1 Product Overview

The BP3L is a low-power embedded Bluetooth module developed by Tuya. It is embedded with the Bluetooth communication protocol stack and rich library functions, mainly consisting of a highly integrated Bluetooth chip (PHY6222) and a few peripheral circuits.

1.1 Features

• Embedded with a low-power 32-bit MCU, which can also function as an application processor.
• Operating voltage: 1.8 to 3.6V
• Peripherals: 5 PWMs, 1 ADC, 4 GPIOs, and 1 UART
• Bluetooth RF features:
  • Bluetooth LE 5.1
  • RF data rate up to 1 Mbps.
  • TX power: +8 dBm
  • RX sensitivity: -97 dBm @ 1 Mbps
  • Embedded hardware AES encryption
  • Onboard antenna with a gain of 1.09 dBi
  • Operating temperature: -40°C to +105°C

1.2 Applications

• Smart LED
• Smart home

1.3 Change History

2 Module Interfaces

2.1 Dimensions and Footprint

The BP3L module has 2 lines of pins, totaling 16 pins, with a spacing of 2 mm. The module dimensions are 16±0.35 mm (Width) × 24±0.35 mm (Length) × 3.3±0.15 mm (Height). The thickness of the PCB is 0.8±0.1 mm.

Top View Description: The top view shows the module layout with pins numbered 1 through 16. Pins 1-8 are on one side, and pins 9-16 are on the opposite side. The chip and antenna pattern are visible.

Bottom View Description: The bottom view details the pin assignments. Pin 1 (RESET_N) is labeled as 'exposed'. Pin 11 (P11) and Pin 14 (P14), Pin 33 (P33), Pin 34 (P34) are also labeled as 'exposed'. Pin 8 is VCC, and Pin 9 is GND.

2.2 Pin Definition

Note: P indicates a power supply pin and I/O indicates an input/output pin.

For any special requirements on light color controlled by PWM output, please contact Tuya business personnel.

3 Electrical Parameters

3.1 Absolute Electrical Parameters

3.2 Working Conditions

3.3 Power Consumption in Working Mode

4 RF Parameters

4.1 Basic RF Features

4.2 RF Output Power

4.3 RF Receiving Sensitivity

5 Antenna Information

5.1 Antenna Type

BP3L uses the PCB antenna with a gain of 1.09 dBi.

5.2 Antenna Interference Reduction

To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials wrap around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.

6 Packaging Information and Production Instructions

6.1 Mechanical Dimensions and Dimensions of the Back of the Pad

The module dimensions are 16±0.35 mm (W) × 24±0.35 mm (L) × 3.3±0.15 mm (H), with a PCB thickness of 0.8±0.1 mm. The pin spacing is 2 mm.

Recommended Footprint Description: The recommended footprint shows a layout for the 16 pads. The overall dimensions are approximately 16.00 mm by 24.00 mm. Key dimensions and keep-out zones with radii (e.g., R0.40, R2.00, R1.00, R0.50) are indicated to ensure proper placement and signal integrity.

Side View Description: The side view illustrates the module's profile, indicating a height of 0.80 mm and a width of 2.50 mm. Tolerances are specified: module form factor ±0.35mm, PCB thickness ±0.1mm, and shield cover height ±0.05mm.

6.2 Production Instructions

The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. For specific dimension requirements, consult Tuya.

1. For Tuya in-line modules, wave soldering is preferred over manual soldering. After unpacking, modules must be soldered within 24 hours. If not, they must be stored in a drying cupboard with RH ≤ 10% or repackaged under vacuum (total exposure time not exceeding 168 hours).
2. Wave soldering devices and materials: Wave soldering equipment, wave soldering fixture, constant-temperature soldering iron, tin bar, tin wire, flux, and thermal profiler.
3. Baking devices: Cabinet oven, anti-electrostatic and heat-resistant trays, and anti-electrostatic and heat-resistant gloves.
4. Modules require baking in the following cases:
   • Packaging bag is damaged before unpacking.
   • No humidity indicator card (HIC) in the packaging bag.
   • HIC shows pink for 10% and above after unpacking.
   • Total exposure time exceeds 168 hours since unpacking.
   • More than 12 months have passed since the bag was sealed.
5. Baking settings:
   • Temperature: 60°C (≤5% RH) for reel package; 125°C (≤5% RH) for tray package (use heat-resistant tray).
   • Time: 48 hours for reel package; 12 hours for tray package.
   • Alarm temperature: 65°C for reel package; 135°C for tray package.
6. Production-ready temperature after natural cooling: < 36°C.
7. Re-baking situation: If a module remains unused for over 168 hours after baking, it needs to be baked again.
8. If a batch of modules is not baked within 168 hours, do not use wave soldering. These are Level-3 moisture-sensitive devices prone to dampness, which can lead to device failure or poor soldering at high temperatures.
9. In the whole production process, take electrostatic discharge (ESD) protective measures.
10. To guarantee product quality, pay attention to: soldering flux amount, wave peak height, tin slag and copper content in the wave soldering tank, wave soldering fixture window and thickness, and the wave soldering oven temperature curve.

6.3 Recommended Oven Temperature Curve and Temperature

Set oven temperatures according to the wave soldering temperature curve. The peak temperature is 260°C ±5°C.

Wavesolder Graph Description: The graph illustrates the 'DIP Type Product Pass Wavesolder Graph' showing temperature profiles over time. It includes zones like 'Flux zone' and 'Preheat zone', and curves for 'PCB top-side temperature', 'PCB bottom-side temp.', and 'Solder Wave Peak Temp. max. 260°C'.

6.4 Storage Conditions

Storage conditions for a delivered module:

• The moisture-proof bag should be kept in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date of packaging and sealing.
• A humidity indicator card (HIC) is included in the packaging bag.

Humidity Indicator Card (HIC) Description: The HIC displays color indicators for various humidity levels (10%, 20%, 30%, 40%, 50%, 60%). It provides guidance such as 'DANGER IF PINK CHANGE DESICCANT' and 'Read at Lavender Between Pink & Blue'. If the indicator shows pink, it signifies a need for re-baking.

Moisture Sensitivity Caution Box Description: This box indicates the 'LEVEL 3' moisture sensitivity. It specifies a calculated shelf life in a sealed bag of 12 months at <40°C and <90% RH. The peak package body temperature is 260°C. After opening, devices must be mounted within 168 hours of factory conditions (≤30°C/60% RH) or stored per J-STD-033. Devices require baking if the HIC reads >10% for level 2a-5a or >60% for level 2 devices, or if other conditions are not met. Refer to IPC/JEDEC J-STD-033 for baking procedures. The Bag Seal Date and Production Date are to be recorded.

7 MOQ and Packaging Information

8 Appendix: Statement

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has an FCC ID: 2ANDL-BP3L. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BP3L”.

This device is intended only for OEM integrators under the following conditions:

• The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

[CE mark] [WEEE recycling symbol]

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.