BCW66H: 45V NPN Medium Power Transistor in SOT23
Diodes Incorporated
Features
- BVCEO > 45V
- IC = 800mA High Continuous Collector Current
- Low Saturation Voltage VCE(sat) < 300mV @ 100mA
- Complementary PNP Type: BCW68H
- Totally Lead-Free & Fully RoHS Compliant
- Halogen and Antimony Free. "Green" Device
- Automotive-compliant part available (BCW66HQ datasheet)
Mechanical Data
- Package: SOT23
- Package Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0
- Moisture Sensitivity: Level 1 per J-STD-020
- Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208
- Weight: 0.008 grams (Approximate)
Package Diagrams
SOT23 Package: Depicts the SOT23 surface-mount package from top view, showing the three leads labeled E, B, C. A device symbol is also shown with emitter (E), base (B), and collector (C) terminals. The top view pinout clearly indicates the terminal arrangement.
Ordering Information
Orderable Part Number | Package | Marking | Reel Size (inches) | Tape Width (mm) | Qty. | Carrier |
---|---|---|---|---|---|---|
BCW66HTA | SOT23 | EH | 7 | 8 | 3,000 | Reel |
Notes:
- 1. Compliant with EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3).
- 2. Refer to Diodes Incorporated's website for definitions of Halogen- and Antimony-free, "Green" and Lead-free.
- 3. "Green" products contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
- 4. Packaging details available at https://www.diodes.com/design/support/packaging/diodes-packaging/.
Marking Information
The product type marking code is "EH".
Maximum Ratings
(All ratings @ TA = +25°C, unless otherwise specified.)
Characteristic | Symbol | Value | Unit |
---|---|---|---|
Collector-Base Voltage | VCBO | 75 | V |
Collector-Emitter Voltage | VCEO | 45 | V |
Emitter-Base Voltage | VEBO | 7 | V |
Continuous Collector Current | IC | 800 | mA |
Peak Pulse Current | ICM | 1000 | mA |
Base Current | IB | 100 | mA |
Thermal Characteristics
(@TA = +25°C, unless otherwise specified.)
Characteristic | Symbol | Value | Unit |
---|---|---|---|
Power Dissipation | PD | 310 (Note 5) / 350 (Note 6) | mW |
Thermal Resistance, Junction to Ambient | RθJA | 403 (Note 5) / 357 (Note 6) | °C/W |
Thermal Resistance, Junction to Leads | RθJL | 350 (Note 7) | °C/W |
Operating and Storage Temperature Range | TJ, TSTG | -55 to +150 | °C |
Notes:
- 5. Device mounted on minimum recommended pad layout (1oz copper on FR4 PCB) in still air.
- 6. Device mounted on 15mm x 15mm 1oz copper.
- 7. Thermal resistance from junction to solder-point (at the end of the leads).
Performance Graphs
Figure 1. Derating Curve: Shows maximum power dissipation versus ambient temperature. The curve indicates how power handling capability decreases as temperature increases.
Figure 2. Transient Thermal Impedance: Illustrates thermal impedance as a function of pulse width for single pulse operation. It shows how the device's temperature rises under transient conditions.
Figure 3. Pulse Power Dissipation: Depicts maximum power dissipation versus pulse width for single pulse operation at TA = 25°C. This graph is useful for understanding power handling during short pulses.
Electrical Characteristics
(@TA = +25°C, unless otherwise specified.)
OFF CHARACTERISTICS
Characteristic | Symbol | Min | Typ | Max | Unit | Test Condition |
---|---|---|---|---|---|---|
Collector-Base Breakdown Voltage | BVCES | 75 | V | IC = 10μA | ||
Collector-Emitter Breakdown Voltage (Base Open) (Note 8) | BVCEO | 45 | V | ICEO = 10mA | ||
Emitter-Base Breakdown Voltage | BVEBO | 7 | V | IEBO = 10μA | ||
Collector-Emitter Cutoff Current | ICES | < 1 | 20 | nA | VCES = 45V | |
Collector-Emitter Cutoff Current | ICES | 20 | μA | VCES = 45V, TA = +150°C | ||
Emitter-Base Cutoff Current | IEBO | < 1 | 20 | nA | VEBO = 5.6V |
ON CHARACTERISTICS (Note 8)
Characteristic | Symbol | Min | Typ | Max | Unit | Test Condition |
---|---|---|---|---|---|---|
Static Forward Current Transfer Ratio | hFE | 80 | 180 | IC = 100μA, VCE = 10V | ||
Static Forward Current Transfer Ratio | hFE | 250 | 350 | IC = 10mA, VCE = 1V | ||
Static Forward Current Transfer Ratio | hFE | 100 | IC = 100mA, VCE = 1V | |||
Static Forward Current Transfer Ratio | hFE | 630 | IC = 500mA, VCE = 2V | |||
Collector-Emitter Saturation Voltage | VCE(sat) | 0.3 | 0.7 | V | IC = 100mA, IB = 10mA | |
Collector-Emitter Saturation Voltage | VCE(sat) | V | IC = 500mA, IB = 50mA | |||
Base-Emitter Saturation Voltage | VBE(sat) | 2 | V | IC = 500mA, IB = 50mA |
SMALL-SIGNAL CHARACTERISTICS (Note 8)
Characteristic | Symbol | Min | Typ | Max | Unit | Test Condition |
---|---|---|---|---|---|---|
Transition Frequency | fT | 100 | MHz | IC = 20mA, VCE = 10V, f = 100MHz | ||
Output Capacitance | Cobo | 8 | 12 | pF | VCB = 10V, f = 1MHz | |
Input Capacitance | Cibo | 80 | pF | VCB = -0.5V, f = 1MHz | ||
Noise Figure | N | 2 | 10 | dB | IC = 0.2mA, VCE = 5V, RG = 1kΩ | |
Turn-On Time | ton | 100 | ns | IC = 150mA | ||
Turn-Off Time | toff | 400 | ns | IB1 = -IB2 = 15mA, RL = 150Ω |
Note 8: Measured under pulsed conditions. Pulse width ≤ 300μs. Duty cycle ≤ 2%.
Package Outline Dimensions
Details for SOT23 package outline. Refer to https://www.diodes.com/package-outlines.html for the latest version.
Dim | Min | Max | Typ |
---|---|---|---|
A | 0.37 | 0.51 | 0.40 |
B | 1.20 | 1.40 | 1.30 |
C | 2.30 | 2.50 | 2.40 |
D | 0.89 | 1.03 | 0.915 |
F | 0.45 | 0.60 | 0.535 |
G | 1.78 | 2.05 | 1.83 |
H | 2.80 | 3.00 | 2.90 |
J | 0.013 | 0.10 | 0.05 |
K | 0.890 | 1.00 | 0.975 |
K1 | 0.903 | 1.10 | 1.025 |
L | 0.45 | 0.61 | 0.55 |
L1 | 0.25 | 0.55 | 0.40 |
M | 0.085 | 0.150 | 0.110 |
a | 0° | 8° |
All Dimensions in mm
Suggested Pad Layout
Layout for SOT23 package. Refer to https://www.diodes.com/package-outlines.html for the latest version.
Dimensions | Value (in mm) |
---|---|
C | 2.0 |
X | 0.8 |
X1 | 1.35 |
Y | 0.9 |
Y1 | 2.9 |
Important Notice
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