loop (PLL) with internal oscillator 32MHz crystal oscillator Embedded 32.768 kHz RC oscillator and external 32.768kHz crystal oscillator
1.7V to 3.6V DC Switching regulator for DC/DC buck setup
Peak current 10.0 mA (BLE TX 1 Mbps @ +8 dBm and 3.0V) 3.0 uA (System ON IDLE with GRTC (XOSC) and 256 KB RAM) 0.6 uA (System OFF)
MK19A PCB trace antenna MK19B u.FL connector
34 half-hole pins and 4 round debug pad pins
28
-40 to 85°C Extended Industrial temperature -40 to +105°C can be customized
Length: 21mm±0.2mm Width: 13.8mm±0.2mm Height: 2.3mm+0.1mm/-0.15mm
7
3 Hardware Design
3.1 Block Diagram
MK19 Bluetooth Module
Datasheet
Figure 2: MK19 Block Diagram
3.2 Pin-out and Pin Assignments
Figure 3: MK19 pin diagram (Rear View)
8
Module Pin No.
1
nRF54L15 Pin No.
28
nRF54L15 Pin Name
P0.03 GRTCPWM
MK19 Bluetooth Module
Datasheet
Function Description
Dedicated function
Digital I/O Digital I/O
General purpose I/O GRTC PWM output
GRTC
2
29
P0.04
Digital I/O
GRTCLFCLKOUT Digital I/O
General purpose I/O GRTC LF clock output
GRTC
3
37
4
38
P1.09 ASO [2] RADIO [0] P1.10 ASI [2] RADIO [1]
Digital I/O Digital I/O Digital I/O
Digital I/O Digital I/O Digital I/O
General purpose I/O TAMPC active shield 2 output RADIO DFEGPIO
General purpose I/O TAMPC active shield 2 input RADIO DFEGPIO
TAMPC RADIO
TAMPC RADIO
5
39
6
40
P1.11 ASO [3] RADIO [2] AIN4
P1.12 ASI [3] RADIO [3] AIN5
Digital I/O Digital I/O Digital I/O Analog input
Digital I/O Digital I/O Digital I/O Analog input
General purpose I/O TAMPC active shield 3 output RADIO DFEGPIO Analog input
General purpose I/O TAMPC active shield 3 input RADIO DFEGPIO Analog input
TAMPC RADIO
TAMPC RADIO
7
41
P1.13 RADIO [4] AIN6
Digital I/O Digital I/O Analog input
General purpose I/O RADIO DFEGPIO Analog input
RADIO
8
42
P1.14 RADIO [5] AIN7
Digital I/O Digital I/O Analog input
General purpose I/O RADIO DFEGPIO Analog input
RADIO
9
10,22,36,47,48 VDD
Power
Power supply
10
44
VSS, Die pad
Power
Ground
11
3
P1.02 NFC1
Digital I/O NFC input
General purpose I/O NFC antenna connection
12
4
P1.03 NFC2
Digital I/O NFC input
General purpose I/O NFC antenna connection
13
5
14
6
P1.04 ASO [0] AIN0
P1.05 ASI [0] RADIO [6] AIN1
Digital I/O Digital I/O Analog input
Digital I/O Digital I/O Digital I/O Analog input
General purpose I/O TAMPC active shield 0 output Analog input
General purpose I/O TAMPC active shield 0 input RADIO DFEGPIO Analog input
TAMPC
TAMPC RADIO
9
Module Pin No.
15
nRF54L15 Pin No.
7
nRF54L15 Pin Name
P1.06 ASO [1] AIN2
16
8
P1.07 ASI [1] AIN3
17
9
P1.08 CLK16M EXTREF
18
11
P2.00
19
26
20
25
21
12
SWDCLK SWDIO
P2.01
22
13
P2.02
23
14
24
15
P2.03 P2.04
25
16
26
17
P2.05 P2.06
MK19 Bluetooth Module
Datasheet
Function Description
Dedicated function
Digital I/O Digital I/O Analog input
General purpose I/O TAMPC active shield 1 TAMPC output Analog input
Digital I/O Digital I/O Analog input
General purpose I/O TAMPC active shield 1 TAMPC output Analog input
Digital I/O
General purpose I/O
Digital I/O
GRTC HF clock output
Analog input External reference for SAADC
Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O SPIM DCX UARTE RXD QSPI D3
SPIM00/20 UARTE00/20 FLPR (QSPI)
Debug
Serial wire clock. Input with onchip pull-up.
Debug
Digital I/O Digital I/O Digital I/O Digital I/O
Serial
wire
data.
Bidirectional
with standard-drive and
on-chip
pull-down.
General purpose I/O SPIM SCK SPIS SCK QSPI SCK
SPIM00/20 SPIS00/S20 FLPR
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O SPIM SDO SPIS SDO UARTE TXD QSPI D0 Serial wire output (SWO)
SPIM00/20 SPIS00/20 UARTE00/20 FLPR Trace
Digital I/O Digital I/O
General purpose I/O QSPI D2
FLPR
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O SPIM SDI SPIS SDI UARTE CTS QSPI D1
SPIM00/20 SPIS00/20 UARTE00/20 FLPR
Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O SPIM CS UARTE RTS QSPI CS
SPIM00/20 UARTE00/20 FLPR
Digital I/O
General purpose I/O
10
Module nRF54L15 nRF54L15
Pin No. Pin No.
