Diodes Incorporated
Package Outline Dimensions and Suggested Pad Layout
U-WLB1014-12 (Type JC)
Package Outline Dimensions
This section details the physical dimensions of the U-WLB1014-12 (Type JC) package.
Diagram Description:The package is illustrated from top, side, and front views. The top view shows a rectangular outline with overall dimensions D (width) and E (height). Inside this outline, a 4x3 grid of circular pads is depicted, labeled with rows A, B, C, D and columns 1, 2, 3. Pin 1 is marked. Key dimensions indicated include: bØ (ball diameter), e1 (row pitch), e2 (row pitch), e3 (column pitch), e4 (column pitch), z1 (lead/ball offset), and z2 (lead/ball offset). The side view illustrates the package height profile, with dimensions A (overall height), A1 (height from seating plane to top of package), A2 (height from seating plane to bottom of package), and A3 (height of the mold parting line).
| Dim | Min | Max | Typ |
|---|---|---|---|
| A | 0.489 | 0.565 | 0.527 |
| A1 | 0.140 | 0.180 | 0.160 |
| A2 | 0.313 | 0.339 | 0.326 |
| A3 | 0.035 | 0.045 | 0.040 |
| B | 0.191 | 0.231 | 0.211 |
| D | 1.020 | 1.050 | 1.035 |
| E | 1.370 | 1.400 | 1.385 |
| e1 | - | - | 0.350 |
| e2 | - | - | 0.350 |
| e3 | - | - | 0.700 |
| e4 | - | - | 1.050 |
| z1 | - | - | 0.063 |
| z2 | - | - | 0.063 |
All dimensions are in millimeters (mm).
Suggested Pad Layout
This section provides recommendations for the land pattern layout on a printed circuit board (PCB) for the U-WLB1014-12 (Type JC) package.
Diagram Description:The suggested pad layout is depicted as a top-down view of a 4x3 grid of circular pads. Key dimensions for the layout are: X (horizontal spacing between pad centers), Y (vertical spacing between pad centers), C (pad diameter), D (pad diameter), and Y1 (vertical offset for pads in certain rows). DØ represents the diameter of the solder balls.
| Dimensions | Value (in mm) |
|---|---|
| C | 0.350 |
| D | 0.211 |
| X | 0.700 |
| Y | 1.050 |
| Y1 | 0.175 |
Notes and References
All dimensions are nominal values shown in millimeters.
The suggested land pattern dimensions are provided for reference only. Actual pad layouts may vary depending on the specific application, user equipment capability, or fabrication criteria. A more robust pattern for wave soldering can be achieved by adding 0.2 mm to the 'Z' dimension. For further information, consult document IPC-7351A, "Naming Convention for Standard SMT Land Patterns," and for International grid details, refer to document IEC, Publication 97.
Document Date: 2025-07-24
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