10GBASE-T SFP+ Copper RJ-45 100m Transceiver

Product Overview

The FS SFP-10G-T-100 is a high-performance, integrated duplex data link for bi-directional communication over copper cable. It is designed for high-speed communication links requiring 10 Gigabit Ethernet over Cat 7 cable at XFI to Copper Auto-negotiation mode. The module is compliant with Gigabit Ethernet and 1000BASE-T standards (IEEE 802.3-2012, IEEE 802.3ab), supporting 100/1000Base-T Copper data rates up to 100 meters over twisted-pair category 5 cable. It is a multi-rate copper SFP+ module supporting 100M, 1G, 2.5G, 5G, and 10GBase-T Ethernet speeds. Note that for downgraded speeds (100M-5G), manual speed configuration on the local switch port is required as the module does not support auto-negotiation for these speeds.

Key Features:

• Supports XFI(SFI) or SGMII to Copper Auto-negotiation.
• Supports Unshielded and Shielded Cable.
• 10G BASE-T Operation in Host Systems with XFI(SFI) Interface.
• Supports MDI/MDIX Crossover.
• 10G BASE-T Supports Links Up to 100m Using Cat 6a/7 Cable.
• 3.3V Single Power Supply.
• Power Consumption 1.8W MAX. @100m.
• Hot-pluggable SFP Footprint.
• 100/1000 BASE-T Operation Requires the Host System to Have an SGMII Interface.
• 100/1000 BASE-T or 2.5/5G BASE-T Supports Links Up to 100m Using Cat 5E Cable or Better.
• 0 to 70°C Operating Temperature Range.
• Fully Metallic Enclosure for Low EMI.
• Compact RJ-45 Connector Assembly.
• Detailed Product Information in EEPROM.
• Access to I2C -Wire Serial Bus Interface for Serial ID and PHY Register Access.

Compliance:

• SFF-8431, SFF-8432 and SFF-8472
• SFP MSA
• IEEE 802.3-2012, IEEE 802.3az
• CE, FC, RoHS, REACH Compliant

Product Specifications

I. General Specifications

Notes:

• 1. Automatic crossover detection is enabled. External crossover cable is not required.
• 2. 10GBASE-T operation requires the host system to have an XFI(SFI) interface with no clocks.
• 3. 10/100/1000 BASE-T operation requires the host system to have an SGMII interface with no clocks for all part numbers except HTSFPXG-11x1TF.

II. Environmental Specifications

III. +3.3V Electrical Power Interface

The SFP+ Copper Transceiver has an input voltage range of 3.3 V ± 5%. The 4 V maximum voltage is not allowed for continuous operation.

Note: Power consumption and surge current are higher than the specified values in the SFP MSA.

IV. Low-Speed Signals

MOD_DEF (1) (SCL) and MOD_DEF (2) (SDA) are open drain CMOS signals. Both MOD_DEF (1) and MOD_DEF (2) must be pulled up to host_Vcc.

V. High-Speed Electrical Interface

All high-speed signals are AC-coupled internally.

Transmission Line-SFP+

Host-SFP+

XFI Transmitter Performance Specifications

XFI Differential CMOS Data Output

XFI Receiver Input Performance Specifications

VI. Serial Communication Protocol

VII. Serial ID Memory Contents

The Copper SFP provides standard serial ID information compliant with SFP MSA, which can be accessed with address of A0h via the 2-wire serial CMOS EEPROM protocol.

Base ID Fields

Extended ID Fields

Vendor Specific ID Fields

VIII. Pin Definition

Figure 1: Diagram of Host Board Connector Block Pin Numbers and Names

[Diagram description: A table showing pin numbers, signal names, descriptions, and MSA notes for the SFP+ connector. Key signals include VEE_T (Transmitter Ground), TFAULT (Transmitter Fault), TDIS (Transmitter Disable), MOD_DEF (Module Definition pins for Serial ID), and Rate Select.]