Pin Name
TRACECLK
MK19 Bluetooth Module
Datasheet
Function
Digital I/O Digital I/O Digital I/O
Description
SPIM SCK SPIS SCK Trace clock
Dedicated function
SPIM00/21 SPIS20/21 Trace
27
18
P2.07 TRACEDATA [0] SWO
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O Trace data Serial wire output (SWO) SPIM DCX UARTE RXD
Trace Trace SPIM00/21 UARTE00/21
28
19
P2.08
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O Trace data SPIM SDO SPIS SDO UARTE TXD
Trace SPIM00/21 SPIS00/21 UARTE00/21
29
20
P2.09
Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O Trace data SPIM SDI SPIS SDI UARTE CTS
Trace SPIM00/21 SPIS00/21 UARTE00/21
30
21
P2.10
Digital I/O Digital I/O Digital I/O Digital I/O
General purpose I/O Trace data SPIM CS UARTE RTS
Trace SPIM00/21 UARTE00/21
31
23
P0.00
Digital I/O
General purpose I/O
32
24
P0.01
Digital I/O
General purpose I/O
33
30
34
27
nRESET P0.02
Reset Digital I/O
Pin reset with on-chip pull-up General purpose I/O
VCC (round pad)
10,22,36,47,48 VDD
Power
Power supply
GND
44
(round
pad)
VSS, Die pad
Power
Ground
DIO
25
(round
pad)
CLK
26
(round
pad)
SWDIO SWDCLK
Debug Debug
Serial
wire
Bidirectional
data.
with standard-drive and on-chip
pull-down.
Serial wire clock. Input with onchip pull-up.
11
MK19 Bluetooth Module
Datasheet
Note: 1. Please refer to Nordic nRF54L15 / nRF54L10 / nRF54L05 Datasheet for detailed descriptions and
features supported about the SoC pin assignments. 2. Package of nRF54L15 SoC embedded on MK19 Bluetooth module is QFN48 6.0×6.0 mm.
12
MK19 Bluetooth Module
Datasheet
4 Mechanical Details
4.1 PCBA Mechanical Dimensions
MK19A and MK19B Bluetooth modules have the same dimensions.
Symbol
Length Width Height (PCB only) Height (with shield)
Figure 4: MK19 PCBA dimensions
Min.
-0.2mm -0.2mm -0.08mm -0.15mm
Typ.
21mm 13.8mm 0.8mm 2.3mm
Max.
+0.2mm +0.2mm +0.08mm +0.1mm
13
MK19 Bluetooth Module
Datasheet 4.2 PCB Land Pads Dimensions
Figure 5: MK19 PCB land pads dimensions (TOP View)
Symbol
Half-hole Pad (Bottom) Diameter of Half-hole Diameter of Central Round pad
Typ.
0.8mm x 0.8mm 0.55mm 1mm
14
MK19 Bluetooth Module
Datasheet 4.3 u.FL Connector Dimensions
MK19B has mounted a micro SMT u.FL series connector (receptacle), which needs an external
2.4Ghz antenna to connect. The model of the connector is u.FL-R-SMT-1(80). According to the dimensions of the connector to choose an antenna with a right plug which can connect to the receptacle appropriately.
Figure 6: u.FL-R-SMT-1(80) Dimensions
Manuf act ur er shenzhen Ant e Communi cat i on Technol ogy Co. , LTD M/ N: MK19B Type FPC Maxi mum gai n 3. 28dbi
15
MK19 Bluetooth Module
Datasheet
5. Mounting Design Suggestions
5.1 Recommended Mounting and PCB Layout
You can refer to the following references for the mounting design and PCB layout of the MK19 module, especially for the MK19A model which has PCB on-board antenna. For external antenna modules (MK19B needs to connect an external antenna to the u.FL connector), you also need to refer to the external antenna design requirements. The recommended mounting and PCB layout suggestion: Locate MK19 series module close to the edge of the host PCB (mandatory for MK19A
for on-board PCB trace antenna to radiate properly). Ensure there is no copper in the antenna keep-out area on any layers of the host PCB.
Keep all mounting hardware and metal clear of the area to allow proper antenna radiation. Keep the antenna area as far away as possible from the power supply and metal components. Ensure no exposed copper is on the underside of the module. A different host PCB thickness dielectric will have small effect on antenna. Use solid GND plane on inner layer (for best EMC and RF performance). All module GND pins must be connected to the host PCB GND. Place GND vias close to module GND pads as possible. Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect the copper flood to the inner GND plane. If GND flood copper is on the bottom of the module, then connect it with GND vias to the inner GND plane. Use a good layout method to avoid excessive noise coupling with signal lines or supply voltage lines.
