IS2540XSR and IS2541XSR Manual

Introduction

The IS2540XSR and IS2541XSR BLE Modules are developed to implement wireless communication for Digital Door Lock (DDL) systems, enabling functionality outside the door.

Module Configuration

D_1: IS2540XSR with Antenna

Back view: The back view of the D_1 module (IS2540XSR) shows a green printed circuit board with a central silver integrated circuit (IC) chip, several smaller surface-mount components, and a row of connector pins.

Front view: The front view of the D_1 module (IS2540XSR) displays the same green PCB, featuring a larger square chip and a distinct green antenna element integrated onto the board.

D_2: IS2541XSR with Antenna

Back view: The back view of the D_2 module (IS2541XSR) presents a green printed circuit board with a central silver integrated circuit (IC) chip, various smaller surface-mount components, and connector pins.

Front view: The front view of the D_2 module (IS2541XSR) reveals the green PCB with a prominent square chip and an integrated green antenna element.

Note: D_1 and D_2 modules cannot operate independently. They require control from the main MCU on the digital doorlock main board.

Connection to DDL Main Board and Operation

Connection Diagram: The diagram illustrates how the D_1 and D_2 modules connect to the DDL MAIN BOARD. Yellow wires are shown connecting the modules to the main board, indicating the data pathways.

Communication Flow Diagram: This diagram depicts the wireless communication process. When people touch the door lock, the DDL Main Board wakes D_1 to transmit a BLE signal to the front. Simultaneously, D_1 sends a signal to D_2, which transmits a different RF signal. This setup allows a smartphone placed at the back of the DDL to receive a normal BLE signal from D_1 ('Well communicatinon'). If the smartphone is positioned outside the door, it will not establish communication ('No communicatinon').

Operational Details: D_1 functions as a standard BLE module. D_2 generates an RF signal in response to any RF signal transmitted by D_1. From a data transfer perspective, D_1 relays data from the smartphone to the DDL Main Board only after a successful BLE connection is established between D_1 and the smartphone.