Ai-Thinker RA-01SC-P LoRa Series Module Owner's Manual

The Ra-01SC-P is an electrostatic sensitive device. Special
precautions are required when handling it. Avoid touching the
module with bare hands and use antistatic measures during
soldering.

Electrical Characteristics

FAQ

Q: What precautions should I take when handling the Ra-01SC-P
module?

A: The Ra-01SC-P is electrostatic sensitive, so always use
proper ESD handling procedures to prevent damage.

“`

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Ra-01SC-P Specification V1.0.0

Ra-01SC-P Specification

Page 1 of 21

Document resume

Ra-01SC-P Specification V1.0.0

Version

Date

V1.0.0 2024.09.24

Develop/revise content First Edition

Edition Pengfei Dong

Approve Ning Guan

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Ra-01SC-P Specification V1.0.0
Content
1. Product overview………………………………………………………………………………………………………. 4 1.1. Characteristic………………………………………………………………………………………………….. 5
2. Main parameters ……………………………………………………………………………………………………….. 6 2.1. Static electricity requirement ……………………………………………………………………………. 6 2.2. Electrical characteristics…………………………………………………………………………………… 7
3. Pin definition ……………………………………………………………………………………………………………. 8 4. Design guidance ……………………………………………………………………………………………………… 11
4.1. Application Guide Circuit ………………………………………………………………………………. 11 4.2. Recommended PCB package size ……………………………………………………………………. 13 4.3. Antenna Installation……………………………………………………………………………………….. 13 4.4. Power supply ………………………………………………………………………………………………… 13 4.5. GPIO level conversion …………………………………………………………………………………… 14 5. DAQ ……………………………………………………………………………………………………………………… 15 5.1. Factors affecting transmission distance…………………………………………………………….. 15 5.2. Module usage precautions ………………………………………………………………………………. 15 5.3. Factors that interfere with the module………………………………………………………………. 15 6. Storage conditions …………………………………………………………………………………………………… 16 7. Reflow soldering curve ……………………………………………………………………………………………. 16 8. Product packaging information ……………………………………………………………………………….. 17 9. Contact us …………………………………………………………………………………………………………….. 17 Disclaimer and Copyright Notice………………………………………………………………………………….. 20 Notice ……………………………………………………………………………………………………………………….. 20 Important statement…………………………………………………………………………………………………….. 21

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Ra-01SC-P Specification V1.0.0
1. Product overview
Ra-01SC-P is a LoRa series module designed and developed by Shenzhen Ai-Thinker Technology Co., Ltd. This module is used for ultra-long distance spread spectrum communication. Its RF chip LLCC68+ mainly uses LoRaTM long-range modem, which is used for ultra-long distance spread spectrum communication, has strong anti-interference ability, and can minimize current consumption. With the help of SEMTECH’s LoRaTM patented modulation technology, the module has built-in power amplifier (PA) and low noise amplifier (LNA) on this technology, with high sensitivity exceeding -137dBm, long transmission distance and high reliability. At the same time, compared with traditional modulation technology, LoRaTM modulation technology also has obvious advantages in anti-blocking and selection, solving the problem that traditional design solutions cannot take into account distance, anti-interference and power consumption at the same time.
It can be widely used in automatic meter reading, home building automation, security systems, remote irrigation systems, etc.

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Ra-01SC-P Specification V1.0.0
1.1. Characteristic
LoRa® modulation modes Support frequency band 410MHz~525MHz Maximum transmit power, operating current 700mA High sensitivity: as low as -137dBm@SF10 125KHz Extremely small size 17*16*3.2(±0.2)MM, double-row stamp hole patch package Support spread factor SF5/SF6/SF7/SF8/SF9/SF10/SF11 Low power consumption in receiving state, with a minimum receiving current of 11mA The module uses SPI interface, half-duplex communication, with CRC, and a data packet
engine of up to 256 bytes Support multiple antenna installation methods, compatible with half-hole
pads/through-hole pads/IPEX connector

