Tuya ZS3L Zigbee Module Datasheet

1. Product Overview

The ZS3L is a Zigbee module developed by Tuya Smart. It consists of a highly integrated wireless RF processor chip, the EFR32MG21A020F768IM32-B, and a few peripheral components. It integrates the 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions.

The ZS3L features a low-power 32-bit ARM Cortex-M33 core, 768 KByte Flash program memory, 64KB RAM data memory, and rich peripheral resources, integrating all Zigbee MAC functions. Users can develop embedded Zigbee products based on these capabilities.

1.1. Features

• Low-power 32-bit CPU, ARM Cortex-M33 processor with DSP instructions and floating-point unit, can also serve as an application processor.
• Main frequency supports 80 MHz.
• Wide operating voltage: 2.0 V - 3.8 V.
• Peripherals: 9×GPIOs, 1×UART, 1×ADC.
• Zigbee connectivity.
• Supports 802.15.4 MAC/PHY.
• Operating channels 11 - 26 @ 2.400-2.483GHz, air interface rate 250Kbps.
• Maximum output power: +20dBm.
• Operating current: 60µA/MHz; Sleep current: 5µA.
• On-board PCB antenna, antenna gain 1.0dBi.
• Operating temperature: -40℃ to 105℃.
• Supports hardware encryption, AES 128/256.

1.2. Application Fields

• Smart buildings
• Smart home / home appliances
• Smart plugs, smart lights
• Industrial wireless control
• Baby monitors
• Network cameras
• Smart public transport

2. Module Interface

2.1. Package Dimensions

The ZS3L has 2 rows of pins with a pin pitch of 2±0.1mm.

ZS3L dimensions: 24±0.35mm (W) × 16±0.35mm (L) × 2.8±0.15mm (H).

Top View

Side View

Unit: mm

Module form factor tolerance: ±0.35mm

Plate thickness tolerance: ±0.1mm

Shield cover height tolerance: ±0.05mm

2.2. Pin Definition

Bottom View

Notes:

• P indicates a power pin; I/O indicates an input/output pin.
• Pin17-22 are programming pins, which do not need to be led out by default. Customers should pay attention to avoid tracing on the baseboard.

When the ZS3L is used as a gateway module, the corresponding pin connections are as follows:

Additional Pin Configuration Notes:

• PC00 (REQUEST): A 1.5K pull-down resistor is required (mandatory). If the main control has PTA, connect to MCU's STATE. If not, pull down to ground with 1.5K (optional).
• PB01 (GRANT): A 1.5K pull-down resistor is required (mandatory). If the main control has PTA, connect to MCU's ACT. If not, pull down to ground with 1.5K (optional).
• PB00 (PRIORITY): A 1.5K pull-down resistor is required (mandatory). If the main control has PTA, connect to MCU's PRI. If not, pull down to ground with 1.5K (optional).
• PC02 (Shared_REQ): A 1.5K pull-down resistor is required (mandatory). If there is Bluetooth functionality, connect to BT's Shared_REQ. If there is no Bluetooth functionality, pull down to ground with 1.5K (optional).
• PA00 (RX_ACT): A 1.5K pull-down resistor is required (mandatory). If there is Bluetooth functionality, connect to BT's RX_ACT. If there is no functionality, pull down to ground with 1.5K (optional).

Important Note: The 1.5K pull-down resistor must be connected, regardless of whether it is connected to the module.

3. Electrical Parameters

3.1. Absolute Electrical Parameters

3.2. Normal Operating Conditions

3.3. Continuous Transmit and Receive Current Consumption

3.4. Operating Current

4. RF Parameters

4.1. Basic RF Characteristics

4.2. Transmit Performance

4.3. Receive Performance

5. Antenna Information

5.1. Antenna Type

Only PCB onboard antenna connection is available.

5.2. Reducing Antenna Interference

When using a PCB onboard antenna with the Zigbee module, to optimize Zigbee performance, it is recommended that the antenna area of the module be at least 5mm away from other metal components. User PCB boards should not have traces or copper cladding in the antenna area to avoid affecting antenna performance.

Diagram showing recommended spacing for PCB antenna.

Ensure a minimum clearance of 5mm around the PCB antenna. The recommended clearance from the antenna to the edge of the PCB is 5.7mm.

Diagram illustrating antenna placement and clearance.

Diagram: Do not place any metal in the red area above the antenna. The recommended diameter of the circular arc is greater than 3 cm.

6. Packaging Information and Production Guidelines

6.1. Mechanical Dimensions

PCB dimensions: 24±0.35mm (W) × 16±0.35mm (L) × 0.8±0.1mm (H).

Top View

Bottom View

6.2. Side View

Antenna height: 6.6mm

Shield cover height: 15.32mm

Overall dimension: 24±0.35mm

6.3. Schematic Footprint

Diagram of the schematic footprint.

6.4. PCB Footprint Diagram - Pin Header

The ZS3L can be used with SMT chip components or pin header connectors. The dimensions for the pin header connector are shown below.

Diagram showing dimensions for pin header connector.

6.5. PCB Footprint Diagram - SMT

Recommended footprint diagram for SMT placement.

