MMBTA13 / MMBTA14 NPN Darlington Transistor in SOT23

Features

• Ideal for Medium Power Amplification and Switching
• High Current Gain
• Complementary PNP Types: MMBTA63 / MMBTA64
• Totally Lead-Free & Fully RoHS Compliant
• Halogen and Antimony Free. "Green" Device
• For automotive applications requiring specific change control (e.g., parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact Diodes Incorporated or your local Diodes representative.
• https://www.diodes.com/quality/product-definitions/

Mechanical Data

• Package: SOT23
• Package Material: Molded Plastic, "Green" Molding Compound; UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish; Solderable per MIL-STD-202, Method 208
• Weight: 0.008 grams (Approximate)

Ordering Information

Notes:

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + CI) and <1000ppm antimony compounds.
4. For packaging details, go to https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

K3D = Product Type Marking Code

YM = Date Code Marking

Y or Y = Year (e.g., L = 2024)

M = Month (e.g., N = November)

Date Code Key

Absolute Maximum Ratings

Thermal Characteristics

ESD Ratings (Note 6)

Notes:

1. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR-4 PCB; device is measured under still air conditions whilst operating in a steady-state.
2. Refer to JEDEC specification JESD22-A114, JESD22-A115 and JESD22-C101.

Electrical Characteristics

Note: 7. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%

Typical Electrical Characteristics

Figure 1. Max Power Dissipation vs Ambient Temperature

[Graph showing Power Dissipation (mW) on the y-axis and Ambient Temperature (°C) on the x-axis. The graph shows a decreasing trend, starting at 400mW at 25°C and decreasing to 0mW at 200°C. Note 5 applies.]

Figure 2. Collector Emitter Saturation Voltage vs. Collector Current

[Graph showing VCE(sat) (V) on the y-axis and IC (mA) on the x-axis. Multiple curves are shown for different temperatures: -50°C, 25°C, and 150°C. At 100mA, VCE(sat) is approximately 0.55V at -50°C, 0.75V at 25°C, and 1.05V at 150°C.]

Figure 3. DC Current Gain vs Collector Current

[Graph showing hFE (DC Current Gain) on the y-axis (logarithmic scale) and IC (mA) on the x-axis (logarithmic scale). Multiple curves are shown for different temperatures: -50°C, 25°C, and 150°C. At 10mA, hFE is approximately 10,000 at -50°C, 100,000 at 25°C, and 1,000,000 at 150°C.]

Figure 4. Base Emitter Voltage vs. Collector Current

[Graph showing VBE(on) (V) on the y-axis and IC (mA) on the x-axis. Multiple curves are shown for different temperatures: -50°C, 25°C, and 150°C. At 100mA, VBE(on) is approximately 0.7V at -50°C, 0.85V at 25°C, and 1.1V at 150°C.]

Figure 5. Gain Bandwidth Product vs Collector Current

[Graph showing fT (Gain Bandwidth Product MHz) on the y-axis and IC (mA) on the x-axis. A single curve is shown for VCE = 5V, indicating fT increases with IC, reaching approximately 125MHz at 10mA.]

Note: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR-4 PCB; device is measured under still air conditions whilst operating in a steady-state.

Package Outline Dimensions

Please see https://www.diodes.com/design/support/packaging/diodes-packaging/ for the latest version.

SOT23

[Diagram of SOT23 package outline with dimensions labeled A through M, K1, L1. A table lists the dimensions for each label.]

Suggested Pad Layout

Please see https://www.diodes.com/design/support/packaging/diodes-packaging/ for the latest version.

[Diagram showing suggested pad layout for SOT23 package with dimensions labeled X, Y, X1, Y1. A table lists the values for these dimensions.]

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