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Ra-01SC-P Specification V1.0.0

2. Main parameters

Table 1 Description of the main parameters

Model Package
Size Antenna Frequency Operating temperature Storage temperature Power supply Interface Programmable bit rate

Ra-01SC-P SMD-16 17*16*3.2(±0.2)mm Compatible with half-hole pad/through-hole pad/IPEX connector 410MHz~525MHz -40~ 85 -40~ 125, < 90%RH Supply voltage 3.0~3.6V, typical value 3.3V, current1A SPI Up to 300kbps

2.1. Static electricity requirement
Ra-01SC-Pis an electrostatic sensitive device. Therefore, you need to take special precautions when carrying it.

Figure 2 ESD preventive measures
Notice: The Ra-01SC-P module is an electrostatic sensitive device (ESD) and requires special ESD precautions that should generally be applied to ESD sensitive groups. Proper ESD handling and packaging procedures must be used throughout the handling, transportation, and operation of any application incorporating the Ra-01SC-P module. Do not touch the module with your hands or use a non-antistatic soldering iron for soldering to avoid damaging the module.

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Ra-01SC-P Specification V1.0.0

2.2. Electrical characteristics
Table 2 Electrical characteristics table

Parameters Power supply voltage 3V3

Min.

Typical

Max.

Unit

value

3.0

3.3

3.6

IO Output High Level (VOH)

0.9*VDDIO

–

VDDIO

IO Output Low Level (VOL)

–

0.1*VDDIO

IO Input High Level (VIH)

0.7*VDDIO

–

VDDIO+0.3

IO Input Low Level (VIL)

-0.3

–

0.3*VDDIO

(RF_EN/CPS)IO Input High Level

1.2

–

3.6

(RF_EN/CPS)IO Input Low Level

–

0.3

Table 3 SPI interface characteristics

Symbol Description

Condition

Fsck SCK frequency

–

tch SCK high level time

–

tcl SCK low level time

–

trise

SCK rise time

–

tfall

SCK fall time

–

tsetup thold tnsetup

MOSI setup time MOSI hold time NSS setup time

From MOSI change to SCK rising edge
From SCK rising edge to MOSI change
From NSS falling edge to SCK rising edge

tnhold

NSS hold time

From SCK falling edge to NSS rising edge, normal
mode

Min. 50 50 30 20
30
100

Typical value
5 5 –
–
–
–

Max. 10 –
–
–

Unit MHz
ns ns ns ns ns ns
ns
ns

tnhigh

NSS high time of SPI access interval

–

T_DATA DATA hold and

–

250

–

setup time

Fsck SCK frequency

–

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Ra-01SC-P Specification V1.0.0

3. Pin definition
The Ra-01SC-P module has a total of 16 pins, as shown in the pin diagram. The pin function definition table is the interface definition.

No. 1 2 3 4
5
6 7 8 9 10
11
12 13 14 15 16 EPAD

Name ANT GND 3V3 RESET
CPS
DIO1 DIO2 DIO3 GND BUSY
RF_EN
SCK MISO MOSI NSS GND GND

Table 4 Pin function definition table
Function Connect antenna Ground Typical value 3.3V power supply Reset pin FEM chip TX pass-through enable pin, in transmit mode, this pin is low level R F and is directly output without PA amplification, and is internally pulled up by default
Digital IO1 software configuration
Digital IO2 software configuration
Digital IO3 software configuration Ground Status indication pin FEM chip enable pin, high level is effective, the module is pulled up by default; High level is in working state, low level is in sleep state
SPI clock input
SPI data output
SPI data input
SPI chip select input Ground Ground, reliable grounding is required to facilitate heat dissipation

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Ra-01SC-P Specification V1.0.0

The general IO pins of LLCC68+ are available in LoRaTM mode. Their mapping relationship depends on the configuration of the two registers RegDioMapping1 and RegDioMapping2.
Table 5 IO port function mapping table