The keep-out area indicated in the diagram above should not be tinned or traced.

6.6. Production Guidelines

1. For SMT chip component placement, it is recommended to use SMT machines. After unpacking, it is recommended to complete soldering within 24 hours. If not all the product is used after unpacking, it should be stored in a dry cabinet with humidity not exceeding 10%RH, or re-vacuum packaged and the exposure time recorded. The total exposure time should not exceed 168 hours.
2. SMT chip placement requires the following instruments or equipment:
• Chip mounter
• SPI (Solder Paste Inspection)
• Reflow soldering machine
• Furnace temperature tester
• AOI (Automated Optical Inspection)
3. The following instruments or equipment are required for baking:
• Cabinet type baking oven
• Anti-static high-temperature resistant tray
• Anti-static high-temperature resistant gloves
4. Tuya's factory module storage conditions are as follows:
• The moisture-proof bag must be stored in an environment with temperature <40℃ and humidity <90%RH.
• The shelf life of dried packaged products is 12 months from the date of packaging seal.
• The sealed package contains a humidity indicator card.
5. Tuya's factory modules require baking under the following conditions if they may have been exposed to moisture:
• If the vacuum-sealed bag is found to be damaged before unpacking.
• If the humidity indicator card is missing after unpacking.
• If the humidity indicator card shows a pink color, indicating 10% or higher humidity.
• If the total exposure time after unpacking exceeds 168 hours.
• If more than 12 months have passed since the initial vacuum sealing.
6. Baking parameters are as follows:
• Baking temperature: Reel package 40℃, humidity ≤5%RH. Tray package 125℃, humidity ≤5%RH (high-temperature resistant tray, not blister box tray).
• Baking time: Reel package 168 hours, tray package 12 hours.
• Alarm temperature setting: Reel package 50℃, tray package 135℃.
• Cool down to below 36℃ under natural conditions before proceeding with production.
• If the exposure time after baking exceeds 168 hours and the product is not used, it needs to be baked again.
• If the exposure time exceeds 168 hours without baking, it is not recommended to use reflow soldering to weld this batch of modules. Due to the module being a Level 3 moisture-sensitive device, exceeding the allowable exposure time may cause the device to become damp, potentially leading to device failure or poor soldering during high-temperature welding.
7. Throughout the entire production process, ESD (Electrostatic Discharge) protection must be provided for the modules.
8. To ensure product pass rates, it is recommended to use SPI and AOI testing equipment to monitor solder paste printing and placement quality.

6.7. Recommended Reflow Soldering Curve

Please select the appropriate welding method according to the process. For SMT, refer to the recommended reflow soldering curve. For wave soldering, refer to the recommended wave soldering curve. The set reflow temperature may differ from the actual measured reflow temperature. The temperatures shown in the diagrams are actual measured temperatures.

Method 1: SMT Process (Recommended SMT Reflow Soldering Curve)

Please set the reflow temperature according to the reflow soldering curve requirements. The reflow temperature curve is shown below:

Diagram of SMT reflow soldering curve.

• A: Temperature axis
• B: Time axis
• C: Alloy liquidus temperature range: 217-220℃
• D: Heating ramp rate: 1-3℃/S
• E: Preheat time: 60-120S, Preheat temperature range: 150-200°C
• F: Time above liquidus: 50-70S
• G: Peak temperature: 235-245°C
• H: Cooling ramp rate: 1-4℃/S

The recommended curve is for SAC305 solder paste. For other solder pastes, please refer to the solder paste manufacturer's specifications for recommended reflow curves.

Method 2: Wave Soldering Process (Wave Soldering Curve)

Please set the reflow temperature according to the wave soldering reflow temperature recommendations. Peak temperature: 260℃±5℃. The wave soldering temperature curve is shown below:

Diagram of wave soldering temperature curve.

6.8. Storage Conditions

Warning: Moisture-Sensitive Device

MSL Level: 3

1. Calculated shelf life of the device in the sealed bag: 12 months under conditions of <40℃ and <90% relative humidity (RH).

Moisture-proof bag seal date: [See production date or adjacent barcode label if missing]

2. Peak package body temperature: 260°C [See adjacent barcode label if missing]

3. After opening the bag, devices to be processed with reflow soldering or other high-temperature processes must:

• Be mounted in a workshop environment ≤30°C/60% RH within 168 hours, or
• Be stored according to J-STD-033.

4. Before mounting, devices require baking if:

• At 23±5°C, the humidity indicator card shows >10% for Level 2a-5a devices, or >60% for Level 2 devices.
• Conditions 3a or 3b above are not met.

5. If baking is required, refer to the baking procedures in IPC/JEDEC J-STD-033.

Note 1: IPC/JEDEC J-STD-020 specifies the level and peak package body temperature.

7. Module MOQ and Packaging Information

8. Appendix: Statement

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in a host system, except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and the user body.

This device has an FCC ID: 2ANDL-ZS3L. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZS3L”.

This device is intended only for OEM integrators under the following conditions:

1. The antenna must be installed such that 20cm is maintained between the antenna and users.
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

CE Mark

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

Disposal Information

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.