Figure 7: Recommended Module Mounting Examples
16
MK19 Bluetooth Module
Datasheet 5.2 Mechanical Enclosure
Care should be taken when designing and placing the MK19 series module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer. Placement of metal/plastic enclosure: Minimum safe distance for metal parts without seriously compromising the antenna
(tuning) is 40 mm top/bottom and 30 mm left or right. Metal close to the series module antenna (bottom, top, left, right, any direction) will
have degradation on the antenna performance. The amount of that degradation is entirely system dependent, meaning you will need to perform some testing with your host application. Any metal closer than 20 mm will begin to significantly degrade performance (S11, gain, radiation efficiency). It is best that you test the range with a mock-up (or actual prototype) of the product to assess effects of enclosure height (and materials, whether metal or plastic).
17
6. Cautions
MK19 Bluetooth Module
Datasheet
6.1 Reflow Soldering
Reflow soldering is a vitally important step in the SMT process. The temperature curve associated with the reflow is an essential parameter to control to ensure the correct connection of parts. The parameters of certain components will also directly impact the temperature curve selected for this step in the process.
The standard reflow profile has four zones: preheat, soak, reflow, cooling. The profile describes the ideal temperature curve of the top layer of the PCB.
During reflow, modules should not be above 260°C and not for more than 30 seconds.
Figure 8: Temperature-Time Profile for Reflow Soldering
Specification
Temperature Increase Rate
Temperature Decrease Rate
Preheat Temperature
Preheat Period (Typical)
Soak Temp Increase Rate
Soak Temperature
Soak Period
Liquidus
Temperature
(SAC305)
Time Above Liquidous
Reflow Temperature
Absolute Peak Temperature
Value
<2.5°C/s Free air cooling 0-150°C 40-90s 0.4-1°C/s 150-200°C 60-120s 220°C 45-90s 230-250°C 260°C
18
MK19 Bluetooth Module
Datasheet
Figure 9: Example of MOKO Smart SMT reflow soldering
6.2 Usage Condition Notes
Follow the conditions written in this specification, especially the recommended condition ratings about the power supply applied to this product.
The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47Uf directly at the module).
Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation before assembly on the final products.
The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes.
This product away from other high frequency circuits. Keep this product away from heat. Heat is the major cause of decreasing the life of
these products. Avoid assembly and use of the target equipment in conditions where the products’
temperature may exceed the maximum tolerance. This product should not be mechanically stressed when installed.
19
MK19 Bluetooth Module
Do not use dropped products.
Datasheet
Do not touch, damage or soil the pins.
Pressing on parts of the metal shield or fastening objects to the metal shield will cause damage.
6.3 Storage Notes
The module should not be stressed mechanically during storage. Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance will be adversely affected: o Storage in salty air or in an environment with a high concentration of corrosive gas. o Storage in direct sunlight o Storage in an environment where the temperature may be outside the range
specified. o Storage of the products for more than one year after the date of delivery storage
period. Keep this product away from water, poisonous gas and corrosive gas. This product should not be stressed or shocked when transported.
20
MK19 Bluetooth Module
Datasheet
© Copyright 2024 MOKO TECHNOLOGY. All Rights Reserved. Any information furnished by MOKO TECHNOLOGY LTD. is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of MOKO TECHNOLOGY LTD. materials or products rests with the end user since MOKO TECHNOLOGY LTD. cannot be aware of all potential uses. MOKO TECHNOLOGY LTD. makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any MOKO TECHNOLOGY LTD. materials or products for any specific or general uses. MOKO TECHNOLOGY LTD. or any of its affiliates shall not be liable for incidental or consequential damages of any kind. All MOKO TECHNOLOGY LTD. products are sold pursuant to the MOKO TECHNOLOGY LTD. Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. Other marks may be the property of third parties. Nothing herein provides a license under any MOKO TECHNOLOGY LTD. or any third-party intellectual property right.
FCC Statements
This device complies w it h part 15 of t he FCC Rules. Operat ion is subject t o t he follow ing t w o condit ions: (1) This device may not cause harmful int erference, and (2) t his device must accept any int erference received, including int erference t hat may cause undesired operat ion. Changes or modificat ions not expressly approved by t he part y responsible for compliance could void t he user’s aut horit y t o operat e t he equipment . FCC Radiat ion Exposure St at ement This modular complies w it h FCC RF radiat ion exposure limit s set fort h for an uncont rolled environment . This t ransmit t er must not be co-locat ed or operat ing in conjunct ion w it h any ot her ant enna or t ransmit t er.
The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction.
If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2AO94-MK19 Or Contains FCC ID: 2AO94-MK19 When the module is installed inside another device, the user manual of this device must contain below warning statements: 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer’s instructions as described in the user documentation that comes with the product. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
Contact
MOKO TECHNOLOGY LTD.
An original manufacturer for IoT smart devices
Address: 4F, Building 2, Guanghui Technology Park, MinQing Rd, Longhua, Shenzhen, Guangdong, China E-mail: Support_BLE@mokotechnology.com Website: www.mokosmart.com
21
Documents / Resources
 |
MOKO SMART MK19 Bluetooth Module [pdf] Owner's Manual MK19, MK19 Bluetooth Module, Bluetooth Module, Module |