reComputer Industrial Reference Guide
Fanless compact PC
Thermal reference design, wider temperature support -20 ~ 60°C with 0.7m/s airflow
Design for industrial interfaces
2* RJ45 GbE (1 for POE PSE 802.3af); 1* RS 232/RS 422/RS 485; 4* DI/DO; 1* CAN; 3* USB3.2; 1* TPM2.0 (Module optional)
Hybrid connectivity
Support 5G/4G/LoRaWAN® (Module optional) with 1* Nano SIM card slot
Flexible mounting
Desk, DIN rail, Wall-mounting, VESA
Certifications
ROHS, CE, FC, UKCA
Introduction
reComputer Industrial-series includes compact edge computers built with NVIDIA advanced AI embedded systems: Nvidia Jetson Orin™ NX/Orin™ Nano/Xavier NX and Seeed carrier board. With rich extension modules, industrial peripherals, thermal management combined with decades of Seeed's hardware expertise, reComputer Industrial Jetson is ready to help you accelerate and scale the next-gen AI products emerging diverse AI scenarios.
Packing List
- 1* reComputer Industrial
- 2* Mounting Bracket
- 1* DIN Rail Bracket
- 4* Bracket Screw
- 1* 16-Pin Terminal Block for DIO
- 1* 19V Power Adapter (without power cord)
- 1* 2-Pin Terminal Block Power Connector
Hardware Overview
The reComputer Industrial features a robust design with various ports and connectors for industrial applications. Key components include:
- Front View: RESET Button (SW1), RUN LED, POWER LED, COM RS232/422/485 (DB9 J1), USB3.2 x3, DI x4, DO x4, CAN x1.
- Back View: GbE connector (LAN1+PSE, LAN2), HDMI Port, USB2.0 Debug, USB2.0 Device, RECOVERY Button (SW2), Nano SIM Card Slot, DC In.
LED Indicators:
- RUN LED: Green, system operation indicator (Always on or blink after the system is running).
- POWER LED: Red, 3.3V Power Indicator (Always on after power on).
COM 232/422/485 - DB9 J1: This connector supports RS232, RS422, and RS485 modes, configurable via DIP switches (SW3). Default mode is RS485.
DIP Switches - SW3: Used for switching the COM RS232/RS422/485 mode. The switches control RS-422 Full Duplex, Pure RS-232, RS-485 Half Duplex, Low Power, and Shutdown modes.
Specifications
| Product Name | NVIDIA Jetson Module | AI Performance | GPU | CPU | Processor System Memory | Video Encode | Video Decode | eMMC | Storage | Expansion | Networking | USB | DI/DO | COM | Display | SIM | Mini PCIe | Wi-Fi | M.2 Key B | Fan | TPM | RTC | Camera | Power Supply | Power Adapter | Dimensions (W x D x H) | Weight | Installation | Operating Temperature | Environment Operating Humidity | Vibration | Shock | OS | Certification | Warranty |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| reComputer Industrial J4012 | Orin NX 8GB | 70TOPS | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 8-core Arm® Cortex® - A78AE v8.2 64-bit CPU | 2MB L2 + 4MB L3, 16GB 128-bit LPDDR5, 102.4GB/s | 1* 4K60 (H.265) | 3* 4K30 (H.265) | 6x 1080p60 (H.265) | 12x 1080p30 (H.265) | 1080p30 supported by 1-2 CPU cores | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years | |
| reComputer Industrial J4011 | Orin NX 16GB | 100TOPS | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 6-core Arm® Cortex® - A78AE v8.2 64-bit CPU | 1.5MB L2 + 4MB L3, 8GB 128-bit LPDDR5, 102.4GB/s | 3* 4K30 (H.265) | 6x 1080p60 (H.265) | 12x 1080p30 (H.265) | 2* 4K60 (H.265) | 4* 4K30 (H.265) | 10* 1080p60 (H.265) | 22* 1080p30 (H.265) | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years | |
| reComputer Industrial J3011 | Orin Nano 8GB | 40TOPS | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 6-core Arm® Cortex® - A78AE v8.2 64-bit CPU | 1.5MB L2 + 4MB L3, 4GB 64-bit LPDDR5, 34GB/s | 1* 4K60 (H.265) | 3* 4K30 (H.265) | 6x 1080p60 (H.265) | 12x 1080p30 (H.265) | 2*4K60 | 4*4K30 | 10*1080p60 | 22*1080p30 (H.265) | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years | |
| reComputer Industrial J3010 | Orin Nano 4GB | 20TOPS | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 6-core Arm® Cortex® - A78AE v8.2 64-bit CPU | 1.5MB L2 + 4MB L3, 4GB 64-bit LPDDR5, 34GB/s | 1* 4K60 (H.265) | 3* 4K30 (H.265) | 6x 1080p60 (H.265) | 12x 1080p30 (H.265) | 2*4K60 | 4*4K30 | 10*1080p60 | 20*108p30 (H.264) | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years | |
