SkyLink NWBP5020K2-242MSE3 Chip Antenna Specification
Part Number: NWBP5020K2-242MSE3
Description: Chip Antenna 5.0x2.1mm, 2.45G, Type E3
Version: V1.1
Issue Date: 2017/06/22
Product Overview
The NWBP5020K2-242MSE3 is a chip antenna designed for Bluetooth and WLAN applications. It features a compact size of 5.0x2.1mm and operates at 2.45GHz.
L: 5.02 ± 0.20 mm
W: 2.12 ± 0.20 mm
T: 1.03 ± 0.20 mm
Part Number Information
The part number NWBP5020K2-242MSE3 is structured as follows:
- A (Product Series): Antenna
- B (Dimension L x W): 5.0X2.0mm (+-0.2mm)
- C (Material): High K material
- D (Working Frequency): 2.4~2.5GHz
- E (Feeding mode): Monopole & Single Feeding
- F (Antenna type): E3
1. Electrical Specification
| Specification | Value | Unit |
|---|---|---|
| Part Number | NWBP5020K2-242MSE3 | |
| Central Frequency | 2450 | MHz |
| Bandwidth | 100 (Min.) | MHz |
| Return Loss | -10 (Max) | dB |
| Peak Gain | 3.19 | dBi |
| Impedance | 50 | Ohm |
| Operating Temperature | -40~+85 | °C |
| Maximum Power | 4 | W |
| Resistance to Soldering Heats | 10 (@ 260°C) | sec. |
| Polarization | Linear | |
| Azimuth Beamwidth | Omni-directional | |
| Termination | Ni / Au (Leadless) |
Remark: Bandwidth & Peak Gain was measured under evaluation board.
2. Recommended PCB Pattern
Evaluation Board Dimension:
A diagram shows the layout of the evaluation board with dimensions and placement of the antenna, feed line, and vias.
Suggested Matching Circuit:
A schematic illustrates a suggested matching circuit with components including 1.5nH and 2.0nH inductors, connected to the feeding point.
Layout Dimensions in Clearance area (Size=7.0*5.0mm):
A diagram shows the layout dimensions within a clearance area, highlighting the 50 ohm transmission line and the matching circuit.
FootPrint (Unit: mm):
A diagram shows the footprint of the antenna component with dimensions: 4.3000mm length and 2.000mm width.
3. Measurement Results
Return Loss:
A graph displays the return loss measurement for the antenna. Key data points indicate:
- At 2.400000 GHz, Return Loss is -10.070 dB
- At 2.450000 GHz, Return Loss is -20.267 dB
- At 2.500000 GHz, Return Loss is -11.039 dB
Radiation Pattern:
A 3D radiation pattern plot shows the antenna's directivity and power distribution. A table summarizes the measurement results:
| Frequency | Efficiency | Peak Gain | Directivity |
|---|---|---|---|
| 2400MHz | 64.77% | 2.62 dBi | 5.15 dBi |
| 2450MHz | 75.12% | 3.19 dBi | 5.03 dBi |
| 2500MHz | 66.18% | 2.64 dBi | 5.10 dBi |
Chamber Coordinate System:
A diagram illustrates the setup within a measurement chamber, showing the position of the Signal Generator (SGH), Device Under Test (DUT), and turning support, with X, Y, and Z axes indicated.
4. Reliability and Test Conditions
This section details the requirements and test conditions for various reliability tests:
- Solderability: Requires 90% wetting coverage and no visible mechanical damage. Test condition involves pre-heating at 150°C for 60 seconds and soldering at 230±5°C for 4±1 seconds using Sn-Ag3.0-Cu0.5 solder.
- Solder Heat Resistance: Requires no visible mechanical damage and central frequency change within ±6%. Test condition involves pre-heating at 150°C for 60 seconds and soldering at 260±5°C for 10±0.5 seconds.
- Component Adhesion (Push test): Requires no visible mechanical damage. The device is reflow soldered to a tinned copper substrate, and a force gauge is applied to the side of the component. The device must withstand 0.5 Kg without failure of the termination.
- Component Adhesion (Pull test): Requires no visible mechanical damage. Wire is inserted into the open eye bend, and the terminal should not be remarkably damaged.
- Thermal Shock: Requires no visible mechanical damage and central frequency change within ±6%. The test involves cycles of exposure to +85°C and -40°C for 30±3 minutes each, with stabilization time at normal condition.
- Resistance to High Temperature: Requires no visible mechanical damage, central frequency change within ±6%, and no disconnection or short circuit. Test condition is 85±5°C for 1000±12 hours, with stabilization time at normal condition.
- Resistance to Low Temperature: Requires no visible mechanical damage, central frequency change within ±6%, and no disconnection or short circuit. Test condition is -40±5°C for 1000±12 hours, with stabilization time at normal condition.
- Humidity: Requires no visible mechanical damage, central frequency change within ±6%, and no disconnection or short circuit. Test condition is 40±2°C and 90% to 95% RH for 1000±12 hours, with stabilization time at normal condition.
5. Soldering and Mounting
Mildly activated rosin fluxes are preferred. The use of hot air soldering tools is recommended for hand soldering. The document provides recommended temperature profiles for re-flow soldering.
Precautions for using a soldering iron include:
- Preheat circuit and products to 150°C.
- Never contact the ceramic with the iron tip.
- Use a 20-watt soldering iron with a tip diameter of 1.0mm.
- Maximum tip temperature: 280℃.
- Maximum tip diameter: 1.0mm.
- Limit soldering time to 3 seconds.
6. Packaging Information
Tape Specification:
A table details the tape specifications with dimensions for W, A0, B0, K0, P, F, E, D, P0, P2, and t.
Reel Specification: (7”, Φ180 mm)
A diagram shows the reel dimensions (A, B, C, D). A table provides packaging details:
| Tape Width(mm) | A(mm) | B(mm) | C(mm) | D(mm) | Chip/Reel(pcs) |
|---|---|---|---|---|---|
| 12 | 12±1.0 | 60±2 | 13.5±0.5 | 178±2 | 3000 |
7. Storage and Transportation Information
Storage Conditions:
- Temperature and humidity: -10~40℃ and 30~70% RH.
- Use products within 6 months from the time of delivery.
- Keep packaging material away from chlorine or sulfur.
Transportation Conditions:
- Handle with care to avoid damage or contamination from perspiration and skin oils.
- Use of tweezers or vacuum pick up is recommended for individual components.
- Minimize abrasion and mechanical shock during bulk handling.
Compliance Information
The product is RoHS compliant and lead-free.
