Solved: Z2 G5 heatsink fan 4 pin to 5 pin - HP Support Community - 8317706
Product End-of-Life Disassembly Instructions Product Category: Workstation Marketing Name / Model [List multiple models if applicable.] HP Z2 Tower G5 Workstation Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP's Sustainability Contact. 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Item Description Notes Quantity of items included in product Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 3 Assemblies (PCA) Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button style 1 batteries Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.) Battery(ies) are attached to the product by (check all that apply with an "x" inside the "[ ]"): [ ] screws [X] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the sections 3.1 and 3.2. Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Liquid Crystal Displays (LCD) with a surface greater than Includes background illuminated displays with gas 100 sq cm discharge lamps Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater Chicony 700W EPA92 PSU 2 than 2.5 cm in diameter or height External electrical cables and cords Power Cord 1 Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) EL-MF877-00 Template Revision C Page 1 Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Item Description Notes Quantity of items included in product Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Hexagon Screw Driver T-15 Crisscross Screw Driver PH1 Electric Iron QUICK 310 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure: 1. Open access panel 2. Remove front bezel from chassis 3. Disconnect cable from Graphic card 4. Press the Graphic cards latch and unplug Graphic card 5. Press the ODD's latch on ODD cage 6. Disconnect ODD power cable and ODD SATA cable from ODD 7. Remove the ODD from ODD cage 8. Use T-15 screw driver to loose the screws of iron plate 9. Remove the iron plate of ODD 10. Loose the screws of HDD and remove HDD from HDD cage 11. Disconnect HDD power cable and HDD SATA cable from HDD 12. Remove the driver cage from Chassis 13. Disconnect all cables from MB 14. Disconnect system fan cable from MB 15. Use PH1 screwdriver to remove system fan from chassis 16. Remove system fan from chassis 17. Use T-15 screwdriver to loose the screws and remove cooler 18. Use PH1 screwdriver to loose the screws and remove the fan 19. Separate the fan from cooler 20. Remove memory from MB 21. Rotate the handle and open it up 22. Remove the CPU from the board 23. Remove the battery from the system board 24. Remove speaker from Chassis 25. Remove WLAN M.2 Card 26. Use T-15 screwdriver to loose the screws of MB from board EL-MF877-00 Template Revision C Page 2 Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 27. Remove MB from chassis 28. Use T-15 screwdriver remove the screws on the PSU Chassis 29. Disconnect the PSU cable from the MB 30. Remove the PSU from chassis 31. Use PH1 screwdriver to remove screw for the PSU 32. Remove cover 33. Use PH1 screwdriver to remove FG screw 34. Disconnect fan connector and inlet connector 35. Use PH1 screwdriver to remove AC inlet & Fan screw 36. Remove the PCB from the the PSU 37. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it 38. The electrolytic Capacitors had been removed. 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Step1 Open access panel Step2 Remove front bezel from chassis Step3 Disconnect cable from Graphic card Step4 Press the Graphic card s latch and unplug Graphic card Step 5 Press the ODD's latch on ODD cage Step 6 Disconnect ODD power cable and ODD SATA cable from ODD EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 3 Step7 Remove the ODD from ODD cage Step8 Use T-15 screw driver to loose the screws of iron plate EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 4 Step 9 Remove the iron plate of ODD Step 10 Loose the screws of HDD and remove HDD from HDD cage Step 11 Disconnect HDD power cable and HDD SATA cable from HDD Step 12 Remove the driver cage from Chassis EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 5 Step 13 Disconnect system fan cable from MB Step 14 Disconnect all cables from MB Step 15 Use PH1 screwdriver to remove system fan from chassis Step 16 Remove system fan from chassis EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 6 Step 17 Use T-15 screwdriver to loose the screws and remove Step 18 Use PH1 screwdriver to loose the screws and remove cooler the fan Step 19 Separate the fan from cooler Step 20 Remove memory from MB EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 7 Step 21 Rotate the handle and open it up Step 22 Remove the CPU from the board Step 23 Remove the battery from the system board Step 24 Remove speaker from Chassis EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 8 Step 25 Remove WLAN M.2 Card Step 26 Use T-15 screwdriver to loose the screws of MB from board Step 27 Remove MB from chassis Step 28 Use T-15 screwdriver remove the screws on the PSU Chassis EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 9 Step 29 Disconnect the PSU cable from the MB Step 30 Remove the PSU from chassis Step 31 Use PH1 screwdriver to remove screw for the PSU Step 32 Remove cover EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 10 Step 33 Use PH1 screwdriver to remove FG screw Step 34 Disconnect fan connector and inlet connector Step 35 Use PH1 screwdriver to remove AC inlet & Fan screw Step 36 Remove the PCB from the the PSU EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 11 Step 37 Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it Step 38 The electrolytic Capacitors had been removed. EL-MF877-00 Template Revision C Last revalidation date 09-May-2018 HPI instructions for this template are available at EL-MF877-01 Page 12HP Adobe PDF Library 20.12.75