Package Outline Dimensions and Suggested Pad Layout
X1-WLB1010-9 (Type A1)
Package Outline Dimensions
This section details the physical dimensions of the X1-WLB1010-9 (Type A1) package.
The package is a square-based component with solder bumps on the underside. It features a Pin #1 indicator, typically a circle or dot, on one corner of the top surface. Key dimensions are labeled:
- D: Overall width of the package body.
- E: Overall length of the package body.
- A: Maximum height of the package.
- A1: Height from the seating plane to the bottom of the package.
- A2: Height from the seating plane to the top of the package.
- A3: Height of the solder bump.
- b: Width of the solder bump.
- e: Pitch between solder bumps in one direction.
- e1: Pitch between solder bumps in the perpendicular direction.
- z: Clearance from the bottom of the package to the seating plane.
- z1, z2, z3: Additional height/clearance dimensions related to the solder bumps.
- aaa: Maximum allowable deviation from the true position of the package body.
- bbb: Maximum allowable deviation from the true position of the solder bumps.
- ccc: Maximum allowable deviation from the true position of the package body.
- ddd: Maximum allowable deviation from the true position of the solder bumps.
The diagram also shows a magnified view of the solder bump and seating plane, illustrating the component's profile. The dimensions are specified with tolerances and are provided in millimeters (mm).
X1-WLB1010-9 (Type A1) Package Dimensions
| Dim | Min | Max | Typ |
|---|---|---|---|
| A | 0.3756 | 0.4624 | 0.4190 |
| A1 | 0.1386 | 0.1694 | 0.1540 |
| A2 | 0.2150 | 0.2650 | 0.2400 |
| A3 | 0.0220 | 0.0280 | 0.0250 |
| b | 0.1828 | 0.2473 | 0.2150 |
| D | 1.0150 | 1.0700 | 1.0425 |
| E | 1.0150 | 1.0700 | 1.0425 |
| e | -- | -- | 0.3500 |
| e1 | -- | -- | 0.7000 |
| e2 | -- | -- | 0.7000 |
| z | -- | -- | 0.1713 |
| z1 | -- | -- | 0.1713 |
| z2 | -- | -- | 0.1713 |
| z3 | -- | -- | 0.1713 |
| aaa | -- | -- | 0.0275 |
| bbb | -- | -- | 0.0600 |
| ccc | -- | -- | 0.0300 |
| ddd | -- | -- | 0.1500 |
All Dimensions in mm.
Suggested Pad Layout
This section provides recommendations for the land pattern (pad layout) on a printed circuit board (PCB) for the X1-WLB1010-9 (Type A1) package.
The suggested pad layout consists of a 3x3 array of circular pads. The arrangement is designed to accommodate the solder bumps of the component. Key dimensions for the pad layout are:
- C: Clearance between adjacent pads in the same row/column.
- C1: Clearance between adjacent pads diagonally.
- C2: Clearance between adjacent pads in the same row/column. (Note: C and C2 appear to be similar or the same based on the diagram).
- D: Diameter of the individual circular pads.
- ØD: Diameter of the individual circular pads. (Note: D and ØD appear to be the same).
These dimensions are also provided in millimeters (mm).
X1-WLB1010-9 (Type A1) Suggested Pad Layout Dimensions
| Dimensions | Value (in mm) |
|---|---|
| C | 0.3500 |
| C1 | 0.7000 |
| C2 | 0.7000 |
| D | 0.2150 |
Important Notes
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the 'Z' dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
