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EconoPACK™4 Product Family: Mounting Instructions

Application Note AN 2010-06

This application note from Infineon Technologies provides comprehensive guidance for the assembly and integration of the EconoPACK™4 product family. It details critical procedures, requirements, and best practices to ensure reliable performance and proper installation of these power modules.

Key Installation Aspects Covered:

Press-In Process: Detailed instructions on using PressFIT technology, including necessary tools, press-in forces, and the step-by-step procedure for module insertion into printed circuit boards (PCBs).
Heat Sink Integration: Requirements for heat sinks, proper application of thermal interface materials (TIM) such as thermal conductive paste (TCP) using screen printing or manual methods, and secure mounting of modules to heat sinks with specified screw torques.
Electrical Connections: Guidance on connecting busbars to power terminals, including methods for achieving optimal strain relief and adhering to force limitations.
Component Handling: Important information on handling electrostatic sensitive components (ESD) to prevent damage, alongside general warnings and safety considerations for module usage.

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Infineon-AN2010 06 Mounting Instructions EconoPACK4-ApplicationNotes-v02 00-EN Microsoft Office Word 2007

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