Sèvè kalkil milti-nœd MSI CD270

Espesifikasyon

• Modèl: G52-S3862X1
• CPU: CD270-S3071-X2
• Drive Bays: 12 x Hot-Swap 2.5 U.2 Drive Bays (PCIe 5.0 x4, NVMe)
• Memory: Supports DDR5 DIMM slots compatible with RDIMMs, 3DS-RDIMM, and MRDIMMs

CD270-S3071-X2
Gid Demaraj Rapid Sistèm Sèvè a

Deskripsyon

1	COM USB Type-A Port	5	Sistèm Status ki ap dirije
2	USB 2.0 Kalite-A Port	6	UID LED Button (default)/ System Reset Button*
3	1000Base-T Ethernet Port (for mgmt.)	7	System Power LED Button
4	Mini-DisplayPort	8	OCP 3.0 Mezzanine Card Slot

* Bouton LED UID a kapab fonksyone tou kòm yon bouton réinitializasyon sistèm, konfigire avèk jumper J1_1 la.

Retire Plato Nœd Sistèm

Enpòtan

• Etenn nòd la an premye: Retire yon nòd ki limen ap lakòz yon pèt kouran imedyat.
• Pouvwa Endepandan: Chak nœd fonksyone ak pwòp ekipman pou pouvwa li. Lè w etenn yon nœd, sa pa afekte lòt yo.

Etap yo retire

1. Rale latch pous la sou kote pou libere ne a.
2. Kenbe manch lan pou glise ne a dousman soti nan fant li.

Sipòte pwa ne a pandan w ap retire li pou anpeche li tonbe aksidantèlman.

CPU

Yon sèl processeur Intel® Xeon® seri 6900P, TDP jiska 500W pou chak nœd.

CPU ak Enstalasyon Heatsink

memwa
Each node supports 12 DDR5 DIMM slots, compatible with RDIMMs, 3DS-RDIMM and MRDIMMs

Kalite DIMM	Max Frekans	Kapasite Maksimòm pou chak DIMM
RDIMM/ 3DS-RDIMM	6400 MT/s (1DPC)	256 GB
MRDIMM	8800 MT/s (1DPC)

Dyagram Konfigirasyon DIMM DDR5 Sèlman (pou Seri Intel® Xeon® 6900P)

⚠ Enpòtan

• Ta dwe gen omwen yon DIMM DDR5 pou chak priz.
• Konfigirasyon memwa DDR5 yo mande menm kalite DIMM, ran, vitès ak dansite.
• Li pa otorize pou melanje machann, RDIMM ki pa 3DS/3DS, RDIMM 9×4, oubyen DIMM x8/x4.
• Melanje DIMM ak diferan frekans fonksyònman pa valide. Lè frekans yo diferan, sistèm nan itilize vitès komen ki pi ba a pa defo.

Komisyon Konsèy Sistèm

Konektè, kavalye ak LED sou tablo

Non	Deskripsyon
Komisyon Konsèy Sistèm
JPICPWR_1~4	12V PICPWR power connectors (12-pin)
JPICPWR_5	12V PICPWR power connectors (6-pin)
JPWR1 ~ 2	4-pin power connectors
JMCIO1 ~ 9	Konektè MCIO 8i (PCIe 5.0 x8)
M2_1 ~ 2	Plas M.2 (Kle M, PCIe 5.0 x2, 2280/22110)
OCP0	OCP 3.0 mezzanine slot (PCIe 5.0 x16, NCSI supported)
DC-SCM	DC-SCM 2.0 edge slot
JCOOL2	4-Pin liquid leak detection header
JCOOL3	6-Pin liquid cooling header
JUSB3	Konektè USB 3.2 Gen 1 (5 Gbps, pou 2 pò USB)
JFP1~2	DC-MHS control panel header
JPDB_MGNT	PDB management header
JIPMB1	IPMB header (debug only)
JVROC1	VROC connector (debug only)
FBP_I2C_1~3	Tèt I2C
JCHASSIS1	Tèt entrizyon chasi
JPASSWORD_C_1	Password clear jumper (default pin 1-2, Normal)
JUART_SEL1	UART BMC/ CPLD select jumper (default pin 1-2, UART BMC to CPU)
JTAG_SEL2	JTAG select jumper (default pin 2-3, BMC to CPU)
JBAT1	MBP/ I3C select jumper (default pin 1-2, MBP)
JBAT2	RTC clear jumper (default pin 1-2, Normal)
JBAT7	PESTI flash select jumper (default pin 2-3, PESTI2 flash)
LED_H1, LED_L1	Port 80 debug LEDs
MGT1 DC-SCM Module
TPM	SPI TPM Header (for TPM20-IRS)
M2_1	M.2 Slot (M Key, for ROT1)
J_JTAG	Manual programming header (debug only)
J3D2	Force BMC update jumper (default pin 1, Normal)
J3C1	FRU jumper (default pin 2-3, FRU normal operated)
J3C5	JTAG Kavalye SW (pin 2-3 pa defo, J)TAG SW enable)
J1_1	ID/ Reset button select jumper (default pin 1-2, ID Button)
LED1	BMC batman kè ki ap dirije

Kesyon yo poze souvan

• K: Èske mwen ka melanje diferan kalite DIMM nan sistèm sa a?
  A: No, mixing vendors, non-3DS/3DS RDIMMs, 9×4 RDIMMs, or x8/x4 DIMMs is not allowed. It is recommended to use identical DIMMs for optimal performance.
• K: Ki kapasite memwa maksimòm ki sipòte pou chak DIMM DDR5?
  A: The maximum capacity supported per DDR5 DIMM is 256 GB.

Dokiman / Resous

Sèvè kalkil milti-nœd MSI CD270 [pdfGid Itilizatè X2, S386-S3071-v1.0-QG, G52-S3862X1, Sèvè Konpitasyon Plizyè Nœd CD270, CD270, Sèvè Konpitasyon Plizyè Nœd, Sèvè Konpitasyon, Sèvè

Referans

• Manyèl itilizatè