Operation DIOx

Mode

Mapping

DIO3 CadDone

01 All

Valid Header

PayloadCrc 10
Error

–

DIO2
Fhss Change Channel
Fhss Change Channel
Fhss Change Channel
–

DIO1
RxRimeout Fhss
Change Channel CadDetected
–

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Ra-01SC-P Specification V1.0.0

4. Design guidance

4.1. Application Guide Circuit

1 Special pin description About CPS pin

CPS is the TX pass-through control pin of the built-in PA chip of the module, with an internal pull-up resistor of 10K (that is, R F is in PA amplification output mode in the default transmission mode). When the module is in transmission mode:
This pin is high level, and the module’s R F is amplified and output by PA;
When this pin is low level, the module’s R F is directly output without being amplified by PA;
The logic of this pin is invalid in the receiving state and needs to be set to a low level when low power consumption;
About RF_EN pin

RF_EN is the enable pin of the module’s built-in PA chip. When the pin is high, the module’s RF is in normal transceiver state; when the pin is low, the module’s RF function is turned off, which can reduce the module’s power consumption.
Table 6 RF switch truth table

Mode FEM power off FEM working

RF_EN 0 1

The module defaults to BOM, CPS and RF_EN have internal pull-up resistors of 10K (i.e., they are in normal amplification and transceiver state by default). If a low-power working scenario is required, please use an external MCU to control this pin to a low level state. When the level is low, the default pull-up resistor of this pin may have leakage current. If the built-in pull-up resistor is not required, please contact Anxin to modify the BOM.

In summary, the module has two BOM configurations.

Configuration 1. CPS and RF_EN have built-in pull-up resistors of 10K (default BOM configuration)

Configuration 2. CPS and RF_EN have built-in pull-up resistors without mounting, and require IO port control of the peripheral MCU

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2 Typical application circuit

Ra-01SC-P Specification V1.0.0

It is recommended that the IO port of the external MCU control the CPS and RF_EN of the module to achieve low-power application scenarios.
3 Other instruction The communication interface with the master MCU, in addition to the SPI interface, also
needs to connect BUSY/DIO1 to the IO port of the master MCU.
The antenna is soldered on the main control board. It is recommended to reserve a pie-shaped matching circuit at the antenna interface.

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4.2. Recommended PCB package size

Ra-01SC-P Specification V1.0.0

4.3. Antenna Installation
Ra-01SC-P requires an external antenna. There is a half-hole pad on the module that can be connected to the mainboard.
In order for the antenna to achieve the best effect, the antenna should be installed away from metal parts.
The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically upward. When the module is installed inside the casing, use a high-quality antenna extension cable to extend the antenna to the outside of the casing.
The antenna must not be installed inside the metal casing, which will greatly reduce the transmission distance.
4.4. Power supply
Recommend 3.3V voltage, peak current above 1A. If using DC-DC, it is recommended to control the ripple within 100mV. It is recommended to reserve a position for dynamic response capacitors in the DC-DC
power supply circuit, which can optimize the output ripple when the load changes greatly. It is recommended to add ESD devices to the 3.3V power supply interface. When designing the power supply circuit for the module, it is recommended to retain more
than 30% of the power supply current margin, which is conducive to long-term stable operation of the whole machine. Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection may cause permanent damage to the module.

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Ra-01SC-P Specification V1.0.0
4.5. GPIO level conversion
Some IO ports are connected to the module. If you need to use them, it is recommended to connect a 10-100 ohm resistor in series to the IO ports. This can suppress overshoot and make the levels on both sides more stable. It is helpful for EMI and ESD.
For the pull-up and pull-down of special IO ports, please refer to the instructions in the specification, which will affect the startup configuration of the module.
The IO port of the module is 3.3V. If the IO port levels of the main control and the module do not match, a level conversion circuit needs to be added.
If the IO port is directly connected to a peripheral interface, or terminals such as a pin header, it is recommended to reserve ESD devices near the terminals in the IO port routing.

