Product Overview

CB3S is a low-power embedded Wi-Fi module developed by Tuya. It integrates a highly efficient RF chip, BK7231N, along with essential peripherals. The CB3S module supports both Wi-Fi AP and STA modes, as well as Bluetooth Low Energy (LE).

1.1 Features

• Built-in low-power 32-bit CPU, capable of functioning as an application processor.
• Clock rate: 120 MHz
• Working voltage: 3.0V to 3.6V
• Peripherals: 5 PWM channels and 1 UART.
• Wi-Fi Connectivity:
  • Standards: 802.11 b/g/n
  • Channels: 1 to 14 @ 2.4 GHz
  • Security Modes: Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES).
  • Output Power: Up to +16 dBm in 802.11b mode.
  • Working Modes: Support STA, AP, and STA+AP modes.
  • Configuration: Supports SmartConfig and AP network configuration for Android and iOS devices.
  • Antenna: Onboard PCB antenna with a gain of 1.3 dBi.
  • Working Temperature: -40°C to 85°C.
• Bluetooth Connectivity:
  • Transmit Power: Support for 6 dBm in Bluetooth mode.
  • Interface: Complete Bluetooth coexistence interface.
  • Antenna: Onboard PCB antenna with a gain of 1.3 dBi.

1.2 Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

1.3 Change History

Module Interfaces

2.1 Dimensions and Package

The dimensions of the CB3S module are 16.00±0.35 mm (Width) × 24.00±0.35 mm (Length) × 2.8±0.15 mm (Height).

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical Parameters

3.1 Absolute Electrical Parameters

3.2 Normal Working Conditions

3.3 RF Power Consumption

3.4 Working Current

RF Parameters

4.1 Basic RF Features

4.2 Wi-Fi Transmission Performance

4.3 Wi-Fi Receiving Performance

4.4 Bluetooth Transmission Performance

4.5 Bluetooth Receiving Performance

Antenna Information

5.1 Antenna Type

CB3S uses the onboard PCB antenna with a gain of 1.3 dBi.

5.2 Antenna Interference Reduction

To ensure optimal Wi-Fi performance with the onboard PCB antenna, it is recommended that the antenna be placed at least 15 mm away from other metal parts. To prevent adverse impact on antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging Information and Production Instructions

6.1 Mechanical Dimensions

6.2 Production Instructions

1. The Tuya SMT module should be mounted by an SMT device. After unpacking, it must be soldered within 24 hours. If this is not possible, it should be stored in a drying cupboard with relative humidity (RH) not greater than 10%, or repackaged under vacuum. The total exposure time must be recorded and cannot exceed 168 hours.
2. SMT Devices: Mounter, SPI, Reflow soldering machine, Thermal profiler, Automated optical inspection (AOI) equipment.
3. Baking Devices: Cabinet oven, Anti-electrostatic and heat-resistant trays, Anti-electrostatic and heat-resistant gloves.
4. Storage Conditions for a Delivered Module: The moisture-proof bag must be kept in an environment with a temperature below 40°C and relative humidity lower than 90%. The shelf life of a dry-packaged product is 12 months from the date of packaging and sealing. A humidity indicator card (HIC) is included in the packaging bag.
5. Diagram Description (Humidity Indicator Card): An image of a Humidity Indicator Card (HIC) shows color indicators for relative humidity levels (10% to 60%). It provides instructions for reading the card and a warning about pink color changes indicating moisture exposure.
6. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC turn pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
7. Baking Settings:
   • Temperature: 60°C and ≤ 5% RH for reel package; 125°C and ≤5% RH for tray package (use heat-resistant trays).
   • Time: 48 hours for reel package; 12 hours for tray package.
   • Alarm temperature: 65°C for reel package; 135°C for tray package.
   • Production-ready temperature after natural cooling: < 36°C.
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use reflow soldering. These Level-3 moisture-sensitive devices can absorb moisture, leading to device failure or poor soldering at high temperatures.
8. In the whole production process, take electrostatic discharge (ESD) protective measures.
9. To guarantee the passing rate, it is recommended to use SPI and AOI to monitor solder paste printing and mounting quality.

6.3 Recommended Oven Temperature Curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

6.4 Storage Conditions

MOQ and Packaging Information

Appendix-Statement

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note

This device has been tested and found to comply with the limits for a Class B digital device, according to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be co-located and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body".

This device has an FCC ID: 2ANDL-CB3S. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-CB3S".

This device is intended only for OEM integrators under the following conditions: The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

The device could be used with a separation distance of 20cm to the human body.