| reComputer Industrial J2012 | Xavier NX 16GB | 21TOPS | 384-core NVIDIA Volta™™ GPU with 48 Tensor Cores | 6-core NVIDIA Carmel ARM v8.2 64-bit CPU, 6MB L2 + 4MB L3 | 16GB 128-bit LPDDR4x, 59.7GB/s | 1* 8K30 (H.265) | 2* 4K60 (H.265) | 4* 4K30 (H.265) | 9* 1080p60 (H.265) | 18* 1080p30 (H.265) | 2*8K30 | 6*4K60 | 12*4K30 | 22*1080p60 | 44*1080p30 (H.265) | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years | |
| reComputer Industrial J2011 | Xavier NX 8GB | 38TOPS | 384-core NVIDIA Volta™™ GPU with 48 Tensor Cores | 6-core NVIDIA Carmel ARM v8.2 64-bit CPU, 6MB L2 + 4MB L3 | 8GB 128-bit LPDDR4x, 59.7GB/s | 1* 4K60 (H.265) | 2* 4K30 (H.265) | 5* 1080p60 (H.265) | 11* 1080p30 (H.265) | 2*4K60 | 4*4K30 | 10*1080p60 | 20*108p30 (H.264) | 16GB eMMC 5.1 | M.2 Key M PCIe Gen4.0 SSD (M.2 NVMe 2280 SSD 128GB included) | 1* LAN1 RJ45 GbE PoE(PSE 802.3 af 15 W); 1* LAN2 RJ45 GbE (10/100/1000Mbps) | 3* USB3.2; 1* USB2.0 Type C (Device mode); 1* USB2.0 Type C For Debug UART & RP2040 | 4*DI,4*DO,3*GND_DI,2*GND_DO,1*GND_ISO,1*CAN | 1* DB9 (RS232/RS422/RS485) | 1*HDMI 2.0 Type A | 1* Nano SIM card slot | Mini PCIe for 4G/LoRaWAN® (Module optional) | Support SMD Wi-Fi/Bluetooth (Module optional) | M.2 Key B support 4G/5G (Module optional) | Fanless, passive heatsink; 1*Fan connectors(5V PWM) | 1* TPM 2.0 connector (Module optional) | 1* RTC socket (CR1220 included), 1* RTC 2-pin | 2* CSI (2-lane 15pin) | DC 12V-24V Terminal block 2 pin | 19V Power Adapter (without power cord) | 159mm*155mm*57mm | 1.57kg | Desk, DIN rail, wall-mounting, VESA | -20 ~ 60°C with 0.7m/s | 95% @ 40 °C (non-condensing) | 3 Grms @5~500 Hz, random, 1 hr/axis | 50G peak acceleration (11 msec) | Pre-installed Jetpack 5.1 (above) (provide Linux OS with board support package) | FCC, CE, RoHS, UKCA | 2 Years |
Pin Definitions
Front View
Detailed pinout information for the front view connectors:
- LEDs: RUN (Green, operation indicator), POWER (Red, 3.3V indicator).
- RESET Button (SW1): Executes a hard reset on the system.
- COM 232/422/485 - DB9 J1: Supports RS232, RS422, and RS485. Pin definitions include TXD, RXD, GND, RTS, CTS. Mode selection is done via DIP switches (SW3).
DIP Switches - SW3
The DIP switches (SW3) on the back of the carrier board are used to configure the COM RS232/RS422/485 mode. The table below outlines the modes and their corresponding switch settings:
| MODE_0 | MODE_1 | MODE_2 | Mode | Status |
|---|---|---|---|---|
| 0 | 0 | 0 | RS-422 Full Duplex | 1T/1R RS-422 |
| 0 | 0 | 1 | Pure RS-232 | 3T/5R RS-232 |
| 0 | 1 | 0 | RS-485 Half Duplex | 1T/1R RS-485, TX ENABLE Low Active |
| 0 | 1 | 1 | RS-485 Half Duplex | 1T/1R RS-485, TX ENABLE High Active |
| 1 | 0 | 0 | RS-422 Full Duplex | 1T/1R RS-422 with termination resistor |
| 1 | 0 | 1 | Pure RS-232 | 1T/1R RS-232 co-exists with RS485 application without the need for the bus switch IC (for special usage). |
| 1 | 1 | 0 | RS-485 Half Duplex | 1T/1R RS-485 with termination resistor |
| 1 | 1 | 1 | Low Power | TX ENABLE Low Active |
| Shutdown | All I/O pins are High Impedance | |||
Slew Rate Control: The SLEW pin controls the communication rate. Logical Low input limits the driver slew from either RS-232 to 1Mbps or RS-485 to 10Mbps. Internal pull high = 625KΩ.
| SLEW Status | Note |
|---|---|
| ON (Vcc) | RS-232: Maximum Data Rate is 1.5Mbps. RS-485/RS-422: Maximum Data Rate is 10Mbps. The actual Maximum Data Rate depends on the Jetson SOM used. |
| OFF (GND) | RS-232: Maximum Data Rate is 250Kbps. RS-485/RS-422: Maximum Data Rate is 250kbps. |
USB3.1 TYPE-A x2 - J4
This connector provides two USB 3.0 Type A ports. Pin definitions include VBUS Supply, USB1_D_N/P, Ground, USBSS_RX_N/P, and USBSS_TX_N/P. Supports a total power supply capacity of 2.1A maximum output current.