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Ra-01SC-P Specification V1.0.0

5. FAQ

5.1. Factors affecting transmission distance
When there is a straight-line communication obstacle, the communication distance will be attenuated accordingly.
Temperature, humidity, and co-frequency interference will lead to an increase in the communication packet loss rate.
The ground absorbs and reflects radio waves, so the test effect is poor near the ground. Seawater has a strong ability to absorb radio waves, so the test effect is poor at the seaside. If there are metal objects near the antenna, or it is placed in a metal shell, the signal
attenuation will be very serious. The power register is set incorrectly, and the air rate is set too high (the higher the air rate,
the closer the distance). The power supply low voltage at room temperature is lower than the recommended value.
The lower the voltage, the lower the power. The antenna used is poorly matched with the module or the antenna itself has quality
problems.

5.2. Module usage precautions
Check the power supply to ensure that it is within the recommended power supply voltage. If it exceeds the maximum value, the module will be permanently damaged.
Check the stability of the power supply. The voltage cannot fluctuate frequentlyand significantly.
Ensure anti-static operation during installation and use, and high-frequency components are electrostatically sensitive.
Ensure that the humidity during installation and use is not too high. Some components are humidity-sensitive devices.
If there is no special requirement, it is not recommended to use it at too high or too low temperature.

5.3. Factors that interfere with the module
There is interference from the same frequency signal nearby, stay away from the interference source or change the frequency or channel to avoid interference.
The clock waveform on the SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line should not be too long.
Unsatisfactory power supply may also cause garbled code, so the reliability of the power supply must be ensured.
Poor or too long extension line or feeder line will also cause a high bit error rate.

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Ra-01SC-P Specification V1.0.0
6. Storage conditions
Products sealed in moisture-proof bags should be stored in a non-condensing atmosphere of <40/90%RH. The module’s moisture sensitivity level MSL is level 3. After the vacuum bag is unsealed, it must be used within 168 hours at 25±5/60%RH, otherwise it needs to be baked before it can be put online again.
7. Reflow soldering curve

Figure 12 Reflow soldering curve

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Ra-01SC-P Specification V1.0.0
8. Product packaging information
As shown in the figure below, the packaging of Ra-01SC-P is braided tape, 800pcs/reel. As shown in the figure below:

13 Packaging and taping diagram

9. Contact us

Ai-Thinker official website

Office forum

Develop DOCS

LinkedIn Technical

Tmall shop support

Taobao shop

Alibaba shop

emailsupport@aithinker.com

Domestic

business

cooperationsales@aithinker.com

Overseas business cooperationoverseas@aithinker.com

Company AddressRoom 403-405,408-410, Block C, Huafeng Smart Innovation Port, Gushu 2nd Road, Xixiang, Baoan District, Shenzhen.

Tel+86-0755-29162996

WeChat mini program

WeChat official account

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Ra-01SC-P Specification V1.0.0
Disclaimer and Copyright Notice
The information in this document, including the URL address for reference, is subject to change without notice. The document is provided “as is” without any warranty, including any warranty of merchantability, fitness for a particular purpose or non-infringement, and any warranty mentioned elsewhere in any proposal, specification or sample. This document does not assume any liability, including liability for infringement of any patent rights arising from the use of the information in this document. This document does not grant any intellectual property rights license, whether express or implied, by estoppel or otherwise. The test data obtained in this article are all obtained by Ai-Thinker Laboratory, and the actual results may vary slightly. All trade names, trademarks and registered trademarks mentioned in this article are the property of their respective owners and are hereby declared. The final right of interpretation belongs to Shenzhen Ai-Thinker Technology Co., Ltd.
Notice
The contents of this manual may be changed due to product version upgrades or other reasons. Shenzhen Ai-Thinker Technology Co., Ltd. reserves the right to modify the contents of this manual without any notice or reminder. This manual is only used as a guide. Shenzhen Ai-Thinker Technology Co., Ltd. tries its best to provide accurate information in this manual, but Shenzhen Ai-Thinker Technology Co., Ltd. does not ensure that the contents of the manual are completely error-free, and all statements, information and suggestions in this manual do not constitute any express or implied warranty.

