Marketing Name / Model
- HP ProBook 635 Aero G7 Notebook PC
- HP ProBook 635 Aero G7
- HP ProBook 635 Aero G8 Notebook PC
- HP ProBook 635 Aero G8
- HP mt32 Mobile Thin Client
- HP mt32
- HSN-I39C
Purpose
The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP's Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
| Item Description | Notes | Quantity of items included in product |
|---|---|---|
| Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) | With a surface greater than 10 sq cm | 4 |
| Batteries, excluding Li-Ion batteries. | All types including standard alkaline, coin or button style batteries | 1 |
| Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.) | Battery(ies) are attached to the product by (check all that apply with an “x” inside the “[ ]”): [x] screws [ ] snaps [ ] adhesive [ ] other. Explain. NOTE: Add detailed removal procedures including required tools in the sections 3.1/3.2. | 1 |
| Mercury-containing components | For example, mercury in lamps, display backlights, scanner lamps, switches, batteries | 0 |
| Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm | Includes background illuminated displays with gas discharge lamps (15.6") | 1 |
| Cathode Ray Tubes (CRT) | 0 | |
| Capacitors / condensers (Containing PCB/PCT) | Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height | 0 |
| External electrical cables and cords | DC Cable for External Power Supply | 1 |
| Gas Discharge Lamps | 0 | |
| Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) | 0 | |
| Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner | Include the cartridges, print heads, tubes, vent chambers, and service stations. | 0 |
| Components and waste containing asbestos | 0 | |
| Components, parts and materials containing refractory ceramic fibers | 0 | |
| Components, parts and materials containing radioactive substances | 0 |
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
| Tool Description | Tool Size (if applicable) |
|---|---|
| Screw driver | Cross |
| Opening pry jig | |
| Hot air gun or Hair dryer | |
| Tweezer |
3.0 Product Disassembly Process
3.1 Basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
- Loosen screws and remove base cover
- Remove main battery
- Remove DDR and small cards
- Disconnect all cables and remove RTC battery
- Take out Thermal module, fan and PCA
3.2 Optional Graphic.
If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