USB3.1 TYPE-A x1 - J3
This connector provides one USB 3.0 Type A port. Pin definitions are similar to J4. Supports a total power supply capacity of 2.1A maximum output current.
DI/DO - J2
This connector provides Digital Input (DI) and Digital Output (DO) ports, along with GND and CAN connections. It supports 4*DI, 4*DO, and CAN bus communication. The reference ground signals are provided for DI and DO, and a specific ground signal for CAN.
GbE connector
The reComputer Industrial features two GbE connectors:
- LAN1+PSE (J13): Gigabit Ethernet with Power over Ethernet (PoE) support (PSE 802.3af, 15W). Includes LEDs for Link and Activity.
- LAN2 (J14): Gigabit Ethernet (10/100/1000Mbps), utilizing PCIe to Ethernet conversion.
LAN LED Indicators:
- 10/100/1000 Mbps: Active & Link (Right LED) is Yellow (Blinking), Speed (Left LED) is Green.
HDMI Port - J16
Provides HDMI 2.0 output for display connectivity. Supports 4K resolution and hot-swapping. Pin definitions include DP_TXD data lanes, Ground, HDMI_CEC, Unused, HDMI DDC Clock/Data, and HDMI Hot Plug Detect.
USB2.0 Debug - J18
This USB Type-C connector is used for debugging and firmware burning. It can be used for serial debug information or to enter recovery mode for firmware updates via RP2040.
USB2.0 Device - J19
This USB Type-C connector provides a USB 2.0 Device interface for data communication with a computer.
RECOVERY Button - SW2
Pressing this button allows the system to enter recovery mode for firmware updates.
Nano SIM Card Slot - J15
Supports a Nano SIM card for cellular connectivity. SIM card detection is available via the SIM_DETECT_1V8 signal.
DC In - J17
This connector accepts DC power input from 12V to 24V with a 5A current limit. The power LED indicates power status.
Carrier board
The carrier board provides various expansion and connectivity options:
- Mini PCIe (J5): Supports 4G/LoRaWAN modules. Configuration for SIM card usage is available via jumpers on J8.
- M.2 Key B (J6): Supports 4G/5G modules and UART, IIS, GPIO.
- FAN Header (J7): For connecting a system fan, with tachometer and PWM control signals.
- Control and UART Header (J8): Provides control signals like SIM_MUX_SEL, USB_MUX_SEL, MCU_USB_BOOT, MCU_RST, AUTO_ON_DIS, BMCU_ACOK, PWR_BTN*, and UART communication pins.
- TPM Header (J11): For connecting a TPM 2.0 module. Supports SPI interface.
- RTC Connect (J12): For connecting a coin cell battery for RTC backup.
- 2-Pin RTC Connect: Connects to the RTC backup battery.
- 260Pin SODIMM Connector: For connecting the NVIDIA Jetson module.
- DIP Switches: Used for COM port mode selection.
- M.2 Key M (J21): Supports PCIe Gen4.0 SSDs.
- 2* CSI (2-lane 15pin): For connecting camera modules.
- Wi-Fi/Bluetooth (Optional): Supports modules like BL-M8723DU1.
- EXT Antenna Interface (J24, J25): For Wi-Fi/Bluetooth antennas.
- RTC Socket (J22): Accommodates a CR1220 coin cell battery.
Accessories Information
The following accessories are optional and not included in the package:
- 4G: EC25EUXGA-MINIPCIE, EC20CEHCLG-MINIPCIE
- 5G: SIM8202G-M2
- LoRaWAN: WM1303 LoRaWAN Gateway Module Without SX1262(SPI) - EU868
- TPM: TPM2.0 Module with Infineon SLB9670
- Wi-Fi/Bluetooth: BL-M8723DU1
Pre-installed OS
The reComputer Industrial comes with Jetpack 5.1 pre-installed, providing a Linux OS with a board support package. It also includes an M.2 NVMe 2280 SSD 128G with the OS pre-installed. For reflashing the image, refer to the wiki.
Dimensions
The physical dimensions of the reComputer Industrial are approximately 159mm (Width) x 155mm (Depth) x 57mm (Height).
Diagrams illustrating the dimensions are provided.
Flexible mounting
The reComputer Industrial supports various mounting options:
- Wall-mounting: Using screws (e.g., 4*Screw-KA4.0*20.0mm).
- Desk/Shelf mounting: Using screws (e.g., 4*Screw-PM4.0*6.0mm).
- DIN rail mounting: Using screws (e.g., 2*Screw-120°-KM3.0*5.0mm).
Diagrams illustrating these mounting methods are included.
Certifications
The device is certified with FCC, CE, RoHS, and UKCA.
More information
For more details about the device and support, users can check the Seeed Studio wiki, forum, and Discord community. Customized services can be inquired about at https://www.seeedstudio.com/odm.