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Ra-01SC-P Specification V1.0.0
Important statement
Ai-Thinker may provide technical and reliability data “as is” (including data sheets), design resources (including design for reference purposes), application or other design recommendations, network tools, security information and other resources (the “these resources”) and without warranty without express or implied warranty, including without limitation, adaptability for a particular purpose or infringement of intellectual property rights of any third party. And specifically declares that it is not liable for any inevitable or incidental losses arising from the application or the use of any company products and circuits.
Ai-Thinker reserves the right to the information released in this document (including but not limited to the indicators and product description) and any changes to the Company without notice to automatically replace and replace all the information provided in the previous version of the same document number document.
These resources are available to skilled developers who design Essence products. You will assume all responsibilities for the following: (1) select the appropriate optional products for your application; (2) design, verify, and run your application and products during the full life cycle; and (3) ensure that your application meets all corresponding standards, norms and laws, and any other functional.
Ai-Thinker authorizes you to use these resources only for the application of the Ai-Thinker products described in this resource. Without the permission of Ai-Thinker, no unit or individual shall copy or copy part or all of these resources without authorization, and shall not spread them in any form. You are not entitled to use any other Principal or any third party intellectual property. You shall fully indemnify you for any claims, damages, costs, losses and debts incurred by the result of the use of these resources.
The products available by Ai-Thinker are subject to the terms of sales or other applicable terms attached to the products. Ai-Thinker may provide these resources does not extend or otherwise change the applicable warranty or warranty disclaimer for the product release.

Page 21 of 21

FCC WARNING FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user. (b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual: Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: –Reorient or relocate the receiving antenna. –Increase the separation between the equipment and receiver. –Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. –Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncon- trolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labelled in a visible area with the following: “Contains Transmitter Module “FCC ID: 2ATPO-RA01SCP”

Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power,spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See alsoSection 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C (15.231).it specifically establish AC Power Line Conducted Emission, Radiated Emission Dwell Time, Occupied Bandwidth
2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-topoint antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturer’s instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.4 Single Modular
If a modular transmitter is approved as a “Single Modular,” then the module manufacturer is responsible for approving the host environment that the Single Modular is used with. The manufacturer of a Single Modular must describe, both in the filing and in the installation instructions, the alternative means that the Single Modular manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A Single Modular manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited

module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This Single Modular procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a single module. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements.
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna); b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered); c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout; d) Appropriate parts by manufacturer and specifications; e) Test procedures for design verification; and f) Production test procedures for ensuring compliance
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a person’s body); and (2) additional text needed

for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application).
Explanation: The module complies with FCC radiofrequency radiation exposure limits for uncontrolled environments. The device is installed and operated with a distance of more than 20 cm between the radiator and your body.” This module follows FCC statement design, FCC ID: 2ATPO-RA01SCP 2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional antenna” is not considered to be a specific “antenna type”). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product.

The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The product antenna uses an irreplaceable antenna with a gain of 1dBi 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating “Contains FCC ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: “Contains FCC ID: 2ATPO-RA01SCP 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturer’s determination that a module as installed in a host complies with FCC requirements. Explanation: Shenzhen Ai-Thinker Technology Co., Ltd can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product

as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.

Documents / Resources

Ai-Thinker RA-01SC-P LoRa Series Module [pdf] Owner's Manual
RA01SCP, 2ATPO-RA01SCP, 2ATPORA01SCP, RA-01SC-P LoRa Series Module, RA-01SC-P, LoRa Series Module, Module

References

User Manual

Ai-Thinker RA-01SC-P LoRa Series Module Owner’s Manual

RA-01SC-P LoRa Series Module

Specifications

Product Overview

Main Parameters

Product Usage Instructions

Static Electricity Requirement

Electrical Characteristics

FAQ

Q: What precautions should I take when handling the Ra-01SC-P
module?

Documents / Resources

References

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