Notes:

• 1. TX Fault is not used and is always tied to ground.
• 2. TX Disable as described in the MSA is not applicable to the module, but is used for convenience as an input to reset the internal ASIC. This pin is pulled up within the module with a 4.7 Kohm resistor. Low (0–0.8 V): Transceiver on. Between (0.8 V and 2.0 V): Undefined. High (2.0–3.465 V): Transceiver in reset disable state. Open: Transceiver in reset disable state.
• 3. Mod-Def 0, 1, 2. These are the module definition pins. They should be pulled up with a 4.7-10 Kohm resistor on the host board to a supply less than VCCT+ 0.3 V or VCCR + 0.3 V. Mod Def 0 is tied to ground to indicate that the module is present. Mod-Def 1 is clock line of two wire serial interface for optional serial ID. Mod-Def 2 is data line of two wire serial interface for optional serial ID.
• 4. This pin is open drain CMOS output signals. They should be pulled up with a 4.7-10 Kohm resistor on the host board to a supply less than VCCT + 0.3 V or VCCR + 0.3 V. (see Table 3. Low-Speed Signals, Electronic Characteristics)
• 5. RD-/+: These are the differential receiver outputs. They are ac coupled 100 ohm differential lines which should be terminated with 100 ohm differential at the user SerDes. The ac coupling is done inside the module and is thus not required on the host board.
• 6. VCCR and VCCT are the receiver and transmitter power supplies. They are defined as 3.3 V ± 5% at the SFP connector pin. The associated in-rush current will typically be no more than 30 mA above steady state after 500 nanoseconds.
• 7. TD-/+: These are the differential transmitter inputs. They are ac coupled differential lines with 100 ohm differential termination inside the module. The ac coupling is done inside the module and is thus not required on the host board.

IX. Typical Application Circuit

Figure 2: Recommended Interface Circuit

[Diagram description: A schematic showing the interface between a Host Board (containing an XFI or SGMII/802.3 MAC Controller) and the SFP module. It illustrates connections for TD+, TD-, RX_LOS, MOD_DEF signals, and power supply (V_SUPPLY, VCC_T, VCC_R) with associated filtering components like capacitors (10 uF, 0.1 uF) and inductors (1 uH). The diagram also shows the connection to an RJ45 Jack & Magnetics for CAT5 cable.]

X. Typical Application Circuit

Figure 3: Recommended Host Board Power Supply Circuit

[Diagram description: A schematic illustrating the power supply circuit for the SFP module from the Host Board. It shows VccT and VccR connections from the Host Board to the SFP Module, with filtering components including 0.1 uF capacitors and 1 uH inductors, connected to a 3.3 V supply.]

XI. Mechanical Diagram

Figure 4: Mechanical Diagram of Copper SFP+

[Diagram description: Multiple views (side, top, front) of the copper SFP+ transceiver, showing its physical dimensions in millimeters. Key dimensions include length (66.31 mm), height (13.7 mm, 13.5 mm), and width (e.g., 18.5 mm). The RJ45 connector is clearly visible at the front.]

Test Center

I. Compatibility Testing

Each transceiver has been tested in host devices from over 200 vendors to ensure full compatibility. Examples of tested equipment include:

• Cisco Catalyst C9500-24Y4C
• Cisco MS425-16
• Dell EMC Networking Z9100-ON
• Brocade VDX 6940-144S
• Force10™ S60-44T
• HUAWEI S6720-30L-HI-24S

For more information on the test bed network equipment, users can refer to the "Test Bed PDF".

II. Performance Testing

Transceivers are fully tested using advanced analytical equipment to ensure that they work perfectly on user devices. Tests include:

• TX/RX Signal Quality Testing: Using an all-in-one tester with integrated 4ch BERT and sampling oscilloscope, and variable optical attenuator. Tests include Eye Pattern Measurements (Jitter, Mask Margin), Average Output Power, OMA, Extinction Ratio, Receiver Sensitivity, and BER Curve.
• Reliability and Stability Testing: Subjecting transceivers to dramatic temperature changes in a thermal shock chamber. Tested ranges include Commercial (0 °C to 70 °C), Extended (-5 °C to 85 °C), and Industrial (-40 °C to 85 °C).
• Transfer Rate and Protocol Testing: Testing actual transfer data rate and transmission ability under different protocols (Ethernet, Fibre Channel, SOH/SONET, CPRI) using Network Master Pro.
• Optical Spectrum Evaluation: Evaluating parameters like Center Wavelength, Level, OSNR, SMSR, and Spectrum Width using an Optical Spectrum Analyzer to meet industry standards.